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China Bicheng Electronics Technology Co., Ltd company profile 0

 

PCB Test

  • ·Automatic Optical Inspection
  • ·Differential Impedance / Single End Impedance
  • ·Flying Probe Net List Test
  • ·High Voltage Test
  • ·IPC Class 2 / IPC Class 3
  • ·Reliability Test
  • ·Solder-ability Test
  • ·Thermal Stress Test
  • ·TDR Testing

 

Available Base Materials

  • ·RO4350B, RO4003C, RO4730G3, RO4360G2, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210;
  • ·RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC;
  • ·TMM4, TMM10, Kappa 438;
  • ·TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5;
  • ·PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2);
  • ·AD450, AD600, TC350;
  • ·Nelco N4000, N9350, N9240;
  •  FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V;
  •  Polyimide, PET;
  •  Aluminum base, Copper base
  • ·Hybrid PCB

 

Plating

  • ·Conductive Via Fill
  • ·Hard Gold Edge connector
  • ·HASL Standard
  • ·HASL Lead Free (RoHS)
  • ·Immersion Gold
  • ·Immersion Silver
  • ·Immersion Tin
  • ·Non-Conductive Via Fill
  • ·OSP
  • ·Plated Edges
  • ·Plated Radii (Castellation)
  • ·Plated Milling Cutouts
  • ·Non-Conductive Via Fill
History

 

BichengPCB is the brand of Shenzhen Bicheng Electronics Technology Co., Ltd. It can be traced back to 2003 when her name is Bicheng Enterprise Company. It specialized in blank printed circuit boards for single sided PCB and double sided PCB.

 

In order to meet the increases of market demands, we started to offer multilayer PCBs in 2008, layer count up to 32 layers. Bicheng introduced high frequency material in 2010 for the applications of antenna and amplifer and raido products.

 

With development, metal core PCB and hybrid PCB were suscessfully put into trial production and and got highly evaluated. In 2014 the company was restructured and reformed. Bicheng played a new role in the organiztion, focusing on global market sales and after-sales services.

 

Time flies to 2020, we have completed a series of integrated PCB products: High frequency/microwave PCB, Multi-layer/ Hybrid PCB, Metal Core PCB and Flexible Circuits.

 

As of now, our products can be found in more than 100 countries and regions in the world.

 

China Bicheng Electronics Technology Co., Ltd company profile 0

office building

 

 

Our Team

China Bicheng Electronics Technology Co., Ltd company profile 0

Every day, we dedicate to make things better, keep moving forward and never stop. We believe that teamwork is the guarantee of success, and our focus on creative process makes us even better.

 

Under the guidance of modern science management and instant information shared through the network technology, a high efficient working environment has been come into being. Skilled manufacturing experience can bring out the best performance of the equipment. You'll enjoy our professional super-value services with our high quality PCB's and flexible cooperation.

 

Your individual requirements can get satisfied at Bicheng and also our success can be achieved by the innovative products and competitive advantages.

 

 

PCB Capability

China Bicheng Electronics Technology Co., Ltd company profile 0

                                       Printed Circuit Board Capability 2021
Parameter Value
 Layer Counts  1-32
 Substrate Material RO4350B, RO4003C, RO4730G3, RO4360G2, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210;
RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC;
TMM4, TMM10, Kappa 438;
TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5;
PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2);
AD450, AD600, TC350;
Nelco N4000, N9350, N9240;
FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V;
Polyimide, PET; Metal Core etc.
 Maximum Size  Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
 Board Outline Tolerance  ±0.0059" (0.15mm)
 PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)  ±8%
Thickness Tolerance(t<0.8mm)  ±10%
 Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
 Minimum Track 0.003" (0.075mm)
 Minimum Space  0.003" (0.075mm)
 Outer Copper Thickness  35µm--420µm (1oz-12oz)
 Inner Copper Thickness  17µm--420µm (0.5oz - 12oz)
 Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
 Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
 Registration (Mechanical) 0.00197" (0.05mm)
 Aspect Ratio  12:1
 Solder Mask Type  LPI
 Min Soldermask Bridge 0.00315" (0.08mm)
 Min Soldermask Clearance 0.00197" (0.05mm)
 Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance  ±10%
 Surface Finish HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger
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