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In high-frequency PCB design, material selection and process details often determine whether a product succeeds or fails. Today I am looking at a 6-layer board built on Astra MT77 – a commercial microwave laminate that has been gaining attention. But what truly sets this board apart is not the material itself. It is a process that often gets overlooked: resin plugging with copper plating fill.   Let me walk you through the design and then focus on why this process matters.   Construction Overview: A Clean 6-Layer MT77 Stack-up This is a 6-layer rigid PCB measuring 131mm by 107mm. The stackup is straightforward – three layers of 0.127mm MT77 Astra cores, laminated with MT77 Astra prepreg. Finished board thickness is 0.994mm.   Inner layer copper weight is 0.5oz (approximately 18μm), while outer layers use 1oz (about 35μm). Surface finish is Immersion Silver. Both sides have green solder mask with white silkscreen.   Two features are worth highlighting:   Blind vias L1-L2 and L5-L6 G12 resin plugging with copper plating fill – the main focus of this article   MT77 Astra: High-Frequency Performance Without PTFE Headaches   Astra MT77 is Isola's commercial microwave laminate. Its biggest advantage: stable electrical performance across a wide frequency and temperature range, while working seamlessly with standard FR-4 processes.   Across -40°C to +140°C and frequencies up to W-band (75-110GHz), MT77 maintains a stable dielectric constant. Its dissipation factor is just 0.0017 – ultra-low loss. This makes it a cost-effective alternative to PTFE materials.   Why cost-effective? MT77 requires no plasma desmear, no special hole preparation, reduces drill wear, and has shorter lamination cycles. It runs on standard FR-4 production lines without special equipment.   Typical applications include automotive radar systems – adaptive cruise control, pre-crash detection, blind spot monitoring, lane departure warning, and stop-and-go systems.   The Core Process: Resin Plugging and Copper Plating Fill   Now let me focus on the most interesting technical feature: G12 resin plugging with copper plating fill.   What is resin plugging? After initial copper plating, vias are filled with epoxy resin. Then a second copper plating step fills and levels the via opening, making it flush with the board surface.   Why do this? For high-frequency designs, the benefits are significant.   First, signal integrity improves. Vias are impedance discontinuities in high-frequency circuits. A hollow via creates reflections and losses. Resin-filled vias are more uniform, resulting in smoother impedance transitions.   Second, mechanical strength increases. Hollow vias concentrate stress during thermal cycling. Resin-filled vias distribute stress more evenly, making the board more robust – critical for automotive applications that must survive -40°C to +140°C temperature swings.   Third, surface flatness improves. After copper fill, the via is perfectly flush with the board surface. This is essential for SMT assembly and fine-pitch soldering. Uneven surfaces cause uneven solder paste deposition, leading to defects.   Fourth, interlayer reliability improves. The combination of resin plugging and copper fill holds up better under repeated thermal stress than hollow vias.   G12 refers to the resin grade – low shrinkage, high Tg, excellent heat resistance, and good flow characteristics.   Why MT77 and Resin Plugging Work Together   MT77 handles multiple lamination cycles without losing dimensional stability or electrical properties. Resin plugging involves multiple thermal steps – resin curing, copper plating, final lamination, and soldering. If the material were sensitive to heat, the benefits would be lost.   MT77 avoids this. Its CTE matches copper well. Its Tg exceeds 280°C. Among high-frequency laminates, it is exceptionally stable under heat – making it a perfect partner for resin plugging.   Blind Vias and Resin Plugging: A Natural Pairing Blind vias connect L1-L2 and L5-L6 – stopping at inner layers rather than running through the entire board. They already reduce stub effects, improving high-frequency performance. But a blind via still leaves a surface opening – a potential source of unevenness. Resin plugging and copper fill solve this, creating a perfectly smooth surface with no signal reflections.   This pairing exemplifies how design, material, and process must work together.   Immersion Silver and Automotive Radar Immersion Silver offers good conductivity, excellent flatness, and low insertion loss – a solid choice for RF applications. The one caveat: silver tarnishes when exposed to sulfur compounds, requiring proper storage before assembly. In high-volume automotive production, this is manageable.   77GHz millimeter-wave radar is the backbone of ADAS. At 77GHz, even a small Dk shift throws off antenna tuning, reducing detection range and accuracy. MT77 maintains stable Dk across temperature extremes with a Df of just 0.0017 – more than adequate for 77GHz radar. And because it processes like FR-4, even complex 6-layer boards with blind vias and resin plugging can be manufactured at reasonable cost.   Key Considerations If you are considering a similar design, keep these points in mind:   Resin plugging adds cost. Evaluate whether your design truly needs it. For fine-pitch BGAs or tight flatness requirements, it is worthwhile.   Resin selection matters. CTE and curing temperature must match MT77's thermal profile. Consult both your material supplier and fabricator.   Copper fill uniformity requires tight control. Too much copper affects impedance. Too little leaves vias unfilled.   Blind via registration is critical. In a 0.994mm thick 6-layer board, alignment precision is essential. L1-L2 and L5-L6 blind vias are formed in separate lamination steps.     Final Thoughts On paper, this 6-layer MT77 Astra board looks fairly standard. But the real story is the integration: a material that delivers RF performance without FR-4 process penalties, combined with blind vias and resin plugging, aimed at high-reliability automotive radar.   Resin plugging with copper fill adds cost and time, but the payoff is real: better signal integrity, better mechanical reliability, and a perfectly flat surface for assembly. If your next project demands stable RF performance in harsh conditions, this combination is well worth considering.

Date: July 6, 2026 Source: Industry News Kingboard Laminates, a globally leading copper-clad laminate manufacturer under the Kingboard Group, issued a price increase notice today (July 6) through its trading arm, Guangdong Kingboard Laminates Trading Co., Ltd., announcing across-the-board price hikes for its entire product portfolio. The move comes in response to tightening supply and soaring prices of key raw materials, including glass fabric and copper foil. According to the price adjustment notice (Reference No. 20260706), effective immediately for all new orders, FR-4 products (thickness above 1.3mm) will see a 15% price increase, CEM-1/22F products will rise by 10%, and prepreg (PP) materials will increase by 15%. In addition, copper foil processing fees have been revised upward, with grades below 1.5oz rising by RMB 5/KG and grades above 2oz increasing by RMB 8/KG.

SHENZHEN, June 30, 2026 — The European Commission has officially notified that, effective July 1, 2026, the EU will abolish its long-standing €150 import duty exemption threshold. All parcels entering the EU, regardless of their value, will now be subject to customs duties, marking the end of the cross-border small-package tax-free era. New Tariff Rules Take Effect Under the new regulations, B2C (business-to-consumer) parcels valued at €150 or less will no longer enjoy duty-free treatment starting July 1. Customs duties will be calculated based on the number of tariff lines, at a rate of €3 per tariff line. For B2B (business-to-business) commercial parcels, duties will be calculated according to the applicable tariff rates based on the product's customs classification. Stricter Customs Clearance Requirements The new rules also impose stricter requirements on customs documentation. B2B commercial shipments must provide a valid VAT number and EORI (Economic Operators Registration and Identification) number. B2C private parcels must provide a valid IOSS (Import One-Stop Shop) number prior to shipment. Logistics industry sources have cautioned that while shipments without an IOSS or VAT number may still be dispatched, they face a high probability of customs clearance delays, detention, or even return or destruction upon entry. Any resulting losses will be borne by the sender. Invoice and Product Identification Rules The invoicing standards have also been clarified: shippers must clearly indicate the trade nature as either "B2B" or "B2C" on the invoice. Additionally, starting November 1, 2026, B2C parcels will be subject to mandatory Product Identification (PID) requirements. Senders must provide the product's merchant information and manufacturer identification code, as well as the standardized product identification code if available.

Dear Valued Customers and Business Partners, To facilitate smooth communication, production planning, and order scheduling, we are pleased to provide our official holiday schedule for the remainder of 2026 and the upcoming 2027 Spring Festival. Please kindly adjust your order timelines and shipping arrangements accordingly. Mid-Autumn Festival – September 25 to September 27, 2026 (3 days).  National Day – October 1 to October 7, 2026 (7 days).  Spring Festival (Chinese New Year) – February 2 to February 13, 2027 (12 days).    Please note that all production and shipping operations will be suspended during the holidays. Our sales team will remain available via email for urgent inquiries, but response times may be delayed. Should you have any questions or require assistance with order scheduling, please do not hesitate to contact our customer support team. We greatly appreciate your continued trust and partnership. Wishing you and your families a prosperous and joyful holiday season!   Yours sincerely, Bicheng

When it comes to high-frequency PCB design, the material choice often dictates success or failure. This 2-layer board, built on Rogers RO4835, strikes an impressive balance between RF performance and manufacturing practicality. Let's break down why this design works and why it matters for engineers working on automotive radar, microwave links, and power amplifiers. The Material That Makes It Possible RO4835 is essentially the more thermally stable cousin of Rogers' well-known RO4350B. The key differentiator is oxidation resistance. Traditional thermoset microwave materials can degrade when exposed to repeated thermal stress. RO4835 holds up significantly better, maintaining consistent dielectric properties through multiple soldering cycles. The numbers speak for themselves. With a dielectric constant of 3.48 ± 0.05 and a dissipation factor of 0.0037 at 10 GHz, this material delivers the low-loss performance required for circuits operating well into the microwave spectrum. The tight Dk tolerance of ±0.05 is particularly valuable—it means controlled impedance lines stay predictable across production batches, eliminating the need for post-production tuning. Thermally, RO4835 is a beast. The glass transition temperature exceeds 280°C. This isn't just a number on a datasheet. It translates to real-world reliability during lead-free soldering. No blistering. No delamination. Just consistent performance through the harsh temperature profiles of modern assembly processes. The material also carries a UL 94 V-0 flammability rating and meets IPC-4103 specifications, making it suitable for safety-critical applications. The coefficient of thermal expansion deserves attention too. At 31 ppm/°C in the Z-axis, plated through-holes experience less stress during thermal cycling. This directly impacts long-term reliability, especially in automotive applications where temperature swings from -40°C to +125°C are routine. The low in-plane expansion (10 ppm/°C on X-axis, 12 ppm/°C on Y-axis) ensures dimensional stability throughout circuit processing, from lamination through reflow soldering. When materials expand and contract at different rates, via barrels can crack and inner-layer connections can fail. RO4835 minimizes this risk. Another critical advantage is the LoPro reverse-treated copper foil available with RO4835. This proprietary foil treatment reduces conductor surface roughness, which in turn reduces insertion loss at high frequencies. At 10 GHz and above, skin effect concentrates current at the conductor surface. Rough copper increases the effective path length and adds resistive losses. LoPro foil minimizes this effect, preserving signal amplitude through transmission lines.       A Stack-Up That Keeps It Simple This is a no-frills 2-layer design. The core is 0.508 mm of RO4835, sandwiched between 1 oz copper on both sides. Total board thickness comes in at 0.6 mm. The dimensions—45 mm by 83.69 mm with ±0.15 mm tolerance—fit neatly into compact RF modules where space is at a premium. Minimum trace width is 5 mils with 6 mils spacing, which supports controlled impedance lines while staying within standard fabrication capabilities. For a 50-ohm microstrip line on RO4835 with a 0.508 mm dielectric thickness, the trace width would be approximately 0.95 mm. This is a comfortable geometry that balances impedance control with manufacturability. The design rules are achievable with standard etching processes, avoiding the yield penalties associated with ultra-fine features. The minimum hole size of 0.2 mm accommodates standard via drill sizes and through-hole component leads. The design incorporates 9 plated through-hole vias, each with a minimum copper plating thickness of 20 µm. This plating thickness is verified through microsection analysis per IPC-TM-650 2.2.18, ensuring sufficient current-carrying capability and mechanical robustness. No blind vias and no buried vias are specified, which simplifies the fabrication sequence and reduces manufacturing cost. For a 2-layer board, there is simply no need for these advanced via structures. The "No Solder Mask" Decision This might raise eyebrows for engineers accustomed to conventional PCB practices, but the absence of solder mask on both outer layers is a deliberate choice for high-frequency performance. Solder mask isn't electrically neutral. It introduces dielectric loss and has uncontrolled permittivity that can perturb characteristic impedance. The dissipation factor of typical solder mask materials ranges from 0.02 to 0.08—an order of magnitude higher than RO4835's 0.0037. This means even a thin layer of solder mask can add measurable insertion loss, particularly at frequencies above 5 GHz. For microwave circuits, this is unacceptable. Removing the mask eliminates this variable entirely, ensuring that the circuit's electrical performance is determined solely by the controlled dielectric of RO4835. Additionally, solder mask thickness and dielectric constant can vary across the board and from batch to batch. This variability introduces inconsistency in impedance-controlled lines, complicating design validation and production testing. Without solder mask, there are no such variations. The designer achieves consistent, predictable performance across every board. The trade-off is cosmetic—boards won't have that polished green finish—but the electrical benefits are clear. In RF engineering, function trumps appearance. Surface Finish and Silkscreen Immersion gold (ENIG) is specified over electroless nickel. Nickel thickness ranges from 3 to 6 µm with gold thickness of 0.05 to 0.10 µm, compliant with IPC-4552. ENIG provides excellent solderability, corrosion resistance, and a flat surface for component attachment. The planar nature of the finish is particularly important for surface-mount components, ensuring consistent solder joint formation. The finish is compatible with both soldering and wire bonding, giving assembly flexibility. The gold layer protects the nickel from oxidation, ensuring a fresh, solderable surface even after extended storage. ENIG is widely used in the industry and is supported by all major assembly houses. Black silkscreen appears on the top layer only for component identification and reference designator marking. Bottom layer has no legend, reducing unnecessary steps in fabrication. Silkscreen is strictly excluded from pad areas to prevent contamination. Solder paste will not wet properly over silkscreen ink, and even small ink residues can lead to voiding, head-in-pillow defects, or poor wetting. Excluding silkscreen from pads is a simple but important design discipline. Built to IPC Class 2 This isn't aerospace-grade Class 3, and it's not meant to be. IPC Class 2 is appropriate for general-purpose electronic products requiring moderate reliability. Minor cosmetic imperfections are acceptable, but all functional requirements—continuity, insulation resistance, thermal performance—are strictly enforced. Class 2 provides a practical middle ground. It ensures quality without imposing the extreme requirements of Class 3, which would add cost without necessarily improving performance for this application. The standard specifies hole wall quality, minimum annular ring, and cleanliness levels that are achievable with standard manufacturing processes while still guaranteeing reliable operation. Every board undergoes 100% electrical testing before shipping. Flying-probe or fixture-based systems verify continuity of all nets, isolation between non-connected nets, and detection of opens or shorts. No defective units leave the factory. This comprehensive screening ensures that every board functions as designed, supporting worldwide distribution without requiring additional inspection at the customer site. Where This PCB Shines Automotive radar is the obvious use case—24 GHz and 77 GHz systems where low loss and thermal stability are non-negotiable. The material handles the harsh under-hood environment, while the straightforward design keeps costs manageable. Radar sensors are increasingly common in modern vehicles for adaptive cruise control, collision avoidance, and blind-spot detection. These systems must operate reliably in extreme temperatures, vibration, and humidity. RO4835 delivers that reliability. Beyond automotive, this PCB is suitable for point-to-point microwave links, power amplifiers, phased-array radar, and general RF components like filters and couplers. The material's low loss and tight Dk tolerance enable consistent performance in these demanding applications. The Bottom Line This 2-layer board demonstrates that high-frequency design doesn't always require exotic PTFE materials or complex multilayer stack-ups. RO4835 delivers the electrical performance needed for demanding microwave applications while remaining compatible with standard FR-4 fabrication processes. The result is a cost-effective solution for performance-sensitive, high-volume production. No unnecessary complexity. No over-engineering. Just good design decisions backed by solid material science. For engineers working on automotive radar or similar RF applications, this design offers a proven reference point—one that balances performance, reliability, and manufacturability in equal measure. And in the competitive world of automotive electronics, that balance is what separates successful products from also-rans.

Today I want to talk about a somewhat unusual PCB. What makes it unusual is not a high layer count or complex manufacturing processes — quite the opposite. This is a two-layer board with no solder mask and no silkscreen, yet it is specifically designed for high-frequency antenna applications.   The core material is WL-CT440, a domestically produced high-frequency laminate from Wangling. If you are looking for an alternative to Rogers or PTFE materials, this article might give you some new ideas.   Construction Overview: Minimalist but Not Simple Let us start with the basic parameters. The board measures 89mm by 63.5mm and uses a two-layer construction. The finished board thickness is 0.8mm, with 1oz or 35μm of finished copper weight on the outer layers. The minimum trace width is 4 mils and the minimum spacing is 6 mils. The smallest hole size is 0.2mm, and there are no blind vias. Every board undergoes 100% electrical testing before shipment.   Now let me highlight the statistics. The board contains 37 components and 49 pads in total, consisting of 27 thru-hole pads and 22 surface mount pads all located on the top layer — no SMT pads are placed on the bottom layer. There are 31 vias and only 2 nets. This is a typical high-frequency or antenna topology: simple in structure but demanding in performance.   Why No Solder Mask and No Silkscreen? The most distinctive feature of this board is the complete absence of both solder mask and silkscreen — nothing on the top layer and nothing on the bottom layer.   Solder mask is normally used to prevent solder bridging and protect the copper surface. But in high-frequency applications, it can actually become a source of interference. The dielectric constant and loss factor of solder mask differ from those of the base laminate, which can alter the impedance of microstrip lines, especially at frequencies above 10GHz. Removing the solder mask means a purer signal path and better consistency.   The absence of silkscreen is equally straightforward. Without a solder mask, silkscreen adhesion becomes problematic anyway. And on an antenna board, silkscreen provides no benefit for assembly, so omitting it is an easy decision.   This is a classic case of prioritizing function over form — the board does not need to look pretty as long as the electrical performance meets the requirements.     Why Choose WL-CT440? WL-CT440 is Wangling's organic polymer ceramic fiberglass cloth-covered copper clad laminate. It belongs to the thermosetting resin family. The dielectric layer consists of hydrocarbon resin, ceramics, and fiberglass cloth.   At 10GHz and 23°C, it offers a dielectric constant (Dk) of 4.1 and a dissipation factor (Df) of 0.004. What do these numbers mean? Low loss with a moderate dielectric constant — a very good fit for microwave and antenna applications.   But the most appealing feature of WL-CT440 is not its electrical performance alone. It is the full compatibility with FR-4 manufacturing processes. Anyone who has worked with PTFE materials knows that PTFE requires special hole preparation treatments such as plasma etching or sodium naphthalene treatment. Without these, the adhesion of plated copper inside the hole will be insufficient. WL-CT440, on the other hand, can be processed using the conventional workflow of any standard PCB factory — drilling, desmear, electroless copper deposition, pattern transfer — all in one seamless flow. For small-volume prototyping and cost control, this is a real advantage.   Thermal and Mechanical Reliability WL-CT440 has a glass transition temperature (Tg) exceeding 280°C, far above that of standard FR-4. A high Tg means the material will not soften or deform easily under high-temperature operating conditions.   Regarding the coefficient of thermal expansion (CTE), the X-axis is 14ppm/°C and the Y-axis is 18ppm/°C — both matching reasonably well with copper, which sits at approximately 17ppm/°C. The Z-axis CTE is 35ppm/°C. For a two-layer board without blind vias, the thermal reliability stress on vias is relatively low to begin with.   Thermal conductivity is rated at 0.66 W/m·K, which is significantly higher than that of FR-4 at roughly 0.25 W/m·K. This helps with power handling. Moisture absorption is 0.12 percent, which falls within an acceptable range. However, a word of caution is needed here: this board has no solder mask. If used in humid environments, the exposed copper surfaces may face corrosion risks. This needs to be carefully evaluated for the intended application scenario.   One Parameter Worth Special Attention: TCDK WL-CT440 offers a temperature coefficient of dielectric constant (TCDK) of -21 ppm/°C. What does this number tell us? For every 1°C increase in temperature, the dielectric constant decreases by 21 parts per million.   For antenna design, TCDK is a critical parameter. If the Dk of a material varies significantly with temperature, the operating frequency of the antenna will drift — summer measurements will differ from winter measurements, and daytime performance may differ from nighttime performance. The TCDK value of WL-CT440 is quite good, ensuring consistent antenna performance across the full temperature range.   Typical Applications According to the manufacturer, WL-CT440 is primarily used in the following fields:   Aerospace equipment, cabin electronics, and aircraft systems. Microwave antennas and phase-sensitive antennas. Early warning radar and airborne radar systems. Phased array antennas and beam-forming networks. Satellite communication and navigation equipment. Power amplifiers.   Manufacturing Process and Quality Standards The supplied artwork format is Gerber RS-274-X, which can be processed by PCB factories worldwide. The quality standard is IPC-Class-2. Surface finish is immersion gold (ENIG). With no solder mask present, immersion gold effectively protects the copper surface from oxidation while providing good solderability.   A Few Points to Keep in Mind This board design has several aspects that require special attention. First, the absence of a solder mask means the copper surfaces are completely exposed. Despite the immersion gold protection, care must be taken to avoid scratches and contamination during assembly, testing, and use.   Second, there is no silkscreen. Component placement cannot rely on silkscreen reference marks. You will need to depend on the pick-and-place machine's coordinate files or assembly fixtures for manual assembly.   Third, with two layers, 31 vias, and only 2 nets, this topology suggests some form of antenna array or power division network. Special attention should be paid to the impact of vias on the RF path, particularly the continuity of the signal return path.   Final Thoughts The design philosophy behind this two-layer WL-CT440 board is very clear: use a material that can be processed with conventional manufacturing techniques, remove the non-essential solder mask and silkscreen layers, and allocate the cost savings toward performance and reliability.   If you are developing antennas, radar front-ends, or satellite communication modules, and you wish to avoid the processing headaches associated with PTFE materials, WL-CT440 is worth serious consideration. Of course, the protection issues that come with removing the solder mask, the uniformity control of the immersion gold surface, and the calibration of impedance calculations are all details that need to be discussed with your PCB fabricator before prototyping.   Have you run into any challenges when designing high-frequency boards like this one? Feel free to share your experience.

If you're searching for a PCB material that balances low-loss performance with cost-effectiveness, Rogers RO4533 deserves your attention. Today, I want to walk you through a 2-layer rigid PCB design based on RO4533 – a solution that carefully considers material selection, board construction, and manufacturing processes.   Overview: Simple Yet Efficient 2-Layer Structure This PCB measures 123.5mm by 46mm and uses a two-layer construction. The finished board thickness is 0.6mm, with 1oz or 35μm of finished copper weight on the outer layers. The minimum trace and space dimensions are 4 and 5 mils respectively, while the smallest hole size is 0.25mm. There are no blind vias in this design. Every board undergoes 100% electrical testing before shipment to ensure functional integrity.   Looking at the PCB statistics, the board contains 36 components in total. There are 28 pads, consisting of 18 thru-hole pads and 10 surface mount pads all located on the top layer – no SMT pads are placed on the bottom layer. The design includes 17 vias and just 2 nets. The structure isn't overly complex, but every detail is tailored for antenna-class applications.   Why RO4533? RO4533 is Rogers' ceramic-filled, glass-reinforced hydrocarbon-based material. Its biggest advantage over traditional PTFE-based laminates is full compatibility with standard FR-4 fabrication processes. What does this mean in practice? You can process RO4533 using conventional PCB manufacturing techniques – no special hole preparation is required for PTFE materials. For volume production and cost control, this is a very practical benefit.   On the electrical side, RO4533 offers a dielectric constant of 3.3 at 10GHz and a dissipation factor of 0.0025 at the same frequency. Low loss, low dielectric constant, and low passive intermodulation or PIM response make this material highly suitable for microstrip antenna applications – think cellular infrastructure base station antennas, WiMAX antenna networks, and similar wireless communication systems.   Thermal and Mechanical Reliability: Vias You Can Count On RO4533 has a glass transition temperature or Tg exceeding 280°C – well above the 130 to 170°C range of standard FR-4. A high Tg means the material maintains dimensional stability under high temperatures. Combined with a low Z-axis coefficient of thermal expansion or CTE of 37ppm per °C, plated through-hole reliability improves significantly during thermal cycling.   Two additional CTE values are worth noting. The X-axis CTE is 13ppm per °C, while the Y-axis CTE is 11ppm per °C. These match closely with copper, which sits at approximately 17ppm per °C. This good CTE match substantially reduces stress between the copper layers and the dielectric material during temperature changes, helping the antenna board resist warping and deformation.   Thermal Management and Environmental Stability Thermal conductivity is rated at 0.6 watts per meter per Kelvin – mid-to-upper range for RF materials. For antenna designs with meaningful power handling requirements, this parameter makes a real difference.   Moisture absorption is just 0.02 percent. Performance drift in humid environments is minimal, making this material well-suited for outdoor base station equipment.   Surface Finish and Manufacturing Quality Surface finish is Immersion Gold, also known as ENIG, offering good solderability and wire-bonding capability. The top silkscreen is white, while there is no silkscreen on the bottom layer. The top solder mask is green, and again, there is no solder mask on the bottom layer. This asymmetric mask and silkscreen arrangement may be driven by specific antenna radiation requirements or assembly considerations.   Quality standard is IPC-Class-2, which is sufficient for most commercial communication equipment reliability needs. The supplied artwork format is Gerber RS-274-X, which can be processed by PCB factories worldwide.   Key Benefits Let me highlight the key benefits of this design approach. The low loss, low dielectric constant, and low PIM response make this board suitable for a wide range of RF applications. The thermoset resin system is compatible with standard PCB fabrication processes, eliminating the need for specialized handling. Excellent dimensional stability leads to higher yields on larger panel sizes. Uniform mechanical properties help the board maintain its mechanical form during handling. And the high thermal conductivity delivers improved power handling capability.   Typical Applications This PCB design is well-suited for several typical applications. These include cellular infrastructure base station antennas, WiMAX antenna networks, microstrip antenna arrays, and wireless communication infrastructure in general.   Final Thoughts The core idea behind this two-layer RO4533 PCB design is pretty straightforward: use the simplest possible layer count and processes while leveraging RO4533's balanced strengths in RF performance, process compatibility, and reliability.   If you're developing base station antennas, WiMAX network equipment, or other wireless communication products that require low loss and low PIM, this design approach is worth considering. Of course, for your specific project, details like impedance control, antenna feed point layout, and ground via density will need further optimization.   I would love to hear about your experience. In your RF PCB designs, do you lean toward Rogers materials or PTFE-based laminates? What drives your choice – cost, processability, or electrical performance? Feel free to share your thoughts.  

Introduction The F4BTMS series is an upgraded version of the F4BTM series. The material now incorporates a large amount of ceramics and utilizes ultra-thin and ultra-fine fiberglass cloth reinforcement. These enhancements have greatly improved the material's performance, resulting in a wider range of dielectric constants.   The incorporation of ultra-thin, ultra-fine fiberglass cloth reinforcement, along with a precise blend of special nanoceramics and polytetrafluoroethylene resin, minimizes electromagnetic wave interference, reducing dielectric loss and enhancing dimensional stability.   F4BTMS exhibits reduced anisotropy in the X/Y/Z directions, enabling higher frequency usage, increased electrical strength, and improved thermal conductivity.   Features F4BTMS material offers a wide range of dielectric constants, providing flexible options from 2.2 to 10.2, while maintaining a stable value throughout.   Its dielectric loss is extremely low, ranging from 0.0009 to 0.0024, minimizing energy dissipation and improving overall system efficiency.   F4BTMS exhibits excellent temperature coefficient of dielectric constant. The TCDK with a DK value ranging from 2.55 to 10.2, remains within 100 ppm/℃.   The CTE values in the X and Y directions are between 10-50 ppm/°C , while in the Z direction, it is as low as 20-80 ppm/°C. This low thermal expansion ensures exceptional dimensional stability, enabling reliable hole copper connections.   F4BTMS demonstrates remarkable resistance to radiation, retaining stable dielectric and physical properties even after exposure to irradiation; and low outgassing performance, meeting the vacuum outgassing requirements for aerospace applications.   PCB capability We offer a wide range of PCB manufacturing capabilities, allowing you to choose the best options for your needs.   We can accommodate various layer counts, including Single Sided, Double Sided, Multilayer, and Hybrid PCBs.   You can select from different copper weights, such as 1oz (35µm) and 2oz (70µm).   We offer a diverse selection of dielectric thicknesses, ranging from 0.09mm (3.5mil) to 6.35mm (250mil).   Our manufacturing capabilities support PCB sizes up to 400mm X 500mm, catering to designs of different scales.   Various solder mask colors are available, such as Green, Black, Blue, Yellow, Red, and more.   Moreover, we provide diverse surface finish options, including Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold and ENEPIG etc.   PCB Material: PTFE,Ultra-thin and ultra-fine fiberglass, ceramics. Designation (F4BTMS ) F4BTMS DK (10GHz) DF (10 GHz) F4BTMS220 2.2±0.02 0.0009 F4BTMS233 2.33±0.03 0.0010 F4BTMS255 2.55±0.04 0.0012 F4BTMS265 2.65±0.04 0.0012 F4BTMS294 2.94±0.04 0.0012 F4BTMS300 3.0±0.04 0.0013 F4BTMS350 3.5±0.05 0.0016 F4BTMS430 4.3±0.09 0.0015 F4BTMS450 4.5±0.09 0.0015 F4BTMS615 6.15±0.12 0.0020 F4BTMS1000 10.2±0.2 0.0020 Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) Dielectric thickness 0.09mm (3.5mil), 0.127mm (5mil), 0.254mm(10mil),0.508mm(20mil), 0.635mm(25mil), 0.762mm(30mil), 0.787mm(31mil), 1.016mm(40mil), 1.27mm(50mil), 1.5mm(59mil), 1.524mm(60mil), 1.575mm(62mil), 2.03mm(80mil), 2.54mm(100mil), 3.175mm(125mil), 4.6mm(160mil), 5.08mm(200mil), 6.35mm(250mil) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..   Applications F4BTMS PCBs have extensive applications across various domains, including Aerospace and aviation equipment, Microwave and RF applications, Radar systems, Signal distribution feed networks, Phase-sensitive antennas and phased array antennas etc.

Introduction Wangling’s TP material is a unique high-frequency thermoplastic material in the industry. The dielectric layer of TP-type laminates consists of ceramics and polyphenylene Oxide resin (PPO), without fiberglass reinforcement. The dielectric constant can be precisely adjusted by adjusting the ratio between ceramics and PPO resin. The production process is special, and it has excellent dielectric performance and high reliability. Features The dielectric constant can be arbitrarily selected within the range of 3 to 25 according to circuit requirements, and it is stable. Common dielectric constants include 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 10.2, 11, 16, and 20. The material demonstrates low dielectric loss, with a slight increase at higher frequencies. However, this increase is not significant within the 10 GHz range. For long-term operation, the material can withstand temperatures ranging from -100°C to +150°C, showcasing excellent low-temperature resistance. It's important to note that temperatures exceeding 180°C may result in deformation, copper foil peeling, and significant changes in electrical performance. The material exhibits radiation resistance and displays low outgassing properties. Furthermore, the adhesion between the copper foil and dielectric is more reliable compared to ceramic substrates with vacuum coating. PCB Capability Let’s see our PCB Capability on TP materials. Layer count: We offer single-sided and double-sided PCBs based on the characteristics of the material. Copper weight: We provide options of 1oz (35µm) and 2oz (70µm), catering to different conductivity requirements. Wide range of dielectric thicknesses are available, such as 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 7.0mm, 8.0mm, 10.0mm, and 12.0mm, allowing flexibility in design specifications. Due to laminate size constraints, the maximum PCB we can provide is 150mm X 220mm. Solder mask: We offer various solder mask colors, including green, black, blue, yellow, red, and more, enabling customization and visual distinction. Our surface finish options include bare copper, HASL, ENIG, immersion silver, immersion tin, OSP, pure gold, ENEPIG, and more, ensuring compatibility with your specific requirements. PCB Material: Polyphenylene, ceramic Designation (TP Series) Designation DK DF TP300 3.0±0.06 0.0010 TP440 4.4±0.09 0.0010 TP600 6.0±0.12 0.0010 TP615 6.15±0.12 0.0010 TP920 9.2±0.18 0.0010 TP960 9.6±0.2 0.0011 TP1020 10.2±0.2 0.0011 TP1100 11.0±0.22 0.0011 TP1600 16.0±0.32 0.0015 TP2000 20.0±0.4 0.0020 TP2200 22.0±0.44 0.0022 TP2500 25.0±0.5 0.0025 Layer count: Single Sided, Double Sided PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness (or overall thickness) 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 7.0mm, 8.0mm, 10.0mm, 12.0mm PCB size: ≤150mm X 220mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. Applications Displayed on the screen is a TP high-frequency PCB with a thickness of 1.5mm, featuring OSP coating. TP high-frequency PCBs are also utilized in applications such as Beidou, missile-borne systems, fuzes, and miniaturized antennas etc.

Introduction Wangling’s TF laminates are a composite of microwave and temperature-resistant polytetrafluoroethylene (PTFE) resin material and ceramics. These laminates are free from fiberglass cloth and the dielectric constant is precisely adjusted by adjusting the ratio between ceramics and PTFE resin. With the application of special production processes, they demonstrate outstanding dielectric performance and offer a high level of reliability. Features TF laminates exhibit a stable and wide range of dielectric constant, which ranges from 3 to 16, with common values including 3.0, 6.0, 9.2, 9.6, 10.2, and 16. TF laminates feature exceptionally low dissipation factor, with loss tangent values of 0.0010 for DK ranging from 3.0 to 9.5 at 10GHz, 0.0012 for DK from 9.6 to 11.0 at 10GHz, and 0.0014 for DK spanning 11.1 to 16.0 at 5GHz. With a long-term working temperature surpassing TP materials, they can operate within a wide range of -80°C to +200°C The laminates come in thickness options ranging from 0.635mm to 2.5mm, catering to various design requirements. They boast resistance to radiation and exhibit low outgassing properties. PCB Capability We provide a comprehensive range of PCB manufacturing capabilities to fulfill your specific requirements. At first, we can accommodate both Single Sided and Double Sided PCBs. Then you have the option to select from different copper weights, such as 1oz (35µm) and 2oz (70µm), to meet your conductivity needs. A diverse selection of dielectric thicknesses are available in our house, ranging from 0.635mm to 2.5mm. Our manufacturing capabilities support PCB sizes up to 240mm X 240mm and various solder mask colours like Green, Black, Blue, Yellow, Red, and more. Additionally, we offer various surface finish options, including Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, and ENEPIG etc. PCB Material: Polyphenylene, ceramic Designation (TF Series) Designation DK DF TF300 3.0±0.06 0.0010 TF440 4.4±0.09 0.0010 TF600 6.0±0.12 0.0010 TF615 6.15±0.12 0.0010 TF920 9.2±0.18 0.0010 TF960 9.6±0.19 0.0012 TF1020 10.2±0.2 0.0012 TF1600 16.0±0.4 0.0014 Layer count: Single Sided, Double Sided PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness (Dielectric thickness or overall thickness) 0.635mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 2.5mm PCB size: ≤240mm X 240mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. Applications TF high-frequency PCBs are utilized in applications of microwave and millimeter-wave domains, such as millimeter-wave radar sensors, antennas, transceivers, modulators, multiplexers, as well as power supply equipment and automatic control equipment.