Double-Sided Rogers TMM6 Microwave PCB 2mm Thickness HASL Finish

This PCB is a custom 2-layer rigid RF circuit board built with Rogers TMM6 thermoset ceramic composite substrate, engineered for microwave circuits requiring consistent high-frequency performance. Measuring 45.5mm × 90mm with tight ±0.15mm dimensional tolerance, this board features HASL surface finish with no solder mask or silkscreen applied on either side. Constructed entirely with through-hole vias and no blind vias, it supports fine 5/8 mil trace and space routing alongside a minimum hole size of 0.35mm. The outer copper layers carry 1oz finished copper weight, and 20 μm via plating guarantees stable electrical interconnection. Every finished board undergoes 100% electrical testing before shipment and is fabricated to IPC-Class-2 quality standards. Gerber RS-274-X design files are accepted for manufacturing, with worldwide delivery available.

PCB Specification

Each custom microwave PCB is produced following strict dimensional and fabrication controls to preserve high-frequency signal integrity. The table below consolidates all core physical specs, manufacturing rules and surface treatment details for this TMM6 circuit board for your quick reference.

PCB Stack-up

The layer stack-up directly determines impedance and RF performance of microwave PCBs. The following table presents the layer stackup arrangement of this 2-layer rigid PCB, detailing copper foil and core material from top to bottom.

PCB Statistics

The layout statistics reflect the circuit complexity and pad/vias distribution of the submitted design. This table captures key layout statistics derived from the PCB design file.

Rogers TMM6 Introduction

Rogers TMM6 thermoset microwave material is a ceramic thermoset polymer composite designed for high plated thru-hole reliability strip-line and micro-strip applications.

TMM6 laminates offer a combination of the benefits of both ceramic and traditional PTFE microwave circuit laminates without requiring the specialized production techniques common to those materials, all at a unique dielectric constant (Dk) compared to other materials in the product family. Unlike many PTFE-based microwave substrates, TMM6 adopts thermoset chemistry, which simplifies fabrication flow and removes the need for complex handling processes usually required for pure PTFE boards. This unique material design balances outstanding microwave electrical behaviour with good manufacturability for volume RF production.

Features and Benefits

• Dielectric constant (Dk) of 6.0 +/- 0.08 at 10GHz
• Dissipation factor of 0.0023 at 10GHz
• Thermal coefficient of Dk of -11 ppm/°K
• Coefficient of thermal expansion matched to copper
• Decomposition Temperature (Td) of 425 °C TGA
• Coefficient of Thermal Expansion - x y z : 18 ppm/K, 18 ppm/K, 26 ppm/K
• Thermal Conductivity of 0.72W/mk
• Available in a thickness range of 0.0015 to 0.500 inches +/- 0.0015”
• Mechanical properties resist creep and cold flow
• Resistant to process chemicals, reducing damage during fabrication
• Based on a thermoset resin, allowing for reliable wire-bonding
• All common PCB processes can be used with TMM 6 materials

Typical Applications

• RF and microwave circuitry
• Power amplifiers and combiners
• Filters and couplers
• Satellite communication systems
• Global Positioning Systems Antennas
• Patch Antennas
• Dielectric polarizers and lenses
• Chip testers

Quality & Production Information

Fabrication accepts Gerber RS-274-X artwork files. The board complies with IPC-Class-2 standard, and worldwide shipping is supported.

Conclusion

This 2-layer Rogers TMM6 microwave PCB delivers stable high-frequency electrical performance and robust mechanical reliability. The material’s well-balanced thermal and dielectric properties make it a solid choice for RF engineers working on microwave, antenna and satellite projects. With strict dimensional control, full electrical inspection and global supply capability, it is a dependable custom circuit solution for your high-frequency hardware developments. The thermoset composite construction of TMM6 eliminates many manufacturing hurdles seen on conventional PTFE substrates, enabling consistent quality for both prototype builds and scaled manufacturing orders.