Base material:WL-CT350
Layer count:2 layers (double-sided rigid PCB structure)
PCB thickness:0.2mm ultra-thin profile
Base material:TFA300
Layer count:Single side
PCB thickness:0.2mm
Base material:Wangling TP440 thermoplastic material, 0.5mm thickness
Layer count:2 Layers
PCB thickness:0.6mm
Base material:Taconic CER-10 organic-ceramic high-frequency laminate
Layer count:2 layers
PCB size:67mm × 55.9mm (1 piece)
Base material:WL-CT300 high-frequency thermosetting dielectric material
Layer count:2 Layers
PCB thickness:0.25mm
Base material:WL-CT338 thermoset hydrocarbon ceramic glass-reinforced substrate combined with high-Tg FR4 dielectric materials
Layer count:2 Layers
PCB thickness:1.47mm
Base material:TFA294 glass-free ceramic PTFE composite substrate
Layer count:2 layers
PCB thickness:1.1mm
Base material:TF300 high-frequency dielectric material
Layer count:2 layers
PCB thickness:0.7mm
Base material:FSD1020T hydrocarbon nano-ceramic composite substrate
Layer count:2 layers
PCB thickness:0.508mm core dielectric thickness
Base material:TSM-DS3
Layer count:2-layer
PCB thickness:0.6mm
PCB material:RF-30A
Layer count:2-layer
PCN thickness:0.6mm
Base material:TLY-5
Layer count:2-layer
PCB thickness:0.3mm