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On June 3, Xiaomi held its Investor Day event. It was reported that Lei Jun and other Xiaomi executives, including Lu Weibing, discussed topics such as chips, Xiaomi cars, and smartphones.   Smartphone Business: In 2024, Xiaomi is expected to gain over 13 million net new users, with 5.5 million coming from Apple and Huawei users. Lu Weibing emphasized that "without scale, there is no competitiveness," stating, "Capabilities drive outcomes, and transformation is the key."   Lei Jun shared the impressive results from Xiaomi's new retail attempts in Hong Kong, indicating that Xiaomi would strongly promote this model in developed countries and regions.   Lu Weibing revealed that Xiaomi's offline channel costs for home appliances are 15-20 percentage points lower than competitors. Additionally, Xiaomi stated that it would continue to control hardware profit margins at 5%.   YU7 Pricing to Be Confirmed Days Before Launch The automotive business is currently a key focus for Xiaomi. During the Investor Day, Lei Jun mentioned that Xiaomi's automotive division is expected to become profitable in the third and fourth quarters of this year.   According to the financial report released by Xiaomi Group, revenue from Xiaomi's smart electric vehicles rose from 18.4 million yuan in Q1 2024 to 18.1 billion yuan in Q1 2025. In Q1 2025, the company delivered a total of 75,869 Xiaomi SU7 series vehicles.   Moreover, the gross margin for Xiaomi's automotive business has been steadily improving, increasing from 20.4% in the previous quarter to 23.2% in Q1 this year. Xiaomi attributed this rise to the different product mix of the Xiaomi SU7 series delivered during the quarter (including the SU7 Ultra) and an increase in gross margins of other related businesses.   Currently, Xiaomi only sells the Xiaomi SU7 model, with official data showing that delivery numbers for both April and May surpassed 28,000 vehicles.   Previously, Xiaomi's first SUV model, the Xiaomi YU7, was unveiled on May 22, positioned as a luxury high-performance SUV, set to officially launch in July.   At the Xiaomi Investor Conference, Lei Jun disclosed that the latest Xiaomi YU7 price could not be the rumored 235,900 yuan, and the official price would be confirmed 1-2 days prior to launch.   After this, Lu Weibing, Xiaomi Group partner and president, mentioned during the Q1 earnings call that the YU7 received widespread appreciation from users after its pre-release, becoming more popular than the SU7 at its debut.   Lu Weibing revealed that the consultation inquiries for the YU7 after its technical announcement exceeded those of the SU7 during the same period, with user interest being about three times greater. The YU7 has a broader audience, and Xiaomi is very confident about it.   Recently, Xiaomi's automotive division stated that it is preparing for large-scale production of the YU7. In response to questions about whether capacity would be sufficient after the YU7's launch and if there would be delays in delivery, Xiaomi expressed confidence in delivering to users as quickly as possible after the official launch.   During the aforementioned Investor Conference, Lei Jun also mentioned that Xiaomi began investing in robotics research and development five years ago. Currently, their automotive factory is testing relevant capabilities, and Xiaomi's automotive chips are under development, expected to be launched soon.   ------------------------------------------------------------------------------- Source: Caixin, The Paper, Elephant News, Financial Statement: We respect originality and value sharing; the copyrights for text and images belong to the original authors. The purpose of reprint is to share more information and does not represent the stance of this account. If your rights are infringed, please contact us promptly, and we will delete it as soon as possible. Thank you.

The dielectric constant (DK) is a crucial property of materials used in printed circuit boards (PCBs), influencing their performance in various applications. One significant factor affecting DK is temperature. This article examines how fluctuations in temperature affect the dielectric constant and the consequences for PCB design and performance.   Understanding Dielectric Constant   The dielectric constant is a measure of a material's ability to store electrical energy in an electric field. It plays a vital role in determining how signals propagate through PCB materials. A higher DK indicates greater capacitance and can affect signal speed, impedance, and overall circuit performance.   Temperature Dependence of Dielectric Constant   1. General Trends Increase in Temperature: As temperature rises, the dielectric constant of most materials tends to decrease. This phenomenon occurs because increased thermal energy enhances molecular motion, which diminishes the material's polarizability.   Decrease in Temperature: Lowering the temperature typically results in an increased dielectric constant. Reduced molecular motion leads to higher polarizability, thereby increasing the material's ability to store electrical energy.   2. Material-Specific Behavior Different materials respond to temperature changes in various ways. For example:   Ceramics: These materials may exhibit a more pronounced change in dielectric constant with temperature fluctuations compared to polymers.   Polymers: While they generally experience a decrease in DK with increasing temperature, the extent of this change can vary based on the specific polymer used.   Frequency Dependence The effect of temperature on DK can also depend on the frequency of the applied electric field. At certain frequencies, dielectric properties may stabilize, whereas at others, significant variations can occur. This frequency dependence is particularly relevant in high-speed and RF applications, where maintaining consistent electrical characteristics is crucial.   Implications for PCB Performance   1. Signal Integrity Variations in DK due to temperature can significantly impact signal integrity. A lower DK at elevated temperatures may lead to increased signal delay and distortion, affecting the overall performance of high-speed circuits.   2. Impedance Control The dielectric constant directly influences the characteristic impedance of PCB traces. Accurate DK values are essential for ensuring proper impedance matching, which minimizes signal reflection and loss. Designers must account for temperature-induced DK variations to maintain consistent impedance throughout the operating temperature range.   3. Thermal Management Temperature changes can also affect heat dissipation in PCBs. Materials with suitable DK values can help manage thermal performance, ensuring that circuits operate reliably under varying thermal conditions.   Thermal Expansion Considerations As temperature fluctuates, materials expand or contract, potentially altering the geometry of the PCB. This change can further impact the effective dielectric constant, complicating the design process. Understanding these thermal expansion characteristics is essential for achieving accurate electrical performance.   Conclusion The relationship between temperature and dielectric constant is a critical consideration in PCB design. As temperature affects DK, it can influence signal integrity, impedance, and overall circuit performance. Designers must carefully select materials and account for temperature variations to ensure reliability and efficiency, especially in high-frequency and temperature-variable applications. By understanding and managing the impact of temperature on dielectric constant, engineers can create robust PCBs that meet the demands of modern electronics.

In the manufacturing and assembly of printed circuit boards (PCBs), cleaning and drying are crucial steps that significantly influence their performance, reliability, and overall quality. As electronic devices become more complex and compact, the need for impeccable PCB cleanliness has never been more essential. This article delves into the necessity of cleaning PCBs and the various methods employed for effective drying after cleaning.   The Necessity of PCB Cleaning   1. Removal of Contaminants During the PCB manufacturing process, various contaminants can accumulate on the surface of the boards. These may include oils from manufacturing equipment, dust from the production environment, and chemical residues from soldering processes. If not removed, these contaminants can interfere with electrical connections and lead to circuit failures. Cleaning is, therefore, a critical step that ensures a pristine surface, facilitating reliable electrical performance.   2. Improving Solder Quality A clean PCB surface is essential for achieving high-quality solder joints. Contaminants can lead to poor wetting of the solder, resulting in weak joints that may fail under mechanical stress. Proper cleaning ensures that the solder has a good surface to adhere to, thereby enhancing the reliability of the soldering process and ultimately the durability of the entire electronic assembly.   3. Preventing Corrosion Residual chemicals and moisture left on PCBs can lead to corrosion of metal components, which can significantly shorten the lifespan of the device. Corrosion can create conductive pathways that lead to short circuits, potentially damaging the device. Regular cleaning helps eliminate these harmful substances, reducing the risk of corrosion and improving the longevity of the PCB.   4. Enhancing Electrical Performance The presence of impurities can negatively affect the electrical characteristics of a PCB. Contaminants can lead to increased signal loss and interference, particularly in high-frequency applications. By removing these impurities through effective cleaning, manufacturers can ensure stable signal transmission and improved overall electrical performance.   5. Meeting Quality Standards Many industries—especially those in aerospace, automotive, and medical fields—have stringent cleanliness requirements for PCBs. Compliance with these standards is critical for quality assurance and product certification. Cleaning processes help ensure that PCBs meet these requirements, thus avoiding costly rework and potential product failures in the field.   Drying Treatment After PCB Cleaning Once the cleaning process is complete, drying is essential to preserve the integrity and performance of the boards. Moisture left on the PCB can lead to a host of issues, including corrosion and compromised electrical performance. Here are several commonly used drying methods:   1. Hot Air Drying Hot air drying involves using hot air blowers or ovens to evaporate moisture from the PCB. This method is effective for quickly removing surface moisture. However, it is crucial to control the temperature carefully to avoid overheating, which can damage sensitive components or alter the material properties of the PCB. Ensuring uniform air circulation is also vital for consistent drying results.   2. Vacuum Drying Vacuum drying is an efficient method that accelerates moisture evaporation by reducing the atmospheric pressure around the PCB. This technique is particularly beneficial for complex PCB designs with intricate geometries where moisture may be trapped. While effective, vacuum drying requires specialized equipment and careful monitoring to ensure optimal results.   3. Natural Air Drying Natural air drying involves placing the cleaned PCB in a well-ventilated area, allowing it to dry spontaneously. This method is simple and cost-effective; however, it can take longer than other methods. The drying time can be influenced by environmental factors such as temperature and humidity, making it less predictable.   4. Heat Plate Drying In this method, the PCB is placed on a heated plate, which accelerates drying through conduction. Heat plate drying is efficient but requires careful temperature control to prevent localized overheating, which could damage components or the PCB material itself.   5. Using Desiccants Placing the cleaned PCB in a sealed container with desiccants (such as silica gel) helps absorb any residual moisture. This method is particularly useful for long-term storage of PCBs, as it prevents moisture accumulation over time. Regularly changing the desiccants is important to maintain their effectiveness.   Conclusion The cleaning and drying of PCBs are vital processes that directly impact their performance, reliability, and lifespan. Effective cleaning removes contaminants that can impair electrical connections and lead to failures, while proper drying ensures that moisture does not compromise the integrity of the board. By understanding the importance of these processes and implementing suitable methods, manufacturers can significantly enhance the quality of their PCBs.

In PCB (Printed Circuit Board) manufacturing, a "golden finger" refers to a gold-plated connector or contact area on a PCB. These fingers are crucial for establishing electrical connections and ensuring reliable signal transmission between the PCB and other components or devices.   1. Purpose and Functionality   Electrical Connection Golden fingers serve as connectors that interface with sockets, connectors, or other PCBs. They facilitate communication and power transfer within electronic devices, playing a vital role in ensuring that the device operates efficiently and effectively.   Signal Integrity One of the key advantages of using golden fingers is their ability to enhance signal integrity. The gold plating provides a low-resistance connection, which is essential for maintaining signal quality, especially in high-speed data transmission applications. This feature is particularly important in modern electronics, where even minor signal degradation can lead to performance issues.   2. Material and Coating   Gold Plating Golden fingers are typically coated with a thin layer of gold over nickel. Gold is selected for its excellent electrical conductivity, resistance to corrosion, and durability. The nickel layer serves as a barrier to prevent diffusion of gold into the underlying copper, enhancing the overall performance of the connection.   Thickness The thickness of the gold plating can vary based on application requirements. For instance, thicker gold layers are generally used in high-wear applications where mechanical stress is expected, while thinner layers may suffice for less demanding environments.   3. Applications   Computer Boards Golden fingers are commonly found in computer motherboards, graphics cards, and other devices where reliable connections are critical. They provide the necessary interface for connecting various components, such as RAM, CPUs, and GPUs, ensuring that data flows seamlessly between them.   Consumer Electronics In addition to computer hardware, golden fingers are utilized in various consumer electronics, including gaming consoles, printers, and communication devices. Their robustness and reliability make them ideal for devices that require consistent performance over time.   Industrial Applications Golden fingers are also used in industrial applications where durable connections are necessary. For example, they may be found in control systems, automation equipment, and instrumentation devices that operate in challenging environments.   4. Manufacturing Considerations   Precision The manufacturing process for golden fingers requires precision and attention to detail. Accurate dimensions and plating thickness are critical to ensure compatibility with connectors and sockets. Any deviation can result in poor connectivity or functional failure.   Quality Control Rigorous quality control measures are essential during production to ensure that the gold plating is uniform and free from defects. This may involve visual inspections, electrical testing, and other assessments to verify that the golden fingers meet specified standards.   5. Benefits   Durability One of the primary benefits of golden fingers is their durability. Gold is highly resistant to oxidation and corrosion, which enhances the longevity of the connections. This is particularly advantageous in environments where exposure to moisture or contaminants is likely.   Reliability Using gold plating ensures reliable electrical connections, significantly reducing the risk of signal loss or failure. This reliability is crucial in applications where consistent performance is necessary, such as in telecommunications and data centers.   Cost-Effectiveness While gold is more expensive than other materials, the long-term benefits of using golden fingers—such as reduced maintenance costs and lower failure rates—can make them a cost-effective choice in the long run.   Conclusion Golden fingers play a vital role in PCB manufacturing by providing reliable electrical connections and enhancing signal integrity. Their use of gold plating not only ensures durability but also meets the demands of high-performance applications across various industries. As technology continues to evolve, the importance of golden fingers in maintaining robust electronic connections remains indispensable.

Recently, global semiconductor manufacturing leader TSMC announced a partnership with the U.S. startup Avicena to jointly produce Micro LED-based optical interconnect products. This collaboration aims to replace traditional electrical connections with advanced optical communication technology, providing low-cost, high-efficiency data transmission solutions for the growing demands of graphics processors (GPUs).   "TSMC is focusing on non-typical optical technologies!" On May 26, IEEE Spectrum reported that TSMC is producing Micro LED light source receivers (PD) for the U.S. Micro LED startup Avicena.   Micro LED is a new technology that has emerged in the past decade, primarily used in televisions and smartwatches. Although it offers low energy consumption, high brightness, and long lifespan, each pixel requires an independent chip, leading to costs that can reach millions or even tens of millions of chips for a single panel.   Currently, display manufacturers are actively exploring the use of Micro LED for data center chip transmission light sources, aiming to replace traditional copper cables or more advanced laser transmission. Founded in 2019, Avicena is one of many players in this field and has received investments from semiconductor companies such as SK Hynix, Micron, Samsung, and Corning.   One of the favorable contenders in the Micro LED optical communication race is Rayli Light Intelligence, led by brothers He Zhihao (left) and He Zhiqiang.   To meet the high bandwidth data transmission needs of artificial intelligence (AI) servers, companies like Broadcom and NVIDIA have introduced Co-Packaged Optical (CPO) switch architectures, placing external laser modules and optical fibers next to chips as light sources for "long-distance transmission," replacing traditional optical transceiver modules and copper wires used in server cabinets.   However, short-distance transmission between chips in a cabinet still primarily relies on traditional copper wiring. Avicena believes Micro LED offers lower power consumption and greater bandwidth than copper, and has successfully persuaded TSMC to assist in this endeavor.   Lucas Tsai, Vice President of TSMC North America, pointed out that LEDs are widely used in consumer electronics and have much lower power consumption compared to lasers, making them very suitable for short-distance transmission.   ------------------------------------- Source: Tech News Statement: We respect originality and value sharing; the copyrights for text and images belong to the original authors. The purpose of reprint is to share more information and does not represent the stance of this account. If your rights are infringed, please contact us promptly, and we will delete it as soon as possible. Thank you.