2-Layer Rogers RO4360G2 PCB High Dk Laminate Low Loss RF Board

This custom 2-layer rigid PCB is fabricated with authentic Rogers RO4360G2 high-frequency hydrocarbon ceramic laminate, engineered for stable RF performance in cellular communication hardware. With a 0.4mm finished thickness and compact 48.9mm × 95.4mm board size, this circuit board adopts industry-standard ENEPIG surface finish, green top solder mask and white top silkscreen. Built with pure through-hole vias and precise 5/7 mil fine-line routing, the board meets strict IPC-Class-2 quality standards and undergoes 100% electrical testing before shipment. Balancing reliable high-frequency performance and FR-4 compatible processability, this RO4360G2 PCB is a practical, cost-effective solution for base station power amplifiers and small cell transceiver designs.

PCB Specifications

This 2-layer RO4360G2 PCB features a simplified through-hole structure without blind vias, delivering consistent signal transmission for medium-to-high frequency RF circuits. All fabrication parameters follow standard industrial tolerances to ensure repeatable prototype and batch production results.

PCB Stack-up Structure

The board adopts a symmetrical 2-layer stack-up with a 12mil RO4360G2 core substrate. The balanced copper and dielectric structure delivers stable thermal expansion performance and maintains consistent dielectric properties during assembly and long-term operation.

PCB Statistic

This RF PCB is designed for compact communication circuit layouts, with component placement optimized for small cell and power amplifier applications. T

About Rogers RO4360G2 Material

RO4360G2 is a glass-reinforced, hydrocarbon ceramic-filled thermoset laminate developed by Rogers. It delivers a balanced combination of high-frequency performance and manufacturability, standing out as the first high-Dk thermoset laminate that supports FR-4-like processing. The material supports lead-free assembly processes and provides improved rigidity for reliable multilayer fabrication, effectively lowering overall material and manufacturing costs. It can be freely matched with RO440 series prepregs and other low-Dk RO4000 series laminates to meet diverse multilayer RF design requirements.

RO4360G2 Properties

Product Benefits

The unique material properties and process compatibility of RO4360G2 bring practical advantages for commercial RF communication production and design:

Greater design flexibility for compact high-Dk RF circuit layouts, suitable for miniaturized communication devices

Stable plated through-hole performance, reducing failure risks during long-term high-power operation

Fully compatible with automated assembly lines, improving production efficiency for mass manufacturing

Supports lead-free processing, meeting global environmental and industrial assembly standards

Cost-effective material solution with stable supply chains and shorter lead times compared to traditional high-frequency substrates

Typical Applications

This 2-layer RO4360G2 PCB is targeted at commercial wireless communication infrastructure scenarios that demand stable high-frequency performance and cost efficiency:

• Base Station Power Amplifiers
• Small Cell Transceivers

Conclusion

This custom Rogers RO4360G2 rigid PCB offers reliable high-frequency performance for cellular communication infrastructure projects. Combining high dielectric constant, low signal loss and copper-matched thermal expansion properties, the board delivers stable electrical output for power amplifier and small cell transceiver applications. Process-compatible with standard FR-4 workflows and certified to IPC-Class-2 standards, every board passes full electrical testing before delivery. We support worldwide shipping and provide customized RO4360G2 PCB prototyping and mass production services for RF communication clients.