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Bicheng Electronics Technology Co., Ltd Factory Tour

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Customer Reviews
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd
Automatic Film Adding Line
Automatic Film-Stick Equipment
Hole Verifier
Inner Layer Brown Oxidation
Lamination Equipment
Laser Direct Image (LDI)
Pattern Plating
PCB Grinding Machine
PCB Inspection
PCB Pattern Developing
Solder Mask Pre-disposal Machine

Automatic Film Adding Line

Automatic Film Adding Line

Automatic Film-Stick Equipment

Automatic Film-Stick Equipment

Hole Verifier

Hole Verifier

Inner Layer Brown Oxidation

Inner Layer Brown Oxidation

Lamination Equipment

Lamination Equipment

Laser Direct Image (LDI)

Laser Direct Image (LDI)

Pattern Plating

Pattern Plating

PCB Grinding Machine

PCB Grinding Machine

PCB Inspection

PCB Inspection

PCB Pattern Developing

PCB Pattern Developing

Solder Mask Pre-disposal Machine

Solder Mask Pre-disposal Machine

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Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd
2 layer Flex FPC
2 oz Flex PCB
Antenna Flexible PCB
Assembled Flexible PCB
Dual Layer FPC
FPC strips
Heavy Copper Flex PCB
Insole FLEX FPC
Rigid Flex PCB
Sensor FPC

2 layer Flex FPC

Bicheng Electronics Technology is committed to supplying high quality FPC which includes single layer, double layer, multilayer and flex-rigid board, prototype and mass production.

2 oz Flex PCB

Common foil thicknesses for flexible circuits are 17.5, 35, 70 and 105 μm (0.5, 1, 2 and 3 oz.) in our house.

Antenna Flexible PCB

Antenna FPC Layer Count: Single layer Thickness: 0.13mm Material: Polyimide RA copper with adhesive Copper: 1oz Surface finish: Immersion gold Thickness of PI Stiffener: 0.2mm Others: 3M Tape

Assembled Flexible PCB

We provide one-stop service for FPC production, component sourcing and SMD assembly for 17 years, welcomes your patronage.

Dual Layer FPC

Bicheng is committed to supplying Flexible Printed Circuits (FPC) which includes single layer, double layer, multilayer and flex-rigid board, prototype and mass production. Welcome your patronage.

FPC strips

Ask: How longest is your flexible PCB? Answer: 2000 milimeters or 2 meters.

Heavy Copper Flex PCB

The common foil thicknesses for flexible circuits are 17.5, 35, 70, 105μm (0.5, 1, 2, 3 oz.) in our house.

Insole FLEX FPC

Double Sided FPC for Insole Sports 290 x 198mm=1pcs Polyimide, RA copper 1oz copper Yellow coverlay | white overlay Surface finish Ni/Au 0.2mm thick with FR-4 stiffener

Rigid Flex PCB

A rigid-flex PCB is a combination of rigid boards and flexible circuits, the latter creating flexible inter-connects between the rigid boards to which they are laminated by means of bond plies. Both ends are rigid board, flexible circuit is in the middle.

Sensor FPC

Bicheng is committed to supplying Flexible Printed Circuits (FPC) which includes single layer, double layer, multilayer and flex-rigid board, 1oz, 2oz, 3oz, prototype and mass production. Welcome your patronage.

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Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd Bicheng Electronics Technology Co., Ltd
8oz Aluminum PCB
Copper PCB
2 Layer Aluminum PCB
F4B DK2.65 High Frequency PCB
Hybrid PCB RO4003C and FR-4 Combined
RT-35TC High Frequency PCB
RO4003C High Frequency PCB
Mixed PCB on RO4350B and FR-4
RT/duroid 5870 RF PCB
RT/duroid 5880 RF PCB
RT/duroid 6006 High Frequency PCB
TLX-8 High Frequency PCB

8oz Aluminum PCB

Heavy copper PCBs are made on thick copper foil and super-thick copper foil. This thickness can be as thick as 105 μm (≥ 3 oz) ~ 350 μm (≥ 10 oz). Heavy copper PCBs are mostly the high current substrates. They have two major applications: 1. Power Supply Module: Portable electronic products, network products, base station equipment, etc. 2. Automotive Electronic Components: Industrial control, power modules, etc.

Copper PCB

Copper based PCB is one of the most expensive metal circuit board, the thermal conductivity is much better than aluminum substrate and iron substrate, suitable for high frequency circuit, the areas of high and low temperature change and heat dissipation of precision communication equipment.

2 Layer Aluminum PCB

The role of MCPCB is to quickly transfer the heat generated by high power electronic component and devices to ensure the high power electronic parts and devices running stable and reliable.

F4B DK2.65 High Frequency PCB

F4B is a series of PTFE based high frequency materials which is a brand of China. It has advantages on price and quality in the application of navigation, radar, satellite communication, 4G communications, 5G communications and the like.

Hybrid PCB RO4003C and FR-4 Combined

Hybrid PCB is good way for COST reduction over stack-ups with all low loss material. Its signal integrity performance is improved than FR-4 board and signal loss is reduced at high frequency as well.

RT-35TC High Frequency PCB

RF-35TC PCB is woven matrix of fiberglass fabric coated with ceramic filled PTFE circuit board. Its special ceramic filler technique makes a low dissipation factor with high thermal conductivity possible. It is suited for high power applications. Such as 1. Aerospace components 2. Antennas 3. High-end power amplifiers. 4. High power broadcast systems 5. Power dividers, filters and couplers

RO4003C High Frequency PCB

RO4003C PCBs are hydrocarbon ceramic filled laminates, not PTFE which are designed to offer superior high frequency performance. The typical applications are 1. Automotive Radar and Sensors 2. Cellular Base Station Antennas and Power Amplifiers 3. LNB’s for Direct Broadcast Satellites 4. RF filters 5. RF Identification Tags

Mixed PCB on RO4350B and FR-4

Hybrid PCB is good way for COST reduction over stack-ups with all low loss material. Its signal integrity performance is improved than FR-4 board and signal loss is reduced at high frequency as well.

RT/duroid 5870 RF PCB

RT/duroid 5870 High Frequency PCBs are glass microfiber reinforced PTFE circuit boards which are designed for exacting stripline and microstrip circuit applications. They are typically used in Commercial Airline Broadband Antennas, Millimeter Wave Applications and Radar Systems etc.

RT/duroid 5880 RF PCB

RT/duroid 5880 RF microwave PCBs are glass microfiber reinforced PTFE printed circuit boards .They are designed for exacting stripline and microstrip circuit applications. Some typical applications: Guidance Systems Millimeter Wave Applications Point to Point Digital Radio Antennas Radar Systems

RT/duroid 6006 High Frequency PCB

RT/duroid 6006 high frequency PCBs are built on ceramicPTFE composites. They are available with a tight dielectric constant value of 6.15. Rogers 6006 PCBs have good thermal mechanical stability, low moisture absorption and tight thickness control. Some Typical Applications: 1. Aircraft Collision Avoidance Systems 2. Ground Radar Warning Systems 3. Patch Antennas 4. Power Amplifiers 5. Satellite Communications Systems

TLX-8 High Frequency PCB

TLX-8 PCBs are PTFE fiberglass circuit boards which are ideal for use in radar systems, mobile communications, microwave test equipment, microwave transmission devices and RF components. It is suitable for low layer count microwave designs.

  • Production Line

    Bicheng Electronics Technology Co., Ltd factory production line 0

     

    Bicheng Electronics has two major production bases where are located in Shenzhen and Jiangmen. Shenzhen factory has over 300 employees and output PCB more than 10000 square meters per month. The Shenzhen factory is a brand new focusing on quick turn, prototype and small volume production.

     

    The Jiangmen factory has two new industrial buildings that cover about 15,000 square meters, designed for mass production volumes. Brand new automated equipments are introduced from Israel, Japan, German, and Taiwan area. The output of Jiangmen factory for 2-10 layers is up to 30000 square meter per month. The foundation of Jiangmen facility increases our ability to supply high-end PCBs domestically and worldwide.

     

    Our business is facing worldwide. Bicheng has strong and diverse PCB products, covering multi-layer boards up to 32 layers, flex-rigid combination, heavy copper, high frequency high speed, HDI and other types.

     

    We’re committed to become a leading diversified PCB supplier, with precision products, Creating value for customers and create the future for staff.

     

     

     

     

  • OEM/ODM

    PCB Pattern Plating

    Bicheng Electronics Technology Co., Ltd factory production line 0

     

     

    PCB Washing

    Bicheng Electronics Technology Co., Ltd factory production line 1

     

     

    Developing

    Bicheng Electronics Technology Co., Ltd factory production line 2

     

     

  • R&D

     

    Design For Manufacture

    Serial NO. Procedure Item Manufacturing capability
    Large volume S<100 m² Middle volume S<10 m² PrototypeS<1m²
    1 Inner layer (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.isolation of layers 0.1mm 0.1mm 0.06mm
    2 Min.track and spacing 5/5mil(18um) 4/4mil(18um) 3/3.5mil(18um)
    3 5/5mil(35um) 4/4mil(35um) 3/4mil(35um)
    4 7/9mil(70um) 6/8mil(70um) 6/7mil(70um)
    5 9/11mil(105um) 8/10mil(105um) 8/9mil(105um)
    6 13/13mil(140um) 12/12mil(140um) 12/11mil(140um)
    7 Min.distance from drill to conductor 4 Layer 10mil,6 layer 10mil,8-12 layer 12mil 4 layer 8mil6 layer 8mil8-12 layer 10mil14-20 layer 14mil22-32 layer 18mil 4 layer 6mil,6 layer 6mil,8-14 layer 8mil,16-22 layer 12mil,24-32 layer 14mil
    8 Min.width of annular ring on inner layer 4 Layer 10mil(35um),≥6 Layer 14mil(35um) 4 Layer 8mil(35um),≥6 layer 12mil(35um) 4 Layer 6mil(35um),≥6 Layer 10mil(35um)
    9 Inner layer isolation ring width(Min) 10mil (35um) 8mil (35um) 6mil (35um)
    10 Min.via pad diameter 20mil (35um) 16mil (35um) 16mil (35um)
    11 Min. distance from board edge to conductor(no copper exposured)(inner layer) 14 mil(35um) 12 mil(35um)) 8 mil(35um)
    12 Maximum copper weight(Inner layer and outer layer) 3 OZ( 105 um ) 4 OZ ( 140 um ) 6 OZ( 210 um )
    13 Core with different copper foil on both sides / 18/35,35/70 um 18/35,35/70 um
    14 Laminating Tolerance of laminate thickness ±10% PCB thick ±10% PCB thick ±8% PCB thick
    15 Maximum laminate thickness 4.0mm 6.0mm 7.0mm
    16 Laminate alignment accuracy ≤±5 mil ≤±4 mil ≤±4 mil
    17 Drill (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.drill bit diameter 0.2 mm 0.2 mm 0.2 mm
    18 Min.slot router diameter 0.60 mm 0.60 mm 0.60 mm
    19 Min.tolerance of PTH slots ±0.15mm ±0.15mm ±0.1mm
    20 Max.aspect ratio 1:08 1:12 1:12
    21 Hole tolerance ±3mil ±3mil ±3mil
    22 Space of via to via 6mil(same net),12mil(different net) 6mil(same net),14mil(different net) 4mil(same net),12mil(different net)
    23 Space of component hole to component hole 12mil(same net),16mil(different net) 12mil(same net),16mil(different net) 10mil(same net),14mil(different net)
    24 Etching Min.width of etching logo 10mil(18um),12 mil (35um),12 mil(70um) 8mil(18um),10mil(35um),12 mil(70um) 6mil(18um),8 mil(35um),12mil(70um)
    25 Etch factor 1.6-2.2 1.6-2.2 1.6-2.2
    26 Outer layer(18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.via pad diameter 20mil 16mil 16mil
    27 Min.BGA pad diameter 12mil 12mil 10mil
    28 Min.track and spacing 5/5mil(18um) 4/4mil(18um) 3/3.5mil(18um)
    5/5mil(35um) 4/4mil(35um) 3/4mil(35um)
    7/9mil(70um) 6/8mil(70um) 6/7mil(70um)
    9/11mil(105um) 8/10mil(105um) 8/9mil(105um)
    13/13mil(140um) 12/12mil(140um) 12/11mil(140um)
    29 Minimum grid 10/10mil(35um) 8/8mil(35um) 4/8mil(35um)
    30 Min.space (conductor to pad, pad to pad) 6mil(18um) 5mil(18um) 4mil(18um)
    6mil(35um) 5mil(35um) 4mil(35um)
    9mil(70um) 8mil(70um) 7mil(70um)
    11mil(105um) 10mil(105um) 9mil(105um)
    13mil(140um) 12mil(140um) 11mil(140um)
    31 Solder mask (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Maximum via-plug diameter 0.5mm 0.5mm 0.5mm
    32 Min.width of solder mask bridge Green:5mil(35um) Green:4mil(35um) Green:4mil(35um)
    33 Yellow:5mil(35um) Yellow:4mil(35um) Yellow:4mil(35um)
    34 Blue:5mil(35um) Blue:4mil(35um) Blue:4mil(35um)
    35 Black:6mil(35um) Black:6mil(35um) Black:6mil(35um)
    36 White:6mil(35um) White:6mil(35um) White:6mil(35um)
    37 All of Matt:6mil All of Matt:6mil All of Matt:6mil
    38 Green:5mil(70um) Green:4mil(70um) Green:4mil(70um)
    39 Yellow:5mil(70um) Yellow:4mil(70um) Yellow:4mil(70um)
    40 Blue:5mil(70um) Blue:4mil(70um) Blue:4mil(70um)
    41 Black:6mil(70um) Black:6mil(70um) Black:6mil(70um)
    42 White:6mil(70um) White:6mil(70um) White:6mil(70um)
    43 Open solder mask 4mil(35um) 4mil(35um) 3mil(35um)
    44 Solder mask coverage 4mil(35um) 4mil(35um) 3mil(35um)
    45 Min.width of solder mask text 9mil(35um) 9mil(35um) 8mil(35um)
    46 Min.thickness of Solder mask 9um(35um) 9um(35um) 9um(35um)
    47 Max.thickness of solder mask 30um(35um) 30um(35um) 30um(35um)
    48 Silkscreen Min.width of silkscreen text 6mil 6mil 5mil
    49 Min.height of silkscreen text 35mil 35mil 30mil
    50 Min.space from silkscreen to pads 6mil 6mil 5mil
    51 Colour of silkscreen White, Black, Yellow
    52 Carbon ink Carbon ink covers conductor or pads 14mil 13mil 12mil
    53 Mid distance from carbon ink to pads 12mil 11mil 10mil
    54 Peelable mask Peelable mask covers conductor or pads 8mil 7mil 6mil
    55 Min.distance from peelable mask to pads 14mil 13mil 12mil
    56 Max.via-plug of Silk-screen method 2.0mm 2.0mm 2.0mm
    57 Max. via-plug of aluminum foil method 4.5mm 4.5mm 4.5mm
    58 Surface finish Thickness of nickel of ENIG 3-5um 3-5um 2-6.35um
    59 Thickness of Gold of ENIG 0.05-0.1um
    60 Thickness of nickel of Gold finger 3-5um
    61 Thickness of Gold of Gold finger 0.1-1.27um
    62 Thickness of tin of HASL 2.54-6.35um
    63 Thickness of OSP 0.2-0.5um
    64 Thickness of tin of Immersion tin 0.2-0.75um
    65 Thickness of silver of Immersion silver 0.15-0.75um
    66 Contour process Method of contour process CNC milling, V-CUT, Break-out tap, break-out holes, Punching
    67 Minimum router 0.8mm
    68 Min.tolerance of contour ±0.15mm ±0.13mm ±0.1mm
    69 Min.distance of milling contour(no copper exposure) 12mil 10mil 8mil
    70 Angle of V-CUT 20、30、45、60 ±5 degree
    71 Degree of symmetry of V-CUT ±6mil ±5mil ±4mil
    72 Tolerance of residual thickness of V-CUT ±6mil ±5mil ±4mil
    73 Tolerance of Chamfer angle of Gold finger ±5 degree ±5 degree ±5 degree
    74 Tolerance of residual thickness of bevel edge of gold finger ±5mil ±5mil ±5mil
    75 Min radius of inner corner 0.4mm
    76 Min. distance from edge to V-Cut (no copper exposure) 18mil (1.6mm Thick, 20 degree V-groove cutter) 14mil(1.6mm Thick, 20 degree V-groove cutter) 12mil (1.6mm Thick, 20 degree V-groove cutter)
    77 20mil (1.6mm Thick, 30 degree V-groove cutter) 18mil (1.6mm Thick, 30 degree V-groove cutter) 16mil (1.6mm Thick, 30 degree V-groove cutter)
    78 24mil (1.6mm Thick, 45 degree V-groove cutter) 22mil (1.6mm Thick, 45 degree V-groove cutter) 20mil (1.6mm Thick, 45 degree V-groove cutter)
    79 30mil (1.6mm Thick, 60 degree V-groove cutter) 28mil (1.6mm Thick, 60 degree V-groove cutter) 26mil (1.6mm Thick, 60 degree V-groove cutter)
    80 Special tolerance Board thickness of flying probe test 0.6-4.0mm
    81 Panel size of flying probe test Size900X600mm, Small size can be compensated through manufacturing procedure
    82 Panel size of fixture test method Size460X380mm, Small size can be compensated through manufacturing procedure
    83 Board thickness of fixture test method 0.4-6.0mm
    84 Tolerance of press-fit hole ±2mil
    85 Tolerance of NPTH ±2mil
    86 Tolerance of PCB thickness 1.0mm≥PCB thickness, Tolerance ±0.1mm;1.0mm≤PCB thickness, Tolerance ±10%
    87 Tolerance of depth of countersunk hole ±0.2mm
    88 Depth tolerance of blind slot ±0.2mm
    89 Maximum shipment size Size1200X600mmDouble side, no test required
    90 Size1000X600mm Multilayer, no test required
    91 Minimum shipment size 10X10mm
    92 PCB thickness of HASL 0.8-3.0mm(Hole less 0.5mm should be use via-plug or mask-tent )
    93 HASL PCB Size Size≤600X460mm
    94 PCB thickness 0.15-7.0mm
    95 Depth of V groove 0.8-3.2mm
    96 Distance of non-continuous v-groove ≥7mm
    97 Max. drill diameter Size6.5mm (Counterbore or router will be used for holes more than 6.5mm, Min.tolerance ±0.1mm
    98 Max. countersink diameter Size6.5mm Countersink can be used counterbore drill or router
    99 Distance of Bevel Size≥11mm Size≥5mm Size≥5mm
    100 Thickness of peelable mask 0.2-1.5mm ±0.15mm

     

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374847

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)