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Rogers TMM4 Microwave Pcb With Immersion Gold For Satellite Communication

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Rogers TMM4 Microwave Pcb With Immersion Gold For Satellite Communication

Rogers TMM4 Microwave Pcb With Immersion Gold For Satellite Communication
Rogers TMM4 Microwave Pcb With Immersion Gold For Satellite Communication Rogers TMM4 Microwave Pcb With Immersion Gold For Satellite Communication Rogers TMM4 Microwave Pcb With Immersion Gold For Satellite Communication

Large Image :  Rogers TMM4 Microwave Pcb With Immersion Gold For Satellite Communication

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-103.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: Composite Of Ceramic, Hydrocarbon And Thermoset Polymer TMM4 Layer Count: 1 Layer, 2 Layer
PCB Thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm) Etc. PCB Size: ≤400mm X 500mm
Solder Mask: Green, Black, Blue, Yellow, Red Etc. Copper Weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish: Bare Copper, HASL, ENIG, Immersion Tin, OSP.
High Light:

Rogers Tmm4 Microwave Pcb

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Immersion Gold Microwave Pcb

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Satellite Communication Rogers PCB Board

 

Rogers TMM4 Microwave Printed Circuit Board 15mil 20mil 25mil 30mil 50mil 60mil With Immersion Gold

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Rogers TMM4 thermoset microwave material is ceramic, hydrocarbon, thermoset polymer composite designed for high plated-through-hole reliability stripline and microstrip applications. It's available with dielectric constant at 4.70. The electrical and mechanical properties of TMM4 combine many of the benefits of both ceramic and traditional PTFE microwave circuit materials, without requiring the specialized production techniques. It does not require a sodium napthanate treatment prior to electroless plating.

 

TMM4 has an exceptionally low thermal coefficient of dielectric constant, typically less than 30 PPM/°C. The material’s isotropic coefficient of thermal expansion, very closely matched to copper, allows for production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM4 is approximately twice that of traditional PTFE/ceramic materials, facilitating heat removal.

 

TMM4 is based on thermoset resins, and do not soften when heated. As a result, wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation.

 

Our PCB Capability (TMM4)

PCB Material: Composite of Ceramic, hydrocarbon and thermoset polymer
Designator: TMM4
Dielectric constant: 4.5 ±0.045 (process); 4.7 (design)
Layer count: 1 Layer, 2 Layer
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion tin, Pure gold (no nickle under gold), OSP.

 

Typical Applications

Chip testers

Dielectric polarizers and lenses

Filters and coupler

Global Positioning Systems Antennas

Patch Antennas

Power amplifiers and combiners

RF and microwave circuitry

Satellite communication systems

 

Rogers TMM4 Microwave Pcb With Immersion Gold For Satellite Communication 0

 

Data Sheet of TMM4

Property   TMM4 Direction Units Condition Test Method
Dielectric Constant,εProcess 4.5±0.045 Z   10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 4.7 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.002 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant +15 - ppm/°K -55-125 IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 6 x 108 - Mohm.cm - ASTM D257
Surface Resistivity 1 x 109 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 371 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 TGA - ASTM D3850
Coefficient of Thermal Expansion - x 16 X ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 16 Y ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 21 Z ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.7 Z W/m/K 80 ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.7 (1.0) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) 15.91 X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.76 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.07 - % D/24/23 ASTM D570
3.18mm (0.125") 0.18
Specific Gravity 2.07 - - A ASTM D792
Specific Heat Capacity 0.83 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -

 

Rogers TMM4 Microwave Pcb With Immersion Gold For Satellite Communication 1

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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