China Bicheng Electronics Technology Co., Ltd factory production line

Bicheng Electronics Technology Co., Ltd

We Are Your RF PCB Solution Provider!

Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB

ISO9001, ISO14001, IATF 16949 certified

AOI

Flexible PCB

ISO

LDI

Metal Core PCB

Microsection

RO3006 High Frequency PCB

PCB stackup

Workshop

Detail Information

Detail Description

Detail Information

Main Market:

North America , South America , Western Europe , Eastern Europe , Southeast Asia , Africa , Oceania , Worldwide

Business Type:

Manufacturer , Distributor/Wholesaler , Exporter , Seller

Brands:

Bicheng

No. of Employees:

350~450

Annual Sales:

10 million-18 million

Year Established:

2003

Export p.c:

80% - 90%

Detail Description

Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

Main Business & PCB Applications

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.The circuit boards are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

Main Material Partners

Bicheng Electronics Technology Co., Ltd factory production line 0

production line

Bicheng Electronics Technology Co., Ltd factory production line 0

Bicheng Electronics has two major production bases where are located in Shenzhen and Jiangmen. Shenzhen factory has over 300 employees and output PCB more than 10000 square meters per month. The Shenzhen factory is a brand new focusing on quick turn, prototype and small volume production.

The Jiangmen factory has two new industrial buildings that cover about 15,000 square meters, designed for mass production volumes. Brand new automated equipments are introduced from Israel, Japan, German, and Taiwan area. The output of Jiangmen factory for 2-10 layers is up to 30000 square meter per month. The foundation of Jiangmen facility increases our ability to supply high-end PCBs domestically and worldwide.

Our business is facing worldwide. Bicheng has strong and diverse PCB products, covering multi-layer boards up to 32 layers, flex-rigid combination, heavy copper, high frequency high speed, HDI and other types.

We’re committed to become a leading diversified PCB supplier, with precision products, Creating value for customers and create the future for staff.

oem/odm

PCB Pattern Plating

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PCB Washing

Bicheng Electronics Technology Co., Ltd factory production line 1

Developing

Bicheng Electronics Technology Co., Ltd factory production line 2

R&D

Design For Manufacture

Serial NO.	Procedure	Item	Manufacturing capability
			Large volume （S<100 m²）	Middle volume （S<10 m²）	Prototype（S<1m²）
			Large volume （S<100 m²）	Middle volume （S<10 m²）	Prototype（S<1m²）
1	Inner layer (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )	Min.isolation of layers	0.1mm	0.1mm	0.06mm
2		Min.track and spacing	5/5mil(18um)	4/4mil(18um)	3/3.5mil(18um)
3			5/5mil(35um)	4/4mil(35um)	3/4mil(35um)
4			7/9mil(70um)	6/8mil(70um)	6/7mil(70um)
5			9/11mil(105um)	8/10mil(105um)	8/9mil(105um)
6			13/13mil(140um)	12/12mil(140um)	12/11mil(140um)
7		Min.distance from drill to conductor	4 Layer 10mil，6 layer 10mil，8-12 layer 12mil	4 layer 8mil，6 layer 8mil，8-12 layer 10mil，14-20 layer 14mil，22-32 layer 18mil	4 layer 6mil，6 layer 6mil，8-14 layer 8mil，16-22 layer 12mil，24-32 layer 14mil
8		Min.width of annular ring on inner layer	4 Layer 10mil（35um），≥6 Layer 14mil（35um）	4 Layer 8mil(35um)，≥6 layer 12mil（35um）	4 Layer 6mil（35um），≥6 Layer 10mil（35um）
9		Inner layer isolation ring width(Min)	10mil （35um）	8mil （35um）	6mil （35um）
10		Min.via pad diameter	20mil （35um）	16mil （35um）	16mil （35um）
11		Min. distance from board edge to conductor(no copper exposured)(inner layer)	14 mil（35um）	12 mil（35um））	8 mil（35um）
12		Maximum copper weight(Inner layer and outer layer)	3 OZ( 105 um )	4 OZ ( 140 um )	6 OZ( 210 um )
13		Core with different copper foil on both sides	/	18/35,35/70 um	18/35,35/70 um
14	Laminating	Tolerance of laminate thickness	±10% PCB thick	±10% PCB thick	±8% PCB thick
15		Maximum laminate thickness	4.0mm	6.0mm	7.0mm
16		Laminate alignment accuracy	≤±5 mil	≤±4 mil	≤±4 mil
17	Drill (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )	Min.drill bit diameter	0.2 mm	0.2 mm	0.2 mm
18		Min.slot router diameter	0.60 mm	0.60 mm	0.60 mm
19		Min.tolerance of PTH slots	±0.15mm	±0.15mm	±0.1mm
20		Max.aspect ratio	1:08	1:12	1:12
21		Hole tolerance	±3mil	±3mil	±3mil
22		Space of via to via	6mil(same net)，12mil(different net)	6mil(same net)，14mil(different net)	4mil(same net)，12mil(different net)
23		Space of component hole to component hole	12mil(same net)，16mil(different net)	12mil(same net)，16mil(different net)	10mil(same net)，14mil(different net)
24	Etching	Min.width of etching logo	10mil(18um)，12 mil (35um)，12 mil(70um）	8mil(18um)，10mil(35um)，12 mil(70um）	6mil(18um)，8 mil(35um)，12mil(70um）
25	Etching	Etch factor	1.6-2.2	1.6-2.2	1.6-2.2
26	Outer layer(18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )	Min.via pad diameter	20mil	16mil	16mil
27		Min.BGA pad diameter	12mil	12mil	10mil
28		Min.track and spacing	5/5mil(18um)	4/4mil(18um)	3/3.5mil(18um)
			5/5mil(35um)	4/4mil(35um)	3/4mil(35um)
			7/9mil(70um)	6/8mil(70um)	6/7mil(70um)
			9/11mil(105um)	8/10mil(105um)	8/9mil(105um)
			13/13mil(140um)	12/12mil(140um)	12/11mil(140um)
29		Minimum grid	10/10mil(35um)	8/8mil(35um)	4/8mil(35um)
30		Min.space (conductor to pad, pad to pad)	6mil(18um)	5mil(18um)	4mil(18um)
			6mil(35um)	5mil(35um)	4mil(35um)
			9mil(70um)	8mil(70um)	7mil(70um)
			11mil(105um)	10mil(105um)	9mil(105um)
			13mil(140um)	12mil(140um)	11mil(140um)
31	Solder mask (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )	Maximum via-plug diameter	0.5mm	0.5mm	0.5mm
32		Min.width of solder mask bridge	Green:5mil（35um）	Green:4mil（35um）	Green:4mil（35um）
33			Yellow：5mil（35um）	Yellow：4mil（35um）	Yellow：4mil（35um）
34			Blue：5mil（35um）	Blue：4mil（35um）	Blue：4mil（35um）
35			Black：6mil（35um）	Black：6mil（35um）	Black：6mil（35um）
36			White:6mil（35um）	White:6mil（35um）	White:6mil（35um）
37			All of Matt：6mil	All of Matt：6mil	All of Matt：6mil
38			Green:5mil（70um）	Green:4mil（70um）	Green:4mil（70um）
39			Yellow：5mil（70um）	Yellow：4mil（70um）	Yellow：4mil（70um）
40			Blue：5mil（70um）	Blue：4mil（70um）	Blue：4mil（70um）
41			Black：6mil（70um）	Black：6mil（70um）	Black：6mil（70um）
42			White:6mil（70um）	White:6mil（70um）	White:6mil（70um）
43		Open solder mask	4mil(35um)	4mil(35um)	3mil(35um)
44		Solder mask coverage	4mil(35um)	4mil(35um)	3mil(35um)
45		Min.width of solder mask text	9mil(35um)	9mil(35um)	8mil(35um)
46		Min.thickness of Solder mask	9um(35um)	9um(35um)	9um(35um)
47		Max.thickness of solder mask	30um(35um)	30um(35um)	30um(35um)
48	Silkscreen	Min.width of silkscreen text	6mil	6mil	5mil
49		Min.height of silkscreen text	35mil	35mil	30mil
50		Min.space from silkscreen to pads	6mil	6mil	5mil
51		Colour of silkscreen	White, Black, Yellow
52	Carbon ink	Carbon ink covers conductor or pads	14mil	13mil	12mil
53	Carbon ink	Mid distance from carbon ink to pads	12mil	11mil	10mil
54	Peelable mask	Peelable mask covers conductor or pads	8mil	7mil	6mil
55		Min.distance from peelable mask to pads	14mil	13mil	12mil
56		Max.via-plug of Silk-screen method	2.0mm	2.0mm	2.0mm
57		Max. via-plug of aluminum foil method	4.5mm	4.5mm	4.5mm
58	Surface finish	Thickness of nickel of ENIG	3-5um	3-5um	2-6.35um
59		Thickness of Gold of ENIG	0.05-0.1um
60		Thickness of nickel of Gold finger	3-5um
61		Thickness of Gold of Gold finger	0.1-1.27um
62		Thickness of tin of HASL	2.54-6.35um
63		Thickness of OSP	0.2-0.5um
64		Thickness of tin of Immersion tin	0.2-0.75um
65		Thickness of silver of Immersion silver	0.15-0.75um
66	Contour process	Method of contour process	CNC milling, V-CUT, Break-out tap, break-out holes, Punching
67		Minimum router	0.8mm
68		Min.tolerance of contour	±0.15mm	±0.13mm	±0.1mm
69		Min.distance of milling contour(no copper exposure)	12mil	10mil	8mil
70		Angle of V-CUT	20、30、45、60 ±5 degree
71		Degree of symmetry of V-CUT	±6mil	±5mil	±4mil
72		Tolerance of residual thickness of V-CUT	±6mil	±5mil	±4mil
73		Tolerance of Chamfer angle of Gold finger	±5 degree	±5 degree	±5 degree
74		Tolerance of residual thickness of bevel edge of gold finger	±5mil	±5mil	±5mil
75		Min radius of inner corner	0.4mm
76		Min. distance from edge to V-Cut (no copper exposure)	18mil (1.6mm Thick, 20 degree V-groove cutter)	14mil(1.6mm Thick, 20 degree V-groove cutter)	12mil (1.6mm Thick, 20 degree V-groove cutter)
77			20mil (1.6mm Thick, 30 degree V-groove cutter)	18mil (1.6mm Thick, 30 degree V-groove cutter)	16mil (1.6mm Thick, 30 degree V-groove cutter)
78			24mil (1.6mm Thick, 45 degree V-groove cutter)	22mil (1.6mm Thick, 45 degree V-groove cutter)	20mil (1.6mm Thick, 45 degree V-groove cutter)
79			30mil (1.6mm Thick, 60 degree V-groove cutter)	28mil (1.6mm Thick, 60 degree V-groove cutter)	26mil (1.6mm Thick, 60 degree V-groove cutter)
80	Special tolerance	Board thickness of flying probe test	0.6-4.0mm
81		Panel size of flying probe test	Size≤900X600mm, Small size can be compensated through manufacturing procedure
82		Panel size of fixture test method	Size≤460X380mm, Small size can be compensated through manufacturing procedure
83		Board thickness of fixture test method	0.4-6.0mm
84		Tolerance of press-fit hole	±2mil
85		Tolerance of NPTH	±2mil
86		Tolerance of PCB thickness	1.0mm≥PCB thickness, Tolerance ±0.1mm；1.0mm≤PCB thickness, Tolerance ±10%
87		Tolerance of depth of countersunk hole	±0.2mm
88		Depth tolerance of blind slot	±0.2mm
89		Maximum shipment size	Size≤1200X600mm（Double side, no test required）
90		Maximum shipment size	Size≤1000X600mm（ Multilayer, no test required）
91		Minimum shipment size	10X10mm
92		PCB thickness of HASL	0.8-3.0mm(Hole less 0.5mm should be use via-plug or mask-tent )
93		HASL PCB Size	Size≤600X460mm
94		PCB thickness	0.15-7.0mm
95		Depth of V groove	0.8-3.2mm
96		Distance of non-continuous v-groove	≥7mm
97		Max. drill diameter	Size≤6.5mm (Counterbore or router will be used for holes more than 6.5mm, Min.tolerance ±0.1mm ）
98		Max. countersink diameter	Size≤6.5mm Countersink can be used counterbore drill or router）
99		Distance of Bevel	Size≥11mm	Size≥5mm	Size≥5mm
100		Thickness of peelable mask	0.2-1.5mm ±0.15mm

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