quality RF PCB Board & Rogers PCB Board factory

Driven by the wave of AI development, the PCB (Printed Circuit Board), known as the "nerve center" of electronic devices, is experiencing a significant increase in market demand, and the industry is entering a new peak expansion period. Leading Companies Actively Expanding Capacity Pengding Holdings, with its diversified PCB product lines widely used in communications electronics, consumer electronics, high-performance computing products, EVs, and AI servers, stated in an institutional survey on October 31 that since 2025, with the booming development of emerging industries like artificial intelligence, market requirements for PCB performance and precision have increased, also bringing vast market opportunities. Against this backdrop, the company is steadily advancing the in-depth development of various business segments while intensifying market expansion and steadily promoting the certification and production of new products. In the first three quarters of 2025, the company achieved revenue of 26.855 billion yuan, a year-on-year increase of 14.34%, and net profit attributable to shareholders of 2.407 billion yuan, up 21.23% year-on-year. Regarding capacity layout, Pengding Holdings stated it is actively promoting the construction of new production capacity in Huaian, Thailand, and other locations. During the reporting period, the company's capital expenditure reached 4.972 billion yuan, an increase of nearly 3 billion yuan compared to the same period last year. With the explosion in AI computing power, the company has entered a new peak expansion period. In the coming years, as new capacity is gradually released, the computing power field will become an important pillar for the company's development. Similarly, since October, two PCB material companies, Defu Technology and Philip Rock, have disclosed financing and expansion plans. For example, Defu Technology plans to invest an additional 1 billion yuan to build R&D and production workshops for special copper foils like carrier copper foil, buried resistance copper foil, and high-frequency high-speed copper foil, along with supporting equipment facilities. Previously, Han's CNC announced adjustments to some of its raised fund investment projects, increasing the planned capacity of the "PCB Special Equipment Production Expansion and Upgrade Project" from 2,120 units annually to 3,780 units. Industry-Wide Expansion Wave Arrives Shenghong Technology recently stated that to consolidate its leading position in the global PCB industry and its advantages in fields like AI computing power and AI servers, the company continues to expand capacity for high-end products such as advanced HDI and high-layer count boards. This includes the Huizhou HDI equipment update and Plant 4 project, as well as HDI and high-layer count expansion projects in Thai and Vietnamese factories, with expansion speed leading the industry. Currently, all related expansion projects are progressing as planned, and the company will arrange capacity layout according to its strategic plan and business needs. Dongshan Precision stated that its capacity expansion aims to increase high-end PCB production to meet medium to long-term customer demand for high-end PCBs in emerging scenarios like high-speed computing servers and artificial intelligence, while also further expanding the company's operational scale and enhancing overall economic benefits. "Currently, the company's various technical transformation and expansion plans mainly target high-end data communication PCB products, which can support the company's business development needs," stated Guanghe Technology. Jinlu Electronics also mentioned that the PCB expansion project at its Qingyuan production base is being constructed in three phases, with construction and production occurring simultaneously. The company is currently accelerating the first phase of the project, which has not yet commenced production. Institutions Foresee Rapid Industry Growth CITIC Securities stated that with the acceleration of AI computing power infrastructure construction, PCB demand is surging. Against this backdrop, the planned output value for high-layer count boards, HDI boards, and IC substrates is growing rapidly. Domestic manufacturers are actively expanding high-end production capacity, and China's leading PCB companies are expected to form project investment totaling 41.9 billion yuan during 2025-2026. CSC Financial noted that AI PCBs are expected to continuously drive demand for updates and upgrades in PCB equipment. The PCB industry is characterized by a return to an upward cycle, product premiumization, and factory construction in Southeast Asia. Increases in output and process changes are expected to continuously drive demand for updates and upgrades in PCB equipment. According to the "2025-2030 China Printed Circuit Board (PCB) Industry Development Trend and Forecast Report" released by Zhongshang Industry Research Institute, with the proliferation of AI technology and the strong market entry of new energy vehicles, PCB demand related to AI servers and automotive electronics has significantly increased, becoming an important driver for industry growth. The global PCB market size was $78.34 billion in 2023, a decrease of 4.2% year-on-year, and approximately $88 billion in 2024. It is projected to reach $96.8 billion in 2025. Domestically, the same report shows China's PCB market size reached 363.257 billion yuan in 2023, a decrease of 3.80% from the previous year, and approximately 412.11 billion yuan in 2024. It is expected that the Chinese PCB market will recover in 2025, with a market size reaching 433.321 billion yuan. Improved Performance Across the Industry Chain The increased market demand in the PCB industry has already boosted the performance of related companies. Recently, over 10 listed companies in the PCB industry chain, including Shengyi Electronics, Han's CNC, and Dingtai GaoKE, disclosed significant year-on-year performance growth in their third-quarter reports. ---------------------------------- Source: Securities Times Disclaimer: We respect originality and also focus on sharing; the copyright of text and images belongs to the original author. The purpose of reprinting is to share more information. This does not represent our stance. 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In the rapidly evolving field of wireless communications and radar, the printed circuit board (PCB) substrate is a critical determinant of system performance. This technical overview presents a specialized 2-layer PCB construction that leverages the superior properties of Rogers RO3006 high-frequency laminate. Designed with precision and reliability at its core, this board is ideally suited for space-constrained, high-frequency applications. 1. Key Specifications The board is fabricated to meet exacting standards, with a focus on precision and performance in high-frequency regimes. Substrate Architecture: Symmetrical 2-layer construction Base Dielectric: Rogers RO3006 ceramic-PTFE composite Overall Thickness: 0.20 mm nominal Conductor Geometry: 5/9 mil minimum trace/space Interconnect System: 0.20 mm minimum via diameter Surface Metallization: 30 μ" gold (wire bond grade) Quality Conformance: IPC-Class-2, 100% electrical test 2. In-Depth Material Selection: Why RO3006? The choice of Rogers RO3006 laminate is the cornerstone of this board's performance. As a ceramic-filled PTFE composite, it provides a critical advantage over standard FR-4 or other PTFE materials: exceptional dielectric constant (Dk) stability over temperature. Eliminating Dk Drift: Unlike common PTFE/glass materials that exhibit a "step change" in Dk near room temperature, RO3006 offers a stable Dk of 6.15, ensuring predictable performance in real-world environments. Low-Loss Performance: With a dissipation factor (Df) of 0.002 at 10 GHz, the material minimizes signal loss, which is paramount in high-power and high-frequency applications. Mechanical Robustness: The material's low CTE (17 ppm/°C in X/Y) is closely matched to copper, providing excellent dimensional stability during thermal cycling and preventing plated through-hole (PTH) reliability issues. Its low moisture absorption (0.02%) further ensures long-term stability. 3. Benefits and Advantages The combination of the RO3006 material and the precise manufacturing results in several critical benefits: Exceptional Electrical Stability: The stable Dk of RO3006 ensures consistent impedance and minimal phase shift, which is crucial for the accuracy of high-frequency signals. Excellent Dimensional Stability: The low and matched in-plane CTE provides excellent dimensional stability, ensuring reliability during assembly and in environments with temperature fluctuations. Ideal for Hybrid Designs: RO3006 is well-suited for use in hybrid multi-layer designs alongside epoxy-glass materials, offering design flexibility. Wire-Bonding Ready: The 30 μ" pure gold surface finish provides an optimal, reliable surface for wire bonding, essential for connecting to semiconductor dies or other components. Proven Manufacturing: The use of Gerber RS-274-X artwork and adherence to IPC-Class-2 standards guarantee a high-quality, manufacturable product available worldwide. 4. Typical Applications This PCB configuration is ideally deployed in a range of high-performance applications, including: Automotive Radar Systems (e.g., 77 GHz) Global Positioning Satellite (GPS) Antennas Cellular Telecommunications Power Amplifiers and Antennas Patch Antennas for Wireless Communications Direct Broadcast Satellites 5. Conclusion This ultra-thin, double-layer PCB based on Rogers RO3006 material represents a robust solution for designers of next-generation RF and microwave systems. Its carefully controlled construction, leveraging the electrical and mechanical stability of RO3006, makes it a reliable and high-performance choice for demanding applications in the automotive, telecommunications, and satellite industries.

Today, we will take an in-depth look at a high-frequency PCB based on Taconic's TLX-9 material. This article will focus on its complete technical implementation path—from material properties to the final product—and explore how precise process control and rigorous quality management during manufacturing ensure its exceptional high-frequency performance and long-term operational reliability. 1. The Material Foundation: Mastering the Nuances of PTFE The manufacturing journey begins with the core material. TLX-9, a composite of polytetrafluoroethylene (PTFE) and woven fiberglass, provides an excellent foundation for a high-quality circuit board due to its exceptional dimensional stability and extremely low moisture absorption rate of

The successful manufacturing of any PCB, especially for demanding RF applications, is never accidental. It is a testament to a manufacturer's deep expertise in material understanding, process control, and quality verification. This article analyzes a specific two-layer RF board to deconstruct the key manufacturing factors that enable high yield and reliable mass production. We explore a PCB with the following key specifications: Base Material: RF-10 Layer Count: 2 Critical Dimensions: 5/7 mil trace/space, 0.3mm minimum hole size. Surface Finish: Immersion Silver Quality Standard: IPC-Class-2   1. Deep Understanding and Adaptation of Core Materials: The Foundation of Success Successful mass production begins with the precise mastery of the core material, RF-10. Its inherent properties dictate that a compatible process window must be adopted: Stable Dielectric Constant (10.2 ± 0.3): The manufacturer ensures the Dk value of the RF-10 substrate falls within the specified tolerance through strict incoming material inspection. This is the primary prerequisite for achieving consistent performance across batches, avoiding deviations caused by material variations. Inherently Low Dissipation Factor (0.0025): This characteristic facilitates manufacturing. Provided subsequent production processes are well-controlled, it naturally enables hardware performance with low insertion loss, reducing the need for post-production debugging. Excellent Dimensional Stability: This property of RF-10 ensures minimal deformation during thermal processes like lamination and soldering. This safeguards the registration accuracy for the 5/7 mil fine lines, directly improving the yield rate during the assembly stage. 2. Precision Process Control: Translating Specifications into Reality The successful mass production of this board relies on the manufacturer's exceptional control capabilities at several key process points: Fine-Line Etching Process: Achieving a 5/7 mil trace/space implies an extremely narrow etching process window. By precisely regulating the etchant's temperature, concentration, and spray pressure, the manufacturer ensures perfect line formation, free from under-etching (preventing shorts) or over-etching (preventing weak traces). High Aspect Ratio Micro-Via Metallization: Achieving uniform, void-free 20 μm copper plating on the hole walls for the board's 27 vias (with a 0.3mm minimum hole size) is critical for electrical connection reliability. This requires optimized drilling parameters, thorough desmear, and a stable plating process to ensure flawless interlayer connections. Surface Finish for High-Frequency Applications: The successful implementation of the Immersion Silver process depends on strict chemical bath control and workshop cleanliness. The resulting flat, oxidation-free silver layer not only provides excellent solderability but also minimizes skin effect loss for high-frequency signal transmission due to its smooth surface.     3. An End-to-End Quality Verification System Success lies not only in manufacturing but also in proving that every unit is qualified. This is achieved through an interlocking verification system: 100% Electrical Test: Performing a flying probe test on every single board before packaging is the ultimate guarantee before shipment. It irrefutably verifies the connectivity (no opens) and isolation (no shorts) of all electrical networks, ensuring the functional integrity of the delivered product. Quality Framework Adhering to IPC-Class-2: Implementing the quality standard throughout the production and inspection processes provides objective and uniform criteria for product acceptance. This mature system ensures the final product possesses the durability and reliability required for its commercial applications. Conclusion The successful production of this high-frequency PCB is a demonstration of the manufacturer's comprehensive capabilities in material adaptation, process control, and quality management. From the process adaptation to the properties of RF-10, to the precise control of fine lines and micro-via plating, and finally to the rigorous verification represented by the 100% electrical test, excellence in every step collectively forms the foundation for its high yield and high reliability. This fully illustrates that in the field of high-end PCB manufacturing, success stems from the precise mastery of every manufacturing detail.

The annual TPCA Show 2025 (Taiwan Circuit Board Industry International Exhibition) opened grandly today at Taipei Nangang Exhibition Center, Hall 1. The event will run for three days, from October 22nd to October 24th. Centered around the core theme "Energy Efficient AI: From Cloud to the Edge," this year's exhibition is synchronously held alongside three other major shows, including the Taiwan International Electronic Assembly & SMT Exhibition and the Taiwan International Green Tech Exhibition. It focuses on key trend themes such as "End Applications" and "AI & Smart Manufacturing Applications," showcasing cutting-edge solutions including collaborative robotics and intelligent image inspection. The opening ceremony featured a keynote speech by Mr. Ted Tseng, Chairman of Unimicron. A series of heavyweight events, such as the "TPCA Show × Business Weekly Leadership Summit" and the "Semiconductor and PCB Heterogeneous Integration Summit," followed, bringing together industry leaders from TSMC, AWS, Intel, and academic experts to discuss opportunities and challenges in the AI era. The exhibition has attracted over 600 companies from the industrial chain, including numerous renowned PCB industry players such as Zhen Ding Technology, Unimicron, Compeq, Kinwong, Shengyi Electronics, Ellington Electronics, Fastprint, Yangtze, Elec & Eltek, Zhongjing Electronics, Sunny Circuit, Junya Technology, Han's CNC, Yuanzhuo Wein, Xinchen Microequipment, Jiuchuan Intelligent, Dingqin Technology, Topoint, Loxim, Huazheng New Material, Nan Ya New Material, ITEQ, Grace Electron, Tayo Technology, Taiwan Union Technology, Kingboard Laminates, Doosan Electro-Materials, and Mitsubishi Chemical. These exhibitors span multiple sectors including raw materials, equipment, and testing. Notably, the concurrently held 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2025) is deeply integrated with the exhibition. IMPACT features 45 specialized forums and over 300 all-English paper presentations, focusing on forward-looking topics like semiconductor packaging and advanced processes, further enhancing the technical exchange aspect of the event. Against the backdrop of deepening Sino-US tech competition and the restructuring of the global electronics industry, this grand gathering not only highlights China's dominant position, representing over 75% of the global PCB industry output value, but also establishes a core platform for technological innovation and international cooperation. The event is expected to attract over 70,000 professional visitors and buyers from around the world for networking and exchange. On the exhibition floor, companies are showcasing their cutting-edge technologies and products, creating a vibrant stage for exchange and collaboration within the electronic circuit industry. From raw material innovation to equipment upgrades, and from smart manufacturing to green transformation, TPCA Show 2025 is outlining a new development path for the circuit board industry under the waves of AI and sustainability goals from a full industrial chain perspective. --------------------------------------- Live reporting by PCB Information Network Disclaimer: We respect originality and value sharing. The copyrights of texts and images belong to the original authors. The purpose of reposting is to share more information, which does not imply endorsement of the views. If any infringement occurs, please contact us, and we will delete the content promptly. Thank you.

Introduction The F4BTMS series is an upgraded version of the F4BTM series. The material now incorporates a large amount of ceramics and utilizes ultra-thin and ultra-fine fiberglass cloth reinforcement. These enhancements have greatly improved the material's performance, resulting in a wider range of dielectric constants.   The incorporation of ultra-thin, ultra-fine fiberglass cloth reinforcement, along with a precise blend of special nanoceramics and polytetrafluoroethylene resin, minimizes electromagnetic wave interference, reducing dielectric loss and enhancing dimensional stability.   F4BTMS exhibits reduced anisotropy in the X/Y/Z directions, enabling higher frequency usage, increased electrical strength, and improved thermal conductivity.   Features F4BTMS material offers a wide range of dielectric constants, providing flexible options from 2.2 to 10.2, while maintaining a stable value throughout.   Its dielectric loss is extremely low, ranging from 0.0009 to 0.0024, minimizing energy dissipation and improving overall system efficiency.   F4BTMS exhibits excellent temperature coefficient of dielectric constant. The TCDK with a DK value ranging from 2.55 to 10.2, remains within 100 ppm/℃.   The CTE values in the X and Y directions are between 10-50 ppm/°C , while in the Z direction, it is as low as 20-80 ppm/°C. This low thermal expansion ensures exceptional dimensional stability, enabling reliable hole copper connections.   F4BTMS demonstrates remarkable resistance to radiation, retaining stable dielectric and physical properties even after exposure to irradiation; and low outgassing performance, meeting the vacuum outgassing requirements for aerospace applications.   PCB capability We offer a wide range of PCB manufacturing capabilities, allowing you to choose the best options for your needs.   We can accommodate various layer counts, including Single Sided, Double Sided, Multilayer, and Hybrid PCBs.   You can select from different copper weights, such as 1oz (35µm) and 2oz (70µm).   We offer a diverse selection of dielectric thicknesses, ranging from 0.09mm (3.5mil) to 6.35mm (250mil).   Our manufacturing capabilities support PCB sizes up to 400mm X 500mm, catering to designs of different scales.   Various solder mask colors are available, such as Green, Black, Blue, Yellow, Red, and more.   Moreover, we provide diverse surface finish options, including Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold and ENEPIG etc.   PCB Material: PTFE,Ultra-thin and ultra-fine fiberglass, ceramics. Designation (F4BTMS ) F4BTMS DK (10GHz) DF (10 GHz) F4BTMS220 2.2±0.02 0.0009 F4BTMS233 2.33±0.03 0.0010 F4BTMS255 2.55±0.04 0.0012 F4BTMS265 2.65±0.04 0.0012 F4BTMS294 2.94±0.04 0.0012 F4BTMS300 3.0±0.04 0.0013 F4BTMS350 3.5±0.05 0.0016 F4BTMS430 4.3±0.09 0.0015 F4BTMS450 4.5±0.09 0.0015 F4BTMS615 6.15±0.12 0.0020 F4BTMS1000 10.2±0.2 0.0020 Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) Dielectric thickness 0.09mm (3.5mil), 0.127mm (5mil), 0.254mm(10mil),0.508mm(20mil), 0.635mm(25mil), 0.762mm(30mil), 0.787mm(31mil), 1.016mm(40mil), 1.27mm(50mil), 1.5mm(59mil), 1.524mm(60mil), 1.575mm(62mil), 2.03mm(80mil), 2.54mm(100mil), 3.175mm(125mil), 4.6mm(160mil), 5.08mm(200mil), 6.35mm(250mil) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..   Applications F4BTMS PCBs have extensive applications across various domains, including Aerospace and aviation equipment, Microwave and RF applications, Radar systems, Signal distribution feed networks, Phase-sensitive antennas and phased array antennas etc.

Introduction Wangling’s TP material is a unique high-frequency thermoplastic material in the industry. The dielectric layer of TP-type laminates consists of ceramics and polyphenylene Oxide resin (PPO), without fiberglass reinforcement. The dielectric constant can be precisely adjusted by adjusting the ratio between ceramics and PPO resin. The production process is special, and it has excellent dielectric performance and high reliability. Features The dielectric constant can be arbitrarily selected within the range of 3 to 25 according to circuit requirements, and it is stable. Common dielectric constants include 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 10.2, 11, 16, and 20. The material demonstrates low dielectric loss, with a slight increase at higher frequencies. However, this increase is not significant within the 10 GHz range. For long-term operation, the material can withstand temperatures ranging from -100°C to +150°C, showcasing excellent low-temperature resistance. It's important to note that temperatures exceeding 180°C may result in deformation, copper foil peeling, and significant changes in electrical performance. The material exhibits radiation resistance and displays low outgassing properties. Furthermore, the adhesion between the copper foil and dielectric is more reliable compared to ceramic substrates with vacuum coating. PCB Capability Let’s see our PCB Capability on TP materials. Layer count: We offer single-sided and double-sided PCBs based on the characteristics of the material. Copper weight: We provide options of 1oz (35µm) and 2oz (70µm), catering to different conductivity requirements. Wide range of dielectric thicknesses are available, such as 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 7.0mm, 8.0mm, 10.0mm, and 12.0mm, allowing flexibility in design specifications. Due to laminate size constraints, the maximum PCB we can provide is 150mm X 220mm. Solder mask: We offer various solder mask colors, including green, black, blue, yellow, red, and more, enabling customization and visual distinction. Our surface finish options include bare copper, HASL, ENIG, immersion silver, immersion tin, OSP, pure gold, ENEPIG, and more, ensuring compatibility with your specific requirements. PCB Material: Polyphenylene, ceramic Designation (TP Series) Designation DK DF TP300 3.0±0.06 0.0010 TP440 4.4±0.09 0.0010 TP600 6.0±0.12 0.0010 TP615 6.15±0.12 0.0010 TP920 9.2±0.18 0.0010 TP960 9.6±0.2 0.0011 TP1020 10.2±0.2 0.0011 TP1100 11.0±0.22 0.0011 TP1600 16.0±0.32 0.0015 TP2000 20.0±0.4 0.0020 TP2200 22.0±0.44 0.0022 TP2500 25.0±0.5 0.0025 Layer count: Single Sided, Double Sided PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness (or overall thickness) 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 7.0mm, 8.0mm, 10.0mm, 12.0mm PCB size: ≤150mm X 220mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. Applications Displayed on the screen is a TP high-frequency PCB with a thickness of 1.5mm, featuring OSP coating. TP high-frequency PCBs are also utilized in applications such as Beidou, missile-borne systems, fuzes, and miniaturized antennas etc.

Introduction Wangling’s TF laminates are a composite of microwave and temperature-resistant polytetrafluoroethylene (PTFE) resin material and ceramics. These laminates are free from fiberglass cloth and the dielectric constant is precisely adjusted by adjusting the ratio between ceramics and PTFE resin. With the application of special production processes, they demonstrate outstanding dielectric performance and offer a high level of reliability. Features TF laminates exhibit a stable and wide range of dielectric constant, which ranges from 3 to 16, with common values including 3.0, 6.0, 9.2, 9.6, 10.2, and 16. TF laminates feature exceptionally low dissipation factor, with loss tangent values of 0.0010 for DK ranging from 3.0 to 9.5 at 10GHz, 0.0012 for DK from 9.6 to 11.0 at 10GHz, and 0.0014 for DK spanning 11.1 to 16.0 at 5GHz. With a long-term working temperature surpassing TP materials, they can operate within a wide range of -80°C to +200°C The laminates come in thickness options ranging from 0.635mm to 2.5mm, catering to various design requirements. They boast resistance to radiation and exhibit low outgassing properties. PCB Capability We provide a comprehensive range of PCB manufacturing capabilities to fulfill your specific requirements. At first, we can accommodate both Single Sided and Double Sided PCBs. Then you have the option to select from different copper weights, such as 1oz (35µm) and 2oz (70µm), to meet your conductivity needs. A diverse selection of dielectric thicknesses are available in our house, ranging from 0.635mm to 2.5mm. Our manufacturing capabilities support PCB sizes up to 240mm X 240mm and various solder mask colours like Green, Black, Blue, Yellow, Red, and more. Additionally, we offer various surface finish options, including Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, and ENEPIG etc. PCB Material: Polyphenylene, ceramic Designation (TF Series) Designation DK DF TF300 3.0±0.06 0.0010 TF440 4.4±0.09 0.0010 TF600 6.0±0.12 0.0010 TF615 6.15±0.12 0.0010 TF920 9.2±0.18 0.0010 TF960 9.6±0.19 0.0012 TF1020 10.2±0.2 0.0012 TF1600 16.0±0.4 0.0014 Layer count: Single Sided, Double Sided PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness (Dielectric thickness or overall thickness) 0.635mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 2.5mm PCB size: ≤240mm X 240mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. Applications TF high-frequency PCBs are utilized in applications of microwave and millimeter-wave domains, such as millimeter-wave radar sensors, antennas, transceivers, modulators, multiplexers, as well as power supply equipment and automatic control equipment.

Introduction Wangling’s F4BTM series laminates are fiberglass cloth, nano-ceramic fillers, and PTFE resin, followed by strict pressing processes. They are based on the F4BM dielectric layer, with the addition of high dielectric and low loss nano-level ceramics, resulting in higher dielectric constant, improved heat resistance, lower thermal expansion coefficient, higher insulation resistance, and better thermal conductivity, while maintaining low loss characteristics.   F4BTM and F4BTME share the same dielectric layer but use different copper foils: F4BTM is paired with ED copper foil, while F4BTME is paired with reverse-treated (RTF) copper foil, offering excellent PIM performance, more precise line control, and lower conductor loss.   Features F4BTM offers a wide range of features. With a DK range from 2.98 to 3.5, it provides flexibility in design. The addition of ceramics further enhances its performance, making it suitable for demanding applications. This material is available in various thicknesses and sizes, catering to different project requirements while offering cost savings. Its commercialization and suitability for large-scale production make it a highly cost-effective choice. Additionally, F4BTM exhibits radiation-resistant and low out-gassing properties, ensuring its reliability even in challenging environments.   PCB Capability Our PCB manufacturing capabilities cover a wide range of options. We can handle various layer counts, including single-sided, double-sided, multilayer, and hybrid PCBs.   For copper weight, we offer options of 1oz (35µm), and 2oz (70µm), allowing flexibility in conductivity requirements.   When it comes to dielectric thickness (or overall thickness), we provide a comprehensive selection of options ranging from 0.25mm to 12.0mm, catering to different design specifications.   The maximum PCB size we can accommodate is 400mm X 500mm, ensuring sufficient space for your project.   We offer a variety of solder mask colors, including green, black, blue, yellow, red, and more, allowing for customization and visual distinction.   Regarding surface finish, we support several options such as bare copper, HASL, ENIG, immersion silver, immersion tin, OSP, pure gold, ENEPIG, and more, ensuring compatibility with your specific requirements.   PCB Material: PTFE / glass fiber cloth / Nano-ceramic filler Designation (F4BTM ) F4BTM DK (10GHz) DF (10 GHz) F4BTM298 2.98±0.06 0.0018 F4BTM300 3.0±0.06 0.0018 F4BTM320 3.2±0.06 0.0020 F4BTM350 3.5±0.07 0.0025 Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness (or overall thickness) 0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..   Applications The screen displays a DK 3.0 F4BTM PCB, constructed on a 1.524mm substrate and featuring HASL surface finishes.   F4BTM PCBs are utilized in various applications, including Antenna, Mobile Internet, Sensor Network, Radar, Millimeter Wave Radar, Aerospace, Satellite Navigation, and Power Amplifier etc.

Brief introduction RO3203 high frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials have been specifically engineered to provide exceptional electrical performance and mechanical stability while remaining cost-effective. As an extension of the RO3000 series, RO3203 materials stand out with their enhanced mechanical stability.   With a dielectric constant of 3.02 and a dissipation factor of 0.0016, RO3203 materials enable an extended useful frequency range beyond 40 GHz.   Features RO3203 has a thermal conductivity of 0.48 W/mK, indicating its ability to conduct heat.   The volume resistivity is 107 MΩ.cm and surface resistivity of the material is also 107 MΩ.   RO3203 exhibits a dimensional stability of 0.8 mm/m in the X and Y directions and it has a moisture absorption rate of less than 0.1%, indicating its ability to resist absorbing moisture when exposed to specific conditions.   The material has different coefficients of thermal expansion in three directions. The Z-direction coefficient is 58 ppm/℃, while the X and Y-direction coefficients are both 13 ppm/℃.   RO3203 has a Thermal Decomposition Temperature (Td) of 500℃ and a density of 2.1 gm/cm3 at 23℃.   After soldering, the material exhibits a copper peel strength of 10.2 lbs/in and a flammability rating of V-0 according to the UL 94 standard, while also being compatible with lead-free processes.   Property RO3203 Direction Units Condition Test Method Dielectric Constant,εProcess 3.02±0.04 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5 Dielectric Constant,εDesign 3.02 Z - 8 GHz - 40 GHz Differential Phase Length Method Dissipation Factor, tan d 0.0016 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5 Thermal Conductivity 0.48   W/mK Float 100℃ ASTM C518 Volume Resistivity 107   MΩ.cm A ASTM D257 Surface Resistivity 107   MΩ A ASTM D257 Dimensional Stability 0.8 X, Y mm/m COND A IPC-TM-650 2.4.3.9 Moisure Absorption