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           Automatic Film Adding Line
Automatic Film-Stick Equipment
Hole Verifier
Inner Layer Brown Oxidation
Lamination Equipment
Laser Direct Image (LDI)
Pattern Plating
PCB Grinding Machine
PCB Inspection
PCB Pattern Developing
Solder Mask Pre-disposal Machine
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Automatic Film Adding Line Automatic Film Adding Line |
Automatic Film-Stick Equipment Automatic Film-Stick Equipment |
Hole Verifier Hole Verifier |
Inner Layer Brown Oxidation Inner Layer Brown Oxidation |
Lamination Equipment Lamination Equipment |
Laser Direct Image (LDI) Laser Direct Image (LDI) |
Pattern Plating Pattern Plating |
PCB Grinding Machine PCB Grinding Machine |
PCB Inspection PCB Inspection |
PCB Pattern Developing PCB Pattern Developing |
Solder Mask Pre-disposal Machine Solder Mask Pre-disposal Machine |
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          2 layer Flex FPC
2 oz Flex PCB
Antenna Flexible PCB
Assembled Flexible PCB
Dual Layer FPC
FPC strips
Heavy Copper Flex PCB
Insole FLEX FPC
Rigid Flex PCB
Sensor FPC
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2 layer Flex FPC Bicheng Electronics Technology is committed to supplying high quality FPC which includes single layer, double layer, multilayer and flex-rigid board, prototype and mass production. |
2 oz Flex PCB Common foil thicknesses for flexible circuits are 17.5, 35, 70 and 105 μm (0.5, 1, 2 and 3 oz.) in our house. |
Antenna Flexible PCB Antenna FPC Layer Count: Single layer Thickness: 0.13mm Material: Polyimide RA copper with adhesive Copper: 1oz Surface finish: Immersion gold Thickness of PI Stiffener: 0.2mm Others: 3M Tape |
Assembled Flexible PCB We provide one-stop service for FPC production, component sourcing and SMD assembly for 17 years, welcomes your patronage. |
Dual Layer FPC Bicheng is committed to supplying Flexible Printed Circuits (FPC) which includes single layer, double layer, multilayer and flex-rigid board, prototype and mass production. Welcome your patronage. |
FPC strips Ask: How longest is your flexible PCB? Answer: 2000 milimeters or 2 meters. |
Heavy Copper Flex PCB The common foil thicknesses for flexible circuits are 17.5, 35, 70, 105μm (0.5, 1, 2, 3 oz.) in our house. |
Insole FLEX FPC Double Sided FPC for Insole Sports 290 x 198mm=1pcs Polyimide, RA copper 1oz copper Yellow coverlay | white overlay Surface finish Ni/Au 0.2mm thick with FR-4 stiffener |
Rigid Flex PCB A rigid-flex PCB is a combination of rigid boards and flexible circuits, the latter creating flexible inter-connects between the rigid boards to which they are laminated by means of bond plies. Both ends are rigid board, flexible circuit is in the middle. |
Sensor FPC Bicheng is committed to supplying Flexible Printed Circuits (FPC) which includes single layer, double layer, multilayer and flex-rigid board, 1oz, 2oz, 3oz, prototype and mass production. Welcome your patronage. |
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            8oz Aluminum PCB
Copper PCB
2 Layer Aluminum PCB
F4B DK2.65 High Frequency PCB
Hybrid PCB RO4003C and FR-4 Combined
RT-35TC High Frequency PCB
RO4003C High Frequency PCB
Mixed PCB on RO4350B and FR-4
RT/duroid 5870 RF PCB
RT/duroid 5880 RF PCB
RT/duroid 6006 High Frequency PCB
TLX-8 High Frequency PCB
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8oz Aluminum PCB Heavy copper PCBs are made on thick copper foil and super-thick copper foil. This thickness can be as thick as 105 μm (≥ 3 oz) ~ 350 μm (≥ 10 oz). Heavy copper PCBs are mostly the high current substrates. They have two major applications: 1. Power Supply Module: Portable electronic products, network products, base station equipment, etc. 2. Automotive Electronic Components: Industrial control, power modules, etc. |
Copper PCB Copper based PCB is one of the most expensive metal circuit board, the thermal conductivity is much better than aluminum substrate and iron substrate, suitable for high frequency circuit, the areas of high and low temperature change and heat dissipation of precision communication equipment. |
2 Layer Aluminum PCB The role of MCPCB is to quickly transfer the heat generated by high power electronic component and devices to ensure the high power electronic parts and devices running stable and reliable. |
F4B DK2.65 High Frequency PCB F4B is a series of PTFE based high frequency materials which is a brand of China. It has advantages on price and quality in the application of navigation, radar, satellite communication, 4G communications, 5G communications and the like. |
Hybrid PCB RO4003C and FR-4 Combined Hybrid PCB is good way for COST reduction over stack-ups with all low loss material. Its signal integrity performance is improved than FR-4 board and signal loss is reduced at high frequency as well. |
RT-35TC High Frequency PCB RF-35TC PCB is woven matrix of fiberglass fabric coated with ceramic filled PTFE circuit board. Its special ceramic filler technique makes a low dissipation factor with high thermal conductivity possible. It is suited for high power applications. Such as 1. Aerospace components 2. Antennas 3. High-end power amplifiers. 4. High power broadcast systems 5. Power dividers, filters and couplers |
RO4003C High Frequency PCB RO4003C PCBs are hydrocarbon ceramic filled laminates, not PTFE which are designed to offer superior high frequency performance. The typical applications are 1. Automotive Radar and Sensors 2. Cellular Base Station Antennas and Power Amplifiers 3. LNB’s for Direct Broadcast Satellites 4. RF filters 5. RF Identification Tags |
Mixed PCB on RO4350B and FR-4 Hybrid PCB is good way for COST reduction over stack-ups with all low loss material. Its signal integrity performance is improved than FR-4 board and signal loss is reduced at high frequency as well. |
RT/duroid 5870 RF PCB RT/duroid 5870 High Frequency PCBs are glass microfiber reinforced PTFE circuit boards which are designed for exacting stripline and microstrip circuit applications. They are typically used in Commercial Airline Broadband Antennas, Millimeter Wave Applications and Radar Systems etc. |
RT/duroid 5880 RF PCB RT/duroid 5880 RF microwave PCBs are glass microfiber reinforced PTFE printed circuit boards .They are designed for exacting stripline and microstrip circuit applications. Some typical applications： Guidance Systems Millimeter Wave Applications Point to Point Digital Radio Antennas Radar Systems |
RT/duroid 6006 High Frequency PCB RT/duroid 6006 high frequency PCBs are built on ceramicPTFE composites. They are available with a tight dielectric constant value of 6.15. Rogers 6006 PCBs have good thermal mechanical stability, low moisture absorption and tight thickness control. Some Typical Applications: 1. Aircraft Collision Avoidance Systems 2. Ground Radar Warning Systems 3. Patch Antennas 4. Power Amplifiers 5. Satellite Communications Systems |
TLX-8 High Frequency PCB TLX-8 PCBs are PTFE fiberglass circuit boards which are ideal for use in radar systems, mobile communications, microwave test equipment, microwave transmission devices and RF components. It is suitable for low layer count microwave designs. |
Bicheng Electronics has two major production bases where are located in Shenzhen and Jiangmen. Shenzhen factory has over 300 employees and output PCB more than 10000 square meters per month. The Shenzhen factory is a brand new focusing on quick turn, prototype and small volume production.
The Jiangmen factory has two new industrial buildings that cover about 15,000 square meters, designed for mass production volumes. Brand new automated equipments are introduced from Israel, Japan, German, and Taiwan area. The output of Jiangmen factory for 2-10 layers is up to 30000 square meter per month. The foundation of Jiangmen facility increases our ability to supply high-end PCBs domestically and worldwide.
Our business is facing worldwide. Bicheng has strong and diverse PCB products, covering multi-layer boards up to 32 layers, flex-rigid combination, heavy copper, high frequency high speed, HDI and other types.
We’re committed to become a leading diversified PCB supplier, with precision products, Creating value for customers and create the future for staff.
PCB Pattern Plating
PCB Washing
Developing
Design For Manufacture
| Serial NO. | Procedure | Item | Manufacturing capability | ||
| Large volume （S<100 m²） | Middle volume （S<10 m²） | Prototype（S<1m²） | |||
| 1 | Inner layer (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) | Min.isolation of layers | 0.1mm | 0.1mm | 0.06mm |
| 2 | Min.track and spacing | 5/5mil(18um) | 4/4mil(18um) | 3/3.5mil(18um) | |
| 3 | 5/5mil(35um) | 4/4mil(35um) | 3/4mil(35um) | ||
| 4 | 7/9mil(70um) | 6/8mil(70um) | 6/7mil(70um) | ||
| 5 | 9/11mil(105um) | 8/10mil(105um) | 8/9mil(105um) | ||
| 6 | 13/13mil(140um) | 12/12mil(140um) | 12/11mil(140um) | ||
| 7 | Min.distance from drill to conductor | 4 Layer 10mil，6 layer 10mil，8-12 layer 12mil | 4 layer 8mil，6 layer 8mil，8-12 layer 10mil，14-20 layer 14mil，22-32 layer 18mil | 4 layer 6mil，6 layer 6mil，8-14 layer 8mil，16-22 layer 12mil，24-32 layer 14mil | |
| 8 | Min.width of annular ring on inner layer | 4 Layer 10mil（35um），≥6 Layer 14mil（35um） | 4 Layer 8mil(35um)，≥6 layer 12mil（35um） | 4 Layer 6mil（35um），≥6 Layer 10mil（35um） | |
| 9 | Inner layer isolation ring width(Min) | 10mil （35um） | 8mil （35um） | 6mil （35um） | |
| 10 | Min.via pad diameter | 20mil （35um） | 16mil （35um） | 16mil （35um） | |
| 11 | Min. distance from board edge to conductor(no copper exposured)(inner layer) | 14 mil（35um） | 12 mil（35um）） | 8 mil（35um） | |
| 12 | Maximum copper weight(Inner layer and outer layer) | 3 OZ( 105 um ) | 4 OZ ( 140 um ) | 6 OZ( 210 um ) | |
| 13 | Core with different copper foil on both sides | / | 18/35,35/70 um | 18/35,35/70 um | |
| 14 | Laminating | Tolerance of laminate thickness | ±10% PCB thick | ±10% PCB thick | ±8% PCB thick |
| 15 | Maximum laminate thickness | 4.0mm | 6.0mm | 7.0mm | |
| 16 | Laminate alignment accuracy | ≤±5 mil | ≤±4 mil | ≤±4 mil | |
| 17 | Drill (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) | Min.drill bit diameter | 0.2 mm | 0.2 mm | 0.2 mm |
| 18 | Min.slot router diameter | 0.60 mm | 0.60 mm | 0.60 mm | |
| 19 | Min.tolerance of PTH slots | ±0.15mm | ±0.15mm | ±0.1mm | |
| 20 | Max.aspect ratio | 1:08 | 1:12 | 1:12 | |
| 21 | Hole tolerance | ±3mil | ±3mil | ±3mil | |
| 22 | Space of via to via | 6mil(same net)，12mil(different net) | 6mil(same net)，14mil(different net) | 4mil(same net)，12mil(different net) | |
| 23 | Space of component hole to component hole | 12mil(same net)，16mil(different net) | 12mil(same net)，16mil(different net) | 10mil(same net)，14mil(different net) | |
| 24 | Etching | Min.width of etching logo | 10mil(18um)，12 mil (35um)，12 mil(70um） | 8mil(18um)，10mil(35um)，12 mil(70um） | 6mil(18um)，8 mil(35um)，12mil(70um） |
| 25 | Etch factor | 1.6-2.2 | 1.6-2.2 | 1.6-2.2 | |
| 26 | Outer layer(18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) | Min.via pad diameter | 20mil | 16mil | 16mil |
| 27 | Min.BGA pad diameter | 12mil | 12mil | 10mil | |
| 28 | Min.track and spacing | 5/5mil(18um) | 4/4mil(18um) | 3/3.5mil(18um) | |
| 5/5mil(35um) | 4/4mil(35um) | 3/4mil(35um) | |||
| 7/9mil(70um) | 6/8mil(70um) | 6/7mil(70um) | |||
| 9/11mil(105um) | 8/10mil(105um) | 8/9mil(105um) | |||
| 13/13mil(140um) | 12/12mil(140um) | 12/11mil(140um) | |||
| 29 | Minimum grid | 10/10mil(35um) | 8/8mil(35um) | 4/8mil(35um) | |
| 30 | Min.space (conductor to pad, pad to pad) | 6mil(18um) | 5mil(18um) | 4mil(18um) | |
| 6mil(35um) | 5mil(35um) | 4mil(35um) | |||
| 9mil(70um) | 8mil(70um) | 7mil(70um) | |||
| 11mil(105um) | 10mil(105um) | 9mil(105um) | |||
| 13mil(140um) | 12mil(140um) | 11mil(140um) | |||
| 31 | Solder mask (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) | Maximum via-plug diameter | 0.5mm | 0.5mm | 0.5mm |
| 32 | Min.width of solder mask bridge | Green:5mil（35um） | Green:4mil（35um） | Green:4mil（35um） | |
| 33 | Yellow：5mil（35um） | Yellow：4mil（35um） | Yellow：4mil（35um） | ||
| 34 | Blue：5mil（35um） | Blue：4mil（35um） | Blue：4mil（35um） | ||
| 35 | Black：6mil（35um） | Black：6mil（35um） | Black：6mil（35um） | ||
| 36 | White:6mil（35um） | White:6mil（35um） | White:6mil（35um） | ||
| 37 | All of Matt：6mil | All of Matt：6mil | All of Matt：6mil | ||
| 38 | Green:5mil（70um） | Green:4mil（70um） | Green:4mil（70um） | ||
| 39 | Yellow：5mil（70um） | Yellow：4mil（70um） | Yellow：4mil（70um） | ||
| 40 | Blue：5mil（70um） | Blue：4mil（70um） | Blue：4mil（70um） | ||
| 41 | Black：6mil（70um） | Black：6mil（70um） | Black：6mil（70um） | ||
| 42 | White:6mil（70um） | White:6mil（70um） | White:6mil（70um） | ||
| 43 | Open solder mask | 4mil(35um) | 4mil(35um) | 3mil(35um) | |
| 44 | Solder mask coverage | 4mil(35um) | 4mil(35um) | 3mil(35um) | |
| 45 | Min.width of solder mask text | 9mil(35um) | 9mil(35um) | 8mil(35um) | |
| 46 | Min.thickness of Solder mask | 9um(35um) | 9um(35um) | 9um(35um) | |
| 47 | Max.thickness of solder mask | 30um(35um) | 30um(35um) | 30um(35um) | |
| 48 | Silkscreen | Min.width of silkscreen text | 6mil | 6mil | 5mil |
| 49 | Min.height of silkscreen text | 35mil | 35mil | 30mil | |
| 50 | Min.space from silkscreen to pads | 6mil | 6mil | 5mil | |
| 51 | Colour of silkscreen | White, Black, Yellow | |||
| 52 | Carbon ink | Carbon ink covers conductor or pads | 14mil | 13mil | 12mil |
| 53 | Mid distance from carbon ink to pads | 12mil | 11mil | 10mil | |
| 54 | Peelable mask | Peelable mask covers conductor or pads | 8mil | 7mil | 6mil |
| 55 | Min.distance from peelable mask to pads | 14mil | 13mil | 12mil | |
| 56 | Max.via-plug of Silk-screen method | 2.0mm | 2.0mm | 2.0mm | |
| 57 | Max. via-plug of aluminum foil method | 4.5mm | 4.5mm | 4.5mm | |
| 58 | Surface finish | Thickness of nickel of ENIG | 3-5um | 3-5um | 2-6.35um |
| 59 | Thickness of Gold of ENIG | 0.05-0.1um | |||
| 60 | Thickness of nickel of Gold finger | 3-5um | |||
| 61 | Thickness of Gold of Gold finger | 0.1-1.27um | |||
| 62 | Thickness of tin of HASL | 2.54-6.35um | |||
| 63 | Thickness of OSP | 0.2-0.5um | |||
| 64 | Thickness of tin of Immersion tin | 0.2-0.75um | |||
| 65 | Thickness of silver of Immersion silver | 0.15-0.75um | |||
| 66 | Contour process | Method of contour process | CNC milling, V-CUT, Break-out tap, break-out holes, Punching | ||
| 67 | Minimum router | 0.8mm | |||
| 68 | Min.tolerance of contour | ±0.15mm | ±0.13mm | ±0.1mm | |
| 69 | Min.distance of milling contour(no copper exposure) | 12mil | 10mil | 8mil | |
| 70 | Angle of V-CUT | 20、30、45、60 ±5 degree | |||
| 71 | Degree of symmetry of V-CUT | ±6mil | ±5mil | ±4mil | |
| 72 | Tolerance of residual thickness of V-CUT | ±6mil | ±5mil | ±4mil | |
| 73 | Tolerance of Chamfer angle of Gold finger | ±5 degree | ±5 degree | ±5 degree | |
| 74 | Tolerance of residual thickness of bevel edge of gold finger | ±5mil | ±5mil | ±5mil | |
| 75 | Min radius of inner corner | 0.4mm | |||
| 76 | Min. distance from edge to V-Cut (no copper exposure) | 18mil (1.6mm Thick, 20 degree V-groove cutter) | 14mil(1.6mm Thick, 20 degree V-groove cutter) | 12mil (1.6mm Thick, 20 degree V-groove cutter) | |
| 77 | 20mil (1.6mm Thick, 30 degree V-groove cutter) | 18mil (1.6mm Thick, 30 degree V-groove cutter) | 16mil (1.6mm Thick, 30 degree V-groove cutter) | ||
| 78 | 24mil (1.6mm Thick, 45 degree V-groove cutter) | 22mil (1.6mm Thick, 45 degree V-groove cutter) | 20mil (1.6mm Thick, 45 degree V-groove cutter) | ||
| 79 | 30mil (1.6mm Thick, 60 degree V-groove cutter) | 28mil (1.6mm Thick, 60 degree V-groove cutter) | 26mil (1.6mm Thick, 60 degree V-groove cutter) | ||
| 80 | Special tolerance | Board thickness of flying probe test | 0.6-4.0mm | ||
| 81 | Panel size of flying probe test | Size≤900X600mm, Small size can be compensated through manufacturing procedure | |||
| 82 | Panel size of fixture test method | Size≤460X380mm, Small size can be compensated through manufacturing procedure | |||
| 83 | Board thickness of fixture test method | 0.4-6.0mm | |||
| 84 | Tolerance of press-fit hole | ±2mil | |||
| 85 | Tolerance of NPTH | ±2mil | |||
| 86 | Tolerance of PCB thickness | 1.0mm≥PCB thickness, Tolerance ±0.1mm；1.0mm≤PCB thickness, Tolerance ±10% | |||
| 87 | Tolerance of depth of countersunk hole | ±0.2mm | |||
| 88 | Depth tolerance of blind slot | ±0.2mm | |||
| 89 | Maximum shipment size | Size≤1200X600mm（Double side, no test required） | |||
| 90 | Size≤1000X600mm（ Multilayer, no test required） | ||||
| 91 | Minimum shipment size | 10X10mm | |||
| 92 | PCB thickness of HASL | 0.8-3.0mm(Hole less 0.5mm should be use via-plug or mask-tent ) | |||
| 93 | HASL PCB Size | Size≤600X460mm | |||
| 94 | PCB thickness | 0.15-7.0mm | |||
| 95 | Depth of V groove | 0.8-3.2mm | |||
| 96 | Distance of non-continuous v-groove | ≥7mm | |||
| 97 | Max. drill diameter | Size≤6.5mm (Counterbore or router will be used for holes more than 6.5mm, Min.tolerance ±0.1mm ） | |||
| 98 | Max. countersink diameter | Size≤6.5mm Countersink can be used counterbore drill or router） | |||
| 99 | Distance of Bevel | Size≥11mm | Size≥5mm | Size≥5mm | |
| 100 | Thickness of peelable mask | 0.2-1.5mm ±0.15mm | |||
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
