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High-frequency PCBs, such as those utilizing materials like TP1020, demand a set of specialized manufacturing processes to ensure optimal performance in applications operating at 10GHz and beyond. Unlike standard FR-4 based PCBs, these high-performance substrates require meticulous control over every production stage to maintain electrical integrity, dimensional stability, and material properties.   Material Handling & Preparation The unique composition of high-frequency materials like TP1020—ceramic-filled polyphenylene oxide (PPO) resin without fiberglass reinforcement—necessitates specialized handling protocols. Prior to lamination, the raw material must be stored in a controlled environment with humidity levels below 30% and temperature maintained at 23±2°C. This prevents moisture absorption (critical given TP1020's 0.01% maximum absorption rate) which can cause dielectric constant variations exceeding ±0.2 at 10GHz.   Cutting and trimming operations require diamond-tipped tools rather than standard carbide blades. The absence of fiberglass reinforcement in TP1020 makes the material prone to chipping if subjected to excessive mechanical stress, potentially creating micro-fissures that degrade signal integrity. Laser cutting, while more expensive, is preferred for achieving the ±0.15mm dimensional tolerances required for 31mm x 31mm boards used in miniaturized antennas.   Lamination & Core Processing High-frequency laminates demand precise lamination parameters to maintain dielectric consistency. For TP1020, the lamination process operates at 190±5°C with a pressure of 200±10 psi, significantly lower than the 300+ psi used for fiberglass-reinforced materials. This lower pressure prevents ceramic particle displacement within the PPO matrix, ensuring the targeted dielectric constant of 10.2 is maintained across the entire board surface.   The 4.0mm core thickness of TP1020 PCBs requires extended dwell times during lamination—typically 90 minutes compared to 45 minutes for standard substrates. This controlled heating cycle ensures complete resin flow without creating internal voids, which would act as signal reflection points at high frequencies. Post-lamination cooling must proceed at a rate of 2°C per minute to minimize thermal stress, critical for managing TP1020's CTE of 40ppm/°C (X/Y-axis). Drilling & Plating Techniques Drilling high-frequency PCBs presents unique challenges due to the abrasive nature of ceramic fillers in materials like TP1020. Standard twist drills wear prematurely, leading to hole wall roughness exceeding 5μm—unacceptable for high-frequency signal paths. Instead, diamond-coated drill bits with a 130° point angle are required to achieve the 0.6mm minimum hole size with wall roughness

In the complex structure of a Printed Circuit Board (PCB), pads, which may seem like inconspicuous metal dots or polygons, play a crucial role in sustaining the life of the circuit. As the "bridge" between the PCB and electronic components, the design and performance of pads directly determine the stability, reliability, and service life of the entire electronic device, and their importance far exceeds what meets the eye.   From the perspective of connection function, pads are the core carriers for achieving electrical conduction. When components are fixed on the PCB through welding processes, pads form conductive paths with component pins via molten solder, transmitting current and signals from one component to another, and ultimately forming a complete circuit system. Whether it is simple resistors and capacitors or complex integrated circuits, they must rely on pads to establish electrical connections with the PCB. Once pads are detached, oxidized, or have design defects, it will lead to faults such as open circuits and short circuits, directly causing circuit functional failure.   In terms of mechanical support, pads also play an irreplaceable role. During the welding process, after the solder solidifies, it will firmly fix the components on the PCB surface. Pads, through close combination with the solder, provide stable mechanical support for the components, preventing them from displacement or falling off under the influence of environmental factors such as vibration, impact, or temperature changes. Especially for larger and heavier components (such as transformers, connectors, etc.), the size, shape, and distribution design of pads directly affect the installation firmness of the components, which in turn relates to the mechanical resistance performance of the device.   The rationality of pad design has a profound impact on circuit performance. In high-frequency circuits, the size, shape, and spacing of pads will affect impedance matching and signal integrity. Excessively large pads may lead to an increase in parasitic capacitance, while excessively small ones may cause impedance mutations, resulting in signal reflection, attenuation, or crosstalk. In power circuits, pads need to have sufficient current-carrying capacity. If the area is insufficient, it will lead to excessive current density, causing local overheating and even burning the circuit. In addition, the connection method between pads and wires (such as whether to adopt a teardrop design) will also affect the fatigue resistance of the PCB, reducing the risk of wire breakage caused by thermal expansion and contraction.   From the perspective of manufacturing, the design of pads is directly related to the feasibility and efficiency of the welding process.   Standardized pad sizes and spacings can adapt to automated welding equipment (such as placement machines, wave soldering furnaces), reducing the rate of welding defects. A reasonable pad layout can avoid problems such as solder bridging and cold soldering, reducing the cost of manual repair. At the same time, the plating quality of pads (such as gold plating, tin plating) will affect the wettability and reliability of welding, which in turn determines the qualification rate and service life of the product.   To sum up, pads are the core hub connecting electricity and machinery in the PCB. Their importance is reflected in multiple dimensions such as maintaining circuit conduction, ensuring structural stability, optimizing circuit performance, and improving production reliability. With the development trend of electronic devices towards miniaturization, high frequency, and high reliability, the design and manufacturing process of pads will become one of the key factors determining product competitiveness, always playing the important role of "small components, great functions".

AI glasses are rapidly driving new demand in the wearable market. Major international companies like Meta and Apple are accelerating their product launches, and several startups in China are also entering the fray. The supply chain for AI glasses, including sensing and lens modules, is generating new momentum and benefiting HDI, flexible circuit board, rigid-flex board, and substrate manufacturers, making AI glasses a focal point in the wearable device sector.   Huatong currently focuses on mid to high-end HDI boards for AI glasses applications and is simultaneously developing flexible and rigid-flex boards, creating a complete product lineup. Although current shipments have not significantly contributed to revenue, growth is evident, and the company has entered stable mass production. Clients include several international brands like Meta, and many startups in China are actively developing AI glasses. The lightweight and compact nature of AI glasses increases the demand for high-end printed circuit boards, which is advantageous for the company to expand its share of high-end applications.   Zhen Ding is one of the earliest PCB manufacturers to enter the smart glasses field, now offering a complete product line that includes flexible boards, SiP modules, and rigid boards. Zhen Ding reports that its global market share for printed circuit boards used in smart glasses has reached 30-50%. Although this year's shipments have not peaked, the scale has grown several times compared to last year. With high technical barriers and premium pricing, the gross margin for this business is already above the company’s overall average and is expected to continue improving profitability.   Taiwan's Jeng Yi has been actively entering the wearable device market in recent years, and its new generation of products for AI glasses has completed mass production introduction, with initial results gradually emerging. The company estimates that shipments will grow significantly in 2026, further boosting operational momentum.   In upstream materials, PI manufacturer Damao is targeting Meta glasses with transparent PI. Damao provides films, while its subsidiary Bo Mi Lan specializes in fine circuits, enabling smart glasses to achieve eye-tracking functionality. The company plans to continue its strategic positioning in the AI glasses market.   ------------------------------------ Source: Money DJ Disclaimer: We respect originality and focus on sharing. The text and images are copyrighted by the original authors. The purpose of reprinting is to share more information and does not represent our position. If your rights are infringed, please contact us promptly, and we will delete it immediately. Thank you.

According to CCTV News, on July 31 local time, U.S. President Trump signed an executive order, setting "reciprocal tariff" rates on imports from multiple countries and regions, with specific rates ranging from 10% to 41%. This tariff list officially took effect at 00:00 on August 7. President Trump's latest tariff plan will impose tariffs higher than 10% on imported goods from approximately 40 countries.   Regarding the impact of the U.S. imposing reciprocal tariffs on electronic products, Li Dingzhuan, Chief Operating Officer of Zhen Ding, stated in an interview on August 12 before hosting an online earnings conference that tariffs have brought challenges to the global supply chain, especially the printed circuit board (PCB) industry, which mainly targets the U.S. market, facing greater uncertainty. However, according to the company's research, despite the pressure from tariff measures, the PCB industry still shows strong resilience and continues to drive growth momentum through technological innovation and diversified market layout.   Li Dingzhuan said that currently, the U.S. market accounts for about 35% of most electronic products, and the remaining 65% are distributed in other international markets, which enables the industry to partially diversify tariff risks. He emphasized that after the Trump administration announced the reciprocal tariff rates for various countries in August, there has been no significant impact on major customers' orders and overall production capacity, and market demand remains stable.   It is worth noting that emerging applications such as AI phones, smart glasses, and humanoid robots have become important drivers of PCB demand. These innovative products not only put forward higher requirements for PCB technical specifications but also continue to double the related output value. The industry generally believes that these emerging fields can make up for potential fluctuations caused by tariffs in the traditional consumer electronics market.   Shen Qingfang, Chairman of Zhen Ding, said that the integration and technological upgrading of the PCB industry chain are the keys to coping with tariff challenges. From material selection, process optimization to the introduction of intelligent manufacturing, all help to improve production efficiency and product added value, thereby consolidating international competitiveness.   Looking to the future, Shen Qingfang emphasized that although there are still variables in the global trade environment, the industry's confidence remains stable. Industry players will continue to focus on high-end technologies and diversified application fields, strengthen international cooperation, and actively expand non-U.S. markets to inject more growth momentum into overall operations.   According to previous announcements, Zhen Ding's cumulative consolidated revenue in the first seven months reached 91.638 billion New Taiwan dollars, a year-on-year increase of 16.91%, setting a new record for the same period in previous years. Zhen Ding explained that exchange rate fluctuations led to a slight year-on-year decrease in revenue denominated in New Taiwan dollars, but driven by customers' stockpiling demand, revenue in July showed a double-digit year-on-year increase in U.S. dollars. Among them, IC substrate revenue continued to grow, and the stockpiling period for new mobile communication and consumer electronics products has begun, with the overall performance still in line with expectations.   Observing the product structure, Zhen Ding's IC substrate revenue share is expected to increase from 3.3% last year to 5.2% this year, and further expand to a high single-digit level next year. The ABF substrates, which have been cultivated for many years, have seen a stable increase in the utilization rate of the Shenzhen factory, and the new Kaohsiung factory is also scheduled to start operation in 2026, which will help optimize supply momentum and customer portfolio simultaneously. In addition, the demand for AI servers and emerging applications continues to increase, and the revenue contribution of related businesses is expected to rise to 7% - 8%, becoming one of the core growth drivers in the next two years.   Although Zhen Ding's cumulative revenue has increased by more than 10% year-on-year, profits are still challenged by exchange rate and raw material cost fluctuations. It is estimated that every 1% change in the exchange rate will affect the gross profit margin by approximately 0.2 - 0.3 percentage points. However, with the start of the peak season for mobile phones, the increase in the proportion of high-end products, and the production capacity distributed in mainland China, Taiwan China, Thailand, etc., which have flexibility in responding to exchange rate and geopolitical risks, the gross profit margin is expected to rise to 20% in the third quarter, and the profit structure in the second half of the year is expected to improve significantly.   Looking ahead, institutional investors predict that Zhen Ding will continue the momentum of the consumer electronics peak season and benefit from the growth in ASP of high-end products driven by the rising penetration rate of AI applications. The annual revenue is expected to exceed 180 billion New Taiwan dollars, a year-on-year increase of nearly 10%. With the continuous advancement of substrate market share and the upgrading of revenue structure driven by capacity expansion, the upward trend will continue next year.     -----------------------------------   Source: United Daily News, Commercial Times Statement: We respect originality and also pay attention to sharing; the copyright of words and pictures belongs to the original author. The purpose of reprinting is to share more information, and does not represent the position of this account. If your rights are infringed, please contact us in time, and we will delete it as soon as possible. Thank you.

On August 8, Bloomberg reported, citing informed sources, that Tesla Inc. will disband its Dojo supercomputer team, and the team leader will leave the company. This move may disrupt Tesla's plan to develop self-designed chips for autonomous driving technology.   Informed sources stated that Peter Bannon, who is in charge of the Dojo project, will resign. Tesla CEO Elon Musk has ordered the closure of the project. Recently, about 20 members of the Dojo team have moved to the newly established DensityAI, while the remaining Dojo employees have been reassigned to other data center and computing projects within Tesla.   Tesla plans to increase its reliance on external technology partners, including adopting computing technologies from NVIDIA and AMD, as well as chip manufacturing services from Samsung Electronics.   This decision marks a major shift in Tesla's project that has been under development for years. Dojo was once regarded as the core of Tesla's multi-billion-dollar plan, which aimed to enhance Tesla's computing power in the AI competition.   Dojo is a supercomputer independently designed by Tesla, used to train the machine learning models behind the company's Autopilot, Full Self-Driving systems, and its humanoid robot Optimus. The computer can receive data collected by vehicles and process it quickly to improve the company's algorithm performance. Analysts have pointed out that Dojo could become a significant competitive advantage for Tesla. Morgan Stanley predicted in 2023 that it might increase Tesla's market value by $500 billion.   However, Musk has hinted at a strategic shift during Tesla's recent quarterly earnings call. He said at the time that Tesla's future self-developed technologies might converge with those of its partners. He stated in the July 23 call: "Intuitively, for Dojo 3 and the AI6 inference chip, we want to converge them into essentially the same chip."   Musk also admitted last year that the company might not push forward with the Dojo project and would instead rely more on external partners.     --------------------------------   Source: Jiangnan Metropolis Daily, integrated with Cailianshe and Phoenix Tech Statement: We respect originality and also value sharing; the copyright of texts and images belongs to the original authors. The purpose of reprinting is to share more information and does not represent the position of this account. If your rights are infringed, please contact us promptly, and we will delete the relevant content as soon as possible. Thank you.

Introduction The F4BTMS series is an upgraded version of the F4BTM series. The material now incorporates a large amount of ceramics and utilizes ultra-thin and ultra-fine fiberglass cloth reinforcement. These enhancements have greatly improved the material's performance, resulting in a wider range of dielectric constants.   The incorporation of ultra-thin, ultra-fine fiberglass cloth reinforcement, along with a precise blend of special nanoceramics and polytetrafluoroethylene resin, minimizes electromagnetic wave interference, reducing dielectric loss and enhancing dimensional stability.   F4BTMS exhibits reduced anisotropy in the X/Y/Z directions, enabling higher frequency usage, increased electrical strength, and improved thermal conductivity.   Features F4BTMS material offers a wide range of dielectric constants, providing flexible options from 2.2 to 10.2, while maintaining a stable value throughout.   Its dielectric loss is extremely low, ranging from 0.0009 to 0.0024, minimizing energy dissipation and improving overall system efficiency.   F4BTMS exhibits excellent temperature coefficient of dielectric constant. The TCDK with a DK value ranging from 2.55 to 10.2, remains within 100 ppm/℃.   The CTE values in the X and Y directions are between 10-50 ppm/°C , while in the Z direction, it is as low as 20-80 ppm/°C. This low thermal expansion ensures exceptional dimensional stability, enabling reliable hole copper connections.   F4BTMS demonstrates remarkable resistance to radiation, retaining stable dielectric and physical properties even after exposure to irradiation; and low outgassing performance, meeting the vacuum outgassing requirements for aerospace applications.   PCB capability We offer a wide range of PCB manufacturing capabilities, allowing you to choose the best options for your needs.   We can accommodate various layer counts, including Single Sided, Double Sided, Multilayer, and Hybrid PCBs.   You can select from different copper weights, such as 1oz (35µm) and 2oz (70µm).   We offer a diverse selection of dielectric thicknesses, ranging from 0.09mm (3.5mil) to 6.35mm (250mil).   Our manufacturing capabilities support PCB sizes up to 400mm X 500mm, catering to designs of different scales.   Various solder mask colors are available, such as Green, Black, Blue, Yellow, Red, and more.   Moreover, we provide diverse surface finish options, including Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold and ENEPIG etc.   PCB Material: PTFE,Ultra-thin and ultra-fine fiberglass, ceramics. Designation (F4BTMS ) F4BTMS DK (10GHz) DF (10 GHz) F4BTMS220 2.2±0.02 0.0009 F4BTMS233 2.33±0.03 0.0010 F4BTMS255 2.55±0.04 0.0012 F4BTMS265 2.65±0.04 0.0012 F4BTMS294 2.94±0.04 0.0012 F4BTMS300 3.0±0.04 0.0013 F4BTMS350 3.5±0.05 0.0016 F4BTMS430 4.3±0.09 0.0015 F4BTMS450 4.5±0.09 0.0015 F4BTMS615 6.15±0.12 0.0020 F4BTMS1000 10.2±0.2 0.0020 Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) Dielectric thickness 0.09mm (3.5mil), 0.127mm (5mil), 0.254mm(10mil),0.508mm(20mil), 0.635mm(25mil), 0.762mm(30mil), 0.787mm(31mil), 1.016mm(40mil), 1.27mm(50mil), 1.5mm(59mil), 1.524mm(60mil), 1.575mm(62mil), 2.03mm(80mil), 2.54mm(100mil), 3.175mm(125mil), 4.6mm(160mil), 5.08mm(200mil), 6.35mm(250mil) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..   Applications F4BTMS PCBs have extensive applications across various domains, including Aerospace and aviation equipment, Microwave and RF applications, Radar systems, Signal distribution feed networks, Phase-sensitive antennas and phased array antennas etc.

Introduction Wangling’s TP material is a unique high-frequency thermoplastic material in the industry. The dielectric layer of TP-type laminates consists of ceramics and polyphenylene Oxide resin (PPO), without fiberglass reinforcement. The dielectric constant can be precisely adjusted by adjusting the ratio between ceramics and PPO resin. The production process is special, and it has excellent dielectric performance and high reliability. Features The dielectric constant can be arbitrarily selected within the range of 3 to 25 according to circuit requirements, and it is stable. Common dielectric constants include 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 10.2, 11, 16, and 20. The material demonstrates low dielectric loss, with a slight increase at higher frequencies. However, this increase is not significant within the 10 GHz range. For long-term operation, the material can withstand temperatures ranging from -100°C to +150°C, showcasing excellent low-temperature resistance. It's important to note that temperatures exceeding 180°C may result in deformation, copper foil peeling, and significant changes in electrical performance. The material exhibits radiation resistance and displays low outgassing properties. Furthermore, the adhesion between the copper foil and dielectric is more reliable compared to ceramic substrates with vacuum coating. PCB Capability Let’s see our PCB Capability on TP materials. Layer count: We offer single-sided and double-sided PCBs based on the characteristics of the material. Copper weight: We provide options of 1oz (35µm) and 2oz (70µm), catering to different conductivity requirements. Wide range of dielectric thicknesses are available, such as 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 7.0mm, 8.0mm, 10.0mm, and 12.0mm, allowing flexibility in design specifications. Due to laminate size constraints, the maximum PCB we can provide is 150mm X 220mm. Solder mask: We offer various solder mask colors, including green, black, blue, yellow, red, and more, enabling customization and visual distinction. Our surface finish options include bare copper, HASL, ENIG, immersion silver, immersion tin, OSP, pure gold, ENEPIG, and more, ensuring compatibility with your specific requirements. PCB Material: Polyphenylene, ceramic Designation (TP Series) Designation DK DF TP300 3.0±0.06 0.0010 TP440 4.4±0.09 0.0010 TP600 6.0±0.12 0.0010 TP615 6.15±0.12 0.0010 TP920 9.2±0.18 0.0010 TP960 9.6±0.2 0.0011 TP1020 10.2±0.2 0.0011 TP1100 11.0±0.22 0.0011 TP1600 16.0±0.32 0.0015 TP2000 20.0±0.4 0.0020 TP2200 22.0±0.44 0.0022 TP2500 25.0±0.5 0.0025 Layer count: Single Sided, Double Sided PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness (or overall thickness) 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 7.0mm, 8.0mm, 10.0mm, 12.0mm PCB size: ≤150mm X 220mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. Applications Displayed on the screen is a TP high-frequency PCB with a thickness of 1.5mm, featuring OSP coating. TP high-frequency PCBs are also utilized in applications such as Beidou, missile-borne systems, fuzes, and miniaturized antennas etc.

Introduction Wangling’s TF laminates are a composite of microwave and temperature-resistant polytetrafluoroethylene (PTFE) resin material and ceramics. These laminates are free from fiberglass cloth and the dielectric constant is precisely adjusted by adjusting the ratio between ceramics and PTFE resin. With the application of special production processes, they demonstrate outstanding dielectric performance and offer a high level of reliability. Features TF laminates exhibit a stable and wide range of dielectric constant, which ranges from 3 to 16, with common values including 3.0, 6.0, 9.2, 9.6, 10.2, and 16. TF laminates feature exceptionally low dissipation factor, with loss tangent values of 0.0010 for DK ranging from 3.0 to 9.5 at 10GHz, 0.0012 for DK from 9.6 to 11.0 at 10GHz, and 0.0014 for DK spanning 11.1 to 16.0 at 5GHz. With a long-term working temperature surpassing TP materials, they can operate within a wide range of -80°C to +200°C The laminates come in thickness options ranging from 0.635mm to 2.5mm, catering to various design requirements. They boast resistance to radiation and exhibit low outgassing properties. PCB Capability We provide a comprehensive range of PCB manufacturing capabilities to fulfill your specific requirements. At first, we can accommodate both Single Sided and Double Sided PCBs. Then you have the option to select from different copper weights, such as 1oz (35µm) and 2oz (70µm), to meet your conductivity needs. A diverse selection of dielectric thicknesses are available in our house, ranging from 0.635mm to 2.5mm. Our manufacturing capabilities support PCB sizes up to 240mm X 240mm and various solder mask colours like Green, Black, Blue, Yellow, Red, and more. Additionally, we offer various surface finish options, including Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, and ENEPIG etc. PCB Material: Polyphenylene, ceramic Designation (TF Series) Designation DK DF TF300 3.0±0.06 0.0010 TF440 4.4±0.09 0.0010 TF600 6.0±0.12 0.0010 TF615 6.15±0.12 0.0010 TF920 9.2±0.18 0.0010 TF960 9.6±0.19 0.0012 TF1020 10.2±0.2 0.0012 TF1600 16.0±0.4 0.0014 Layer count: Single Sided, Double Sided PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness (Dielectric thickness or overall thickness) 0.635mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 2.5mm PCB size: ≤240mm X 240mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. Applications TF high-frequency PCBs are utilized in applications of microwave and millimeter-wave domains, such as millimeter-wave radar sensors, antennas, transceivers, modulators, multiplexers, as well as power supply equipment and automatic control equipment.

Introduction Wangling’s F4BTM series laminates are fiberglass cloth, nano-ceramic fillers, and PTFE resin, followed by strict pressing processes. They are based on the F4BM dielectric layer, with the addition of high dielectric and low loss nano-level ceramics, resulting in higher dielectric constant, improved heat resistance, lower thermal expansion coefficient, higher insulation resistance, and better thermal conductivity, while maintaining low loss characteristics.   F4BTM and F4BTME share the same dielectric layer but use different copper foils: F4BTM is paired with ED copper foil, while F4BTME is paired with reverse-treated (RTF) copper foil, offering excellent PIM performance, more precise line control, and lower conductor loss.   Features F4BTM offers a wide range of features. With a DK range from 2.98 to 3.5, it provides flexibility in design. The addition of ceramics further enhances its performance, making it suitable for demanding applications. This material is available in various thicknesses and sizes, catering to different project requirements while offering cost savings. Its commercialization and suitability for large-scale production make it a highly cost-effective choice. Additionally, F4BTM exhibits radiation-resistant and low out-gassing properties, ensuring its reliability even in challenging environments.   PCB Capability Our PCB manufacturing capabilities cover a wide range of options. We can handle various layer counts, including single-sided, double-sided, multilayer, and hybrid PCBs.   For copper weight, we offer options of 1oz (35µm), and 2oz (70µm), allowing flexibility in conductivity requirements.   When it comes to dielectric thickness (or overall thickness), we provide a comprehensive selection of options ranging from 0.25mm to 12.0mm, catering to different design specifications.   The maximum PCB size we can accommodate is 400mm X 500mm, ensuring sufficient space for your project.   We offer a variety of solder mask colors, including green, black, blue, yellow, red, and more, allowing for customization and visual distinction.   Regarding surface finish, we support several options such as bare copper, HASL, ENIG, immersion silver, immersion tin, OSP, pure gold, ENEPIG, and more, ensuring compatibility with your specific requirements.   PCB Material: PTFE / glass fiber cloth / Nano-ceramic filler Designation (F4BTM ) F4BTM DK (10GHz) DF (10 GHz) F4BTM298 2.98±0.06 0.0018 F4BTM300 3.0±0.06 0.0018 F4BTM320 3.2±0.06 0.0020 F4BTM350 3.5±0.07 0.0025 Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness (or overall thickness) 0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..   Applications The screen displays a DK 3.0 F4BTM PCB, constructed on a 1.524mm substrate and featuring HASL surface finishes.   F4BTM PCBs are utilized in various applications, including Antenna, Mobile Internet, Sensor Network, Radar, Millimeter Wave Radar, Aerospace, Satellite Navigation, and Power Amplifier etc.

Brief introduction RO3203 high frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials have been specifically engineered to provide exceptional electrical performance and mechanical stability while remaining cost-effective. As an extension of the RO3000 series, RO3203 materials stand out with their enhanced mechanical stability.   With a dielectric constant of 3.02 and a dissipation factor of 0.0016, RO3203 materials enable an extended useful frequency range beyond 40 GHz.   Features RO3203 has a thermal conductivity of 0.48 W/mK, indicating its ability to conduct heat.   The volume resistivity is 107 MΩ.cm and surface resistivity of the material is also 107 MΩ.   RO3203 exhibits a dimensional stability of 0.8 mm/m in the X and Y directions and it has a moisture absorption rate of less than 0.1%, indicating its ability to resist absorbing moisture when exposed to specific conditions.   The material has different coefficients of thermal expansion in three directions. The Z-direction coefficient is 58 ppm/℃, while the X and Y-direction coefficients are both 13 ppm/℃.   RO3203 has a Thermal Decomposition Temperature (Td) of 500℃ and a density of 2.1 gm/cm3 at 23℃.   After soldering, the material exhibits a copper peel strength of 10.2 lbs/in and a flammability rating of V-0 according to the UL 94 standard, while also being compatible with lead-free processes.   Property RO3203 Direction Units Condition Test Method Dielectric Constant,εProcess 3.02±0.04 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5 Dielectric Constant,εDesign 3.02 Z - 8 GHz - 40 GHz Differential Phase Length Method Dissipation Factor, tan d 0.0016 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5 Thermal Conductivity 0.48   W/mK Float 100℃ ASTM C518 Volume Resistivity 107   MΩ.cm A ASTM D257 Surface Resistivity 107   MΩ A ASTM D257 Dimensional Stability 0.8 X, Y mm/m COND A IPC-TM-650 2.4.3.9 Moisure Absorption