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Bicheng Electronics Technology Co., Ltd Factory Tour

All Products

RF PCB Board
(354)

Rogers PCB Board
(243)

Taconic PCB
(21)

PTFE PCB Board
(16)

F4B PCB
(38)

Multilayer PCB
(65)

Hybrid PCB
(36)

HDI PCB Board
(14)

High Speed PCB
(37)

FR 4 PCB Board
(51)

Custom PCBs
(110)

Certification

Customer Reviews

Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Production Line OEM/ODM

1 2 3 4 5 6 7 8 9 10 11

Automatic Film Adding Line

Automatic Film-Stick Equipment

Hole Verifier

Inner Layer Brown Oxidation

Lamination Equipment

Laser Direct Image (LDI)

Pattern Plating

PCB Grinding Machine

PCB Inspection

PCB Pattern Developing

Solder Mask Pre-disposal Machine

Automatic Film Adding Line

Automatic Film Adding Line

Automatic Film-Stick Equipment

Automatic Film-Stick Equipment

Hole Verifier

Hole Verifier

Inner Layer Brown Oxidation

Inner Layer Brown Oxidation

Lamination Equipment

Lamination Equipment

Laser Direct Image (LDI)

Laser Direct Image (LDI)

Pattern Plating

Pattern Plating

PCB Grinding Machine

PCB Grinding Machine

PCB Inspection

PCB Inspection

PCB Pattern Developing

PCB Pattern Developing

Solder Mask Pre-disposal Machine

Solder Mask Pre-disposal Machine

1 2

Production Line

Bicheng Electronics operates two major production bases, strategically located in Shenzhen and Jiangmen.

The Shenzhen factory employs over 300 staff and has a monthly output exceeding 10,000 square meters of PCBs. As a brand-new facility, it specializes in quick-turn prototypes and small-volume production.

The Jiangmen factory features two new industrial buildings spanning approximately 15,000 square meters, specifically designed for mass production. Equipped with state-of-the-art automated machinery sourced from Israel, Japan, Germany, and Taiwan, the Jiangmen facility produces up to 30,000 square meters per month for 2- to 10-layer PCBs. The establishment of this plant has significantly strengthened Bicheng’s capacity to supply high-end PCBs to both domestic and global markets.

With a strong and diverse product portfolio, Bicheng serves customers worldwide. Our offerings include multi-layer boards (up to 32 layers), flex-rigid combinations, heavy copper PCBs, high-frequency and high-speed boards, and HDI, among other types.

We are committed to becoming a leading diversified PCB supplier known for precision-engineered products. Our mission is to create lasting value for our customers while building a promising future for our employees.
OEM/ODM
About Us

We are a service-oriented company specializing in PCB fabrication and PCBA delivery. Our core team has over 20 years of industry experience, with in-depth knowledge of manufacturing processes for multi-layer PCBs, HDI boards, rigid-flex boards, high-frequency and high-speed boards.

We do not provide PCB design services. Our expertise lies in efficiently and reliably transforming customer-provided design files (Gerber, BOM, pick-and-place files, etc.) into manufacturable, high-quality products.

Our Services

OEM Manufacturing

With complete design files provided by customers, we manage the entire PCB fabrication and PCBA process:

DFM Review: Engineering validation of Gerber files before production—checking trace width and spacing, hole sizes, stack-up structure, impedance control, and other critical parameters to identify and resolve manufacturing risks early.

Production Resource Matching: Optimal production line allocation based on layer count, material type (FR4, high-frequency materials, metal-core, etc.), surface finish requirements (ENIG, OSP, HASL, etc.), and delivery schedule.

End-to-End Quality Control: Full-process monitoring from material cutting, lamination, drilling, and plating to solder mask, surface finishing, profiling, and electrical testing. Mandatory inspection hold points at critical stages, with 100% electrical testing on finished boards.

PCBA Assembly: Component sourcing, SMT placement, DIP insertion, AOI inspection, X-Ray inspection, ICT testing, functional testing (per customer requirements), assembly, and packaging.

Supply Chain Integration

Leveraging long-established supply chain partnerships, we offer:

Component Sourcing: BOM kitting services through reliable component channels, reducing customers' administrative costs of fragmented procurement.

Flexible Capacity Coordination: Agile capacity deployment across multiple manufacturing partners based on order volume, process complexity, and delivery urgency to ensure on-time delivery.

Cost Optimization Recommendations: Reference suggestions on material alternatives, panelization optimization, and surface finish selection to reduce costs without altering the original design.

Quality System

All manufacturing partners are certified with:
- ISO 9001 Quality Management System
- IATF 16949 Automotive Quality Management
- ISO 13485 Medical Devices Quality Management
- UL Safety Certification
All products are RoHS and REACH compliant.

Each shipment includes a complete inspection report (impedance test, solderability test, cross-section analysis, etc.) with full traceability.

PCB Pattern Plating

PCB Washing

Developing

R&D

Design For Manufacture

Serial NO.	Procedure	Item	Manufacturing capability
			Large volume （S<100 m²）	Middle volume （S<10 m²）	Prototype（S<1m²）
			Large volume （S<100 m²）	Middle volume （S<10 m²）	Prototype（S<1m²）
1	Inner layer (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )	Min.isolation of layers	0.1mm	0.1mm	0.06mm
2		Min.track and spacing	5/5mil(18um)	4/4mil(18um)	3/3.5mil(18um)
3			5/5mil(35um)	4/4mil(35um)	3/4mil(35um)
4			7/9mil(70um)	6/8mil(70um)	6/7mil(70um)
5			9/11mil(105um)	8/10mil(105um)	8/9mil(105um)
6			13/13mil(140um)	12/12mil(140um)	12/11mil(140um)
7		Min.distance from drill to conductor	4 Layer 10mil，6 layer 10mil，8-12 layer 12mil	4 layer 8mil，6 layer 8mil，8-12 layer 10mil，14-20 layer 14mil，22-32 layer 18mil	4 layer 6mil，6 layer 6mil，8-14 layer 8mil，16-22 layer 12mil，24-32 layer 14mil
8		Min.width of annular ring on inner layer	4 Layer 10mil（35um），≥6 Layer 14mil（35um）	4 Layer 8mil(35um)，≥6 layer 12mil（35um）	4 Layer 6mil（35um），≥6 Layer 10mil（35um）
9		Inner layer isolation ring width(Min)	10mil （35um）	8mil （35um）	6mil （35um）
10		Min.via pad diameter	20mil （35um）	16mil （35um）	16mil （35um）
11		Min. distance from board edge to conductor(no copper exposured)(inner layer)	14 mil（35um）	12 mil（35um））	8 mil（35um）
12		Maximum copper weight(Inner layer and outer layer)	3 OZ( 105 um )	4 OZ ( 140 um )	6 OZ( 210 um )
13		Core with different copper foil on both sides	/	18/35,35/70 um	18/35,35/70 um
14	Laminating	Tolerance of laminate thickness	±10% PCB thick	±10% PCB thick	±8% PCB thick
15		Maximum laminate thickness	4.0mm	6.0mm	7.0mm
16		Laminate alignment accuracy	≤±5 mil	≤±4 mil	≤±4 mil
17	Drill (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )	Min.drill bit diameter	0.2 mm	0.2 mm	0.2 mm
18		Min.slot router diameter	0.60 mm	0.60 mm	0.60 mm
19		Min.tolerance of PTH slots	±0.15mm	±0.15mm	±0.1mm
20		Max.aspect ratio	1:08	1:12	1:12
21		Hole tolerance	±3mil	±3mil	±3mil
22		Space of via to via	6mil(same net)，12mil(different net)	6mil(same net)，14mil(different net)	4mil(same net)，12mil(different net)
23		Space of component hole to component hole	12mil(same net)，16mil(different net)	12mil(same net)，16mil(different net)	10mil(same net)，14mil(different net)
24	Etching	Min.width of etching logo	10mil(18um)，12 mil (35um)，12 mil(70um）	8mil(18um)，10mil(35um)，12 mil(70um）	6mil(18um)，8 mil(35um)，12mil(70um）
25	Etching	Etch factor	1.6-2.2	1.6-2.2	1.6-2.2
26	Outer layer(18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )	Min.via pad diameter	20mil	16mil	16mil
27		Min.BGA pad diameter	12mil	12mil	10mil
28		Min.track and spacing	5/5mil(18um)	4/4mil(18um)	3/3.5mil(18um)
			5/5mil(35um)	4/4mil(35um)	3/4mil(35um)
			7/9mil(70um)	6/8mil(70um)	6/7mil(70um)
			9/11mil(105um)	8/10mil(105um)	8/9mil(105um)
			13/13mil(140um)	12/12mil(140um)	12/11mil(140um)
29		Minimum grid	10/10mil(35um)	8/8mil(35um)	4/8mil(35um)
30		Min.space (conductor to pad, pad to pad)	6mil(18um)	5mil(18um)	4mil(18um)
			6mil(35um)	5mil(35um)	4mil(35um)
			9mil(70um)	8mil(70um)	7mil(70um)
			11mil(105um)	10mil(105um)	9mil(105um)
			13mil(140um)	12mil(140um)	11mil(140um)
31	Solder mask (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )	Maximum via-plug diameter	0.5mm	0.5mm	0.5mm
32		Min.width of solder mask bridge	Green:5mil（35um）	Green:4mil（35um）	Green:4mil（35um）
33			Yellow：5mil（35um）	Yellow：4mil（35um）	Yellow：4mil（35um）
34			Blue：5mil（35um）	Blue：4mil（35um）	Blue：4mil（35um）
35			Black：6mil（35um）	Black：6mil（35um）	Black：6mil（35um）
36			White:6mil（35um）	White:6mil（35um）	White:6mil（35um）
37			All of Matt：6mil	All of Matt：6mil	All of Matt：6mil
38			Green:5mil（70um）	Green:4mil（70um）	Green:4mil（70um）
39			Yellow：5mil（70um）	Yellow：4mil（70um）	Yellow：4mil（70um）
40			Blue：5mil（70um）	Blue：4mil（70um）	Blue：4mil（70um）
41			Black：6mil（70um）	Black：6mil（70um）	Black：6mil（70um）
42			White:6mil（70um）	White:6mil（70um）	White:6mil（70um）
43		Open solder mask	4mil(35um)	4mil(35um)	3mil(35um)
44		Solder mask coverage	4mil(35um)	4mil(35um)	3mil(35um)
45		Min.width of solder mask text	9mil(35um)	9mil(35um)	8mil(35um)
46		Min.thickness of Solder mask	9um(35um)	9um(35um)	9um(35um)
47		Max.thickness of solder mask	30um(35um)	30um(35um)	30um(35um)
48	Silkscreen	Min.width of silkscreen text	6mil	6mil	5mil
49		Min.height of silkscreen text	35mil	35mil	30mil
50		Min.space from silkscreen to pads	6mil	6mil	5mil
51		Colour of silkscreen	White, Black, Yellow
52	Carbon ink	Carbon ink covers conductor or pads	14mil	13mil	12mil
53	Carbon ink	Mid distance from carbon ink to pads	12mil	11mil

Contact Details

Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Bicheng Electronics Technology Co., Ltd Factory Tour

RF PCB Board

Rogers PCB Board

Taconic PCB

PTFE PCB Board

F4B PCB

Multilayer PCB

Hybrid PCB

HDI PCB Board

High Speed PCB

FR 4 PCB Board

Custom PCBs

Rogers PCB Board

4 Layer 2oz Rogers 4003C Multi Layer PCB High Frequency For Automotive Radar

Microwave Rogers RT / Duroid 6010LM Rogers PCB Board ceramic PTFE composites

Rogers RT/Duroid 5880 PCB High Frequency 15mil 1 Oz Copper PCB For Millimeter Wave Applications

Dual Layer Flexible PCB Built on Polyimide With Immersion Gold and PI Stiffener

5mil Thick WL-CT300 PCB 2-layer Black Silkscreen Pure Gold Plating

2 Layer Flexible PCB Built On Polyimide with Stiffener On the Tail for Tablet Computer Battery