Bicheng Electronics Technology Co., Ltd Cases

Introduction Wangling’s TFA300 high frequency material utilizes a large amount of uniform special nano-ceramics mixed with PTFE resin, eliminating the fiberglass effect during the propagation of electromagnetic waves.   A new manufacturing process is employed to create prefabricated sheets, which are pressed using a special lamination process. This material exhibits outstanding electrical, thermal, and mechanical properties with excellent dielectric constant at the same level, making it an aerospace-grade high-frequency and high-reliability material that can replace similar foreign products.   Features TFA300 features a low dielectric constant of 3 at 10GHz, enabling minimal signal delay and optimal impedance control for high-speed/high-frequency applications (e.g., 5G, radar, mmWave circuits).   Ultra-low dissipation factor of 0.001 at the same frequency ensures minimal signal loss and high-quality signal integrity in RF/microwave PCBs and antennas.   It also features a great TCDk value of -8 PPM/℃,providing exceptional dielectric constant stability across a wide temperature range (-40°C to +150°C), critical for automotive, aerospace, and outdoor telecom systems.   The peel strength is greater than 1.6N/mm, indicating superior adhesion between copper layers and substrate, reducing delamination risks in multilayer PCBs.   18 PPM/ºC of X/Y axis CTE, closely matching copper’s CTE of 17 ppm/°C, minimizes the stress-induced warpage during thermal cycling. 30 ppm/°C of Z axis, balances rigidity and flexibility for reliable plated through-hole (PTH) integrity.   TFA300 also shows low water absorption of 0.04%, a higher thermal conductivity of 0.8W/MK.   Finally, it meets the flammability standard of UL-94 V-0.   PCB Material: Nano-ceramics mixed with PTFE resin Designation: TFA300 Dielectric constant: 3 ±0.04 Dissipation factor: 0.001 Layer count: Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness: 5mil (0.127mm), 10mil (0.254mm),20mil(0.508mm), 25mil(0.635mm), 30mil(0.762mm), 40mil(1.016mm),50mil(1.27mm), 60mil(1.524mm),75mil(1.905mm), 80mil(2.03mm), 100mil(2.54mm), 125mil(3.175mm),150mil(3.81mm), 160mil(4.06mm), 200mil(5.08mm), 250mil(6.35mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red, Purple, etc. Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc..   PCB Capability We specialize in delivering high-quality TFA300 PCBs tailored to meet your diverse design and performance requirements.   Layer Count: We can provide you with Single-sided, Double-sided, Multi-layer and Hybrid PCBs (mixed materials).   Copper Weight: You can choose 1oz (35µm) for standard signal integrity, or 2oz (70µm) for enhanced current-carrying capacity and thermal management.   Dielectric Thickness: We offer extensive options from 5mil (0.127mm) to 250mil (6.35mm), enabling precise impedance control and adaptability for high-frequency applications.   PCB Size: We can supply a large panel up to 400mm x 500mm with single board or multiple designs.   Solder Mask Colors: It’s available in Green, Black, Blue, Yellow, Red, and more.   Surface Finishes: Immersion Gold (ENIG), HASL (Lead-Free),Immersion Silver, Immersion Tin, ENEPIG, OSP, Bare copper and Pure Gold are available in house.   Applications TFA300 PCBs are typically used in aerospace and aviation equipment, phase-sensitive antennas, airborne radar, Satellite communication, and navigation etc.

Introduction RO3206 high frequency circuit materials are laminates that contain ceramic fillers and are reinforced with woven fiberglass. These materials have been specifically engineered to provide exceptional electrical performance and mechanical stability while maintaining competitive pricing. They are an extension of the RO3000 series high frequency circuit materials, with the notable improvement of enhanced mechanical stability.   Features &Benefits: RO3206 stands out for its exceptional circuit material properties.   With a dielectric constant of 6.15 and tight tolerance at 10 GHz/23°C, it delivers superior electrical performance.   The low dissipation factor of 0.0027 at 10GHz minimizes signal loss, coupled with a high thermal conductivity of 0.67 W/MK for efficient heat dissipation.   With less than 0.1% low moisture absorption and a well-matched copper coefficient of thermal expansion (CTE) of 13, 13, and 34 ppm/°C across all axes, RO3206 ensures functional stability within intricate multi-layer structures and compatibility with epoxy multilayer board hybrid designs The woven glass reinforcement enhances rigidity, making it easier to handle during manufacturing.   Furthermore, the material's surface smoothness allows for precise PCB designs with fine line etching tolerances.   PCB Material: Ceramic-filled Laminates Reinforced with Woven Fiberglass Designation: RO3206 Dielectric constant: 6.15 Dissipation factor: 0.0027 Layer count: Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness: 25mil (0.635mm), 50mil (1.27mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red, Purple etc. Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold plated etc..   PCB Capability I'm excited to introduce you to the remarkable PCB capabilities we offer for RO3206.   First up. let's talk about layer count. The options of Single Sided, Double Sided, Multi-layer PCB, and Hybrid PCB catering to your various design requirements.   Next, consider the copper weight. The choices of 1oz (35µm) and 2oz (70µm) providing flexibility for different applications.   Move on to dielectric thickness. Variants of 25mil (0.635mm) and 50mil (1.27mm) allowing for customization based on design specifications.   In terms of size, we can support up to 400mm X 500mm, accommodating a range of board dimensions.   We have a variety of solder mask color options. You can choose from Green, Black, Blue, Yellow, Red, and more.   Finally, let's discuss surface finishes. We offer a comprehensive selection, including Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, and Pure gold plated.   Applications RO3206 PCBs find applications across a diverse range of industries, including automotive GPS antennas, base station infrastructure, direct broadcast satellites, cable data links, microstrip patch antennas and so on.

Introduction Antenna-grade laminates of RO4725JXR are composed of a hydrocarbon, ceramic, and woven glass composite. The resin system of the dielectric materials provides essential properties for optimal antenna performance. RO4725JXR is fully compatible with traditional FR-4 and high-temperature lead-free solder processing. Unlike conventional PTFE-based laminates, RO4725JXR does not require special treatment for plated through-hole preparation. This makes it a cost-effective alternative to traditional PTFE-based antenna materials, enabling designers to achieve a balance between cost and performance.   Features RO4725JXR showcases distinctive attributes:   Low Dielectric Constant: With a precise value of 2.55 ± 0.05 at 10GHz, signal propagation is optimized. Consistent signal transmission and reception are ensured by a stable dielectric constant.   Low Z-axis CTE: Maintaining stability, the coefficient stands at 25.6 ppm/°C, preventing material expansion or contraction amidst temperature fluctuations.   Low TCDk: The +34 ppm/°C TCDk guarantees a stable dielectric constant across varying temperatures.   Low Dissipation Factor: At 10GHz, the 0.0026 dissipation factor minimizes energy loss as heat during signal transmission.   High Tg: With a Tg exceeding 280°C, the material retains its physical properties even under high-temperature conditions.   Reduced PIM Value: Notably, RO4725JXR boasts a reduced passive inter-modulation (PIM) value of -166 dBC, enhancing antenna performance, particularly in high-power scenarios.   PCB Material: Hydrocarbon / Ceramic / Woven Glass Designation: RO4725JXR Dielectric constant: 2.55 @ 10 GHz Dissipation factor: 0.0026 @10 GHz Layer count: Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness 30.7 mil (0.780mm), 60.7mil (1.542mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Red,Yellow, White etc. Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, Bare Copper, OSP, ENEPIG, Pure gold etc..   PCB Capability Let's dive into our PCB capabilities, where a vast array of options awaits to cater to every customer's unique requirements   From single-sided to double-sided, multi-layer, and hybrid PCBs, we offer a spectrum of choices suitable for applications ranging from basic electronics to intricate communication systems. Dielectric thicknesses like 30.7 mil and 60.7 mil are available to suit diverse needs, ensuring flexibility in design and adaptation to varying signal demands.   The copper weight is also adjustable based on your preferences. Whether it's 1oz (35 µm) or 2oz (70 µm), we customize to optimize the PCB's electrical performance.   Our PCBs come in sizes up to 400 mm by 500 mm, perfect for a multitude of applications. The large size allows for the integration of multiple components and systems, providing greater flexibility in design.   We offer a variety of solder mask colors, including green, black, blue, red, yellow, and white among others.   In addition, our PCBs can be finished with a range of surface finishes, such as immersion gold, HASL, immersion silver, immersion tin, bare copper, OSP, ENEPIG, pure gold, and more. These surface finish options enhance the performance and durability of the PCB.   Applications The RO4725JXR PCB is commonly used in cellular base station antennas.

Introduction AD300D laminates are ceramic-filled, glass-reinforced PTFE-based materials designed to offer a controlled dielectric constant, low loss performance, and excellent passive intermodulation (PIM) performance. They are specifically engineered and manufactured to meet the demands of today’s wireless antenna markets.This PTFE resin based material is compatible with standard PTFE fabrication and provides a cost-effective construction to improve electrical and mechanical performance.   Features The AD300D laminates demonstrate an outstanding passive intermodulation (PIM) value of -159 dBc at 30 mil and -163 dBc at 60 mil, measured with reflected 43 dBm swept tones at 1900 MHz. This low PIM performance enhances antenna efficiency and reduces yield loss due to PIM-related issues.   AD300D features controlled dielectric constant of 2.94 at 10 GHz, and low dissipation factor of 0.0021 at 10 GHz, 23°C, and 50% relative humidity.   Additionally, the thermal coefficient of the dielectric constant is measured at -73 ppm/°C across a temperature range of 0-100°C at 10 GHz, underscoring its stability under varying thermal conditions.   Boasting remarkable thermal resilience, AD300D surpasses a decomposition temperature (Td) exceeding 500°C.   Its coefficient of thermal expansion stands at 24 ppm/°C in the X-axis, 23 ppm/°C in the Y-axis, and 98 ppm/°C in the Z-axis within a temperature range of -55 to 288°C.   Furthermore, AD300D offers robust adhesion and durability, showcasing over 60 minutes of resistance to delamination at 288°C.   The material's moisture absorption rate is minimal, at just 0.04% under E1/105 + D48/50 conditions.   PCB Material: Ceramic-filled, glass-reinforced PTFE-based Composites Designation: AD300D Dielectric constant: 2.94 (10 GHz) Dissipation factor: 0.0021 (10 GHz) Layer count: Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), 120mil (3.048mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare copper, Pure gold etc..   PCB Capability Our PCB manufacturing capabilities for AD300D encompass a wide range, including single-sided, double-sided, multi-layer, and hybrid PCBs.   You can select copper weight options of 1 oz (35 µm) or 2 oz (70 µm) based on your specific requirements. Dielectric thickness is available from 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), and 120mil (3.048mm).   With a maximum PCB size of 400 mm x 500 mm, we accommodate either a single board within these dimensions or multiple designs on a panel of the same size.   We offer a variety of solder mask options including Green, Black, Blue, Yellow, Red, and more to suit your preferences.   Furthermore, we provide an array of surface finish choices such as Immersion Gold, HASL, Immersion Silver, Immersion Tin, OSP, ENEPIG, Bare Copper, and Pure Gold to cater to diverse needs and specifications.   Applications AD300D PCBs are versatile and well-suited for a diverse range of applications, including Cellular infrastructure base station antennas, Automotive telematics antenna systems and Commercial satellite radio antenna.

Introduction Rogers’ IsoClad 917 laminates utilize a minimal amount of non-woven fiberglass/PTFE to attain the lowest dielectric constant and dissipation factor in their category. The non-woven reinforcement enables these laminates to be suitable for applications where the final PCB might need to be bent, such as conformal or wrap-around antennas. IsoClad 917's unique longer random fibers and proprietary manufacturing process offer superior dimensional stability and uniformity of dielectric constant compared to competitors in similar categories.   Features The IsoClad 917 showcases a dielectric constant (Dk) of 2.17 or 2.20, offering precise performance with a tolerance of ±0.03 at 10 GHz.   In addition, the material boasts an impressively low dissipation factor of 0.0013 at the same frequency, ensuring minimal signal loss and enhanced signal integrity.   Its highly isotropic nature across the X, Y, and Z axes ensures uniform electrical performance and reliability in diverse applications.   Moreover, IsoClad 917 features a low moisture absorption rate of just 0.04%.   In addition to its superior electrical properties, IsoClad917 is less rigid than traditional woven fiberglass materials, offering enhanced flexibility.   PCB Material: Non-woven Fiberglass / PTFE Composites Designation: IsoClad 917 Dielectric constant: 2.17 or 2.20 (10 GHz) Dissipation factor: 0.0013 (10 GHz) Layer count: Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness 20mil (0.508mm), 31mil (0.787mm), 62mil (1.575mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold plated etc..   PCB Capability Welcome to our introduction on PCB capabilities for IsoClad 917.   Our offerings encompass a wide range of configurations to meet diverse project requirements:   Layer Count: We support a variety of configurations, including Single Sided, Double Sided, Multi-layer PCBs, and Hybrid PCBs.   Copper Weight: Options are available for 1 oz (35 µm) and 2 oz (70 µm) copper weights to meet diverse electrical requirements.   Dielectric Thickness: We offer multiple dielectric thicknesses,such as 20 mil (0.508 mm), 31 mil (0.787 mm), and 62 mil (1.575 mm).   PCB Size: Our PCBs can be manufactured in sizes up to 400 mm x 500 mm, including one board or multiple designs in this size.   Solder Mask Options: We provide a range of solder mask colors, including Green, Black, Blue, Yellow, Red, and more.   Surface Finish: Various surface finishes are available, such as Immersion Gold, HASL, Immersion Silver, Immersion Tin, ENEPIG, OSP, Bare Copper, and Pure Gold Plated.   Application IsoClad 917 PCBs are perfect for applications in conformal antennas, stripline and microstrip circuits, guidance systems, and radar systems. Its low loss, stable performance, and precise dielectric properties are essential for efficient signal transmission and reliable signal processing.

Introduction Rogers’ TMM10i microwave material is a ceramic thermoset polymer composite designed for high plated thru-hole reliability strip-line and micro-strip applications. This cutting-edge material combines the best qualities of ceramic and PTFE substrates while incorporating soft substrate processing techniques for effortless fabrication.   TMM10i laminates possess isotropic dielectric constant and coefficients of thermal expansion. The CTE closely aligns with copper that enables the creation of highly reliable plated through holes and minimizing etch shrinkage. Additionally, the thermal conductivity of TMM10i laminates is approximately double that of conventional PTFE/ceramic laminates, thus enhancing heat dissipation capabilities.   Features & Benefits With a Dk of 9.80 +/- .245, TMM 10i increases the capacitance of capacitors, allowing for smaller designs while maintaining performance. This is beneficial in high-frequency applications where size and efficiency are critical.   Its impressively low dissipation factor of .0020 at 10GHz guarantees minimal signal loss, distortion and attenuation.   Moreover, its thermal coefficient of Dk at -43 ppm/°K and copper-compatible coefficient of thermal expansion contribute to excellent thermal stability.   The mechanical properties of TMM 10i make it highly resistant to creep and cold flow, ensuring long-term reliability in demanding environments.   Additionally, its resistance to process chemicals minimizes damage during fabrication, streamlining production processes.   PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites Designation: TMM10i Dielectric constant: 9.80 ±0.245 Layer count: Double Layer, Multilayer, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Laminate thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red, Purple etc. Surface finish: HASL, ENIG, Immersion tin, Immersion silver, OSP, Pure Gold, ENEPIG, Bare copper etc..   PCB Capability Now, let's move to the PCB capability column and discover our extensive offerings.   We provide a diverse range of PCB solutions tailored to your needs, including double-layer, multi-layer, and hybrid configurations.   Our copper weights, available in 1 oz (35 µm) and 2 oz (70 µm), cater to various current-carrying capacities.   To meet your design specifications, we offer thickness options from 15 mil (0.381 mm) to 500 mil (12.70 mm).   The maximum PCB size we support is 400 mm x 500 mm, allowing ample space for complex circuit designs.   Additionally, we provide a wide selection of solder mask colors—green, black, blue, yellow, red, and purple—enhancing your design flexibility.   To boost the performance and durability of your PCBs, we offer various surface finishes, including HASL, immersion gold, immersion tin, immersion silver, OSP, pure gold plating, ENEPIG, and bare copper.   Applications TMM 10i PCB's versatility makes it an ideal choice for a wide range of RF and microwave applications. It delivers outstanding performance in power amplifiers, filters, and couplers, particularly in satellite communication and GPS antenna systems. Additional applications include patch antennas, dielectric polarizers, and chip testers, among others.

Introduction Rogers AD255C laminates are a sophisticated blend of a fluoropolymer resin system, carefully selected ceramic elements, and fiberglass reinforcement. By leveraging the exceptional thermal properties of fluoropolymer resin, alongside the strategic integration of ceramic materials and fiberglass reinforcement, AD255C materials stand out for their reduced loss, lower thermal expansion characteristics, and minimized passive intermodulation (PIM) effects. This unique combination results in a specialized RF laminate material that excels in a variety of microwave and RF applications within telecommunication infrastructure.   Features The AD255C boasts several remarkable features, including:   Very Low Loss PTFE and Ceramic Filled Composite: This advanced composite merges PTFE with ceramic fillers, resulting in exceptionally low signal loss, making it perfect for high-frequency applications.   Exceptional Loss Tangent: With a loss tangent of only 0.0014 at 10 GHz and base station frequencies, this material guarantees efficient signal transmission, minimizing energy waste and enhancing overall performance.   Dielectric Constant of 2.55: The material features a dielectric constant of 2.55, providing reliable electrical insulation with tight tolerances, which is vital for maintaining signal integrity in sensitive applications.   Low Profile Copper: The inclusion of low profile copper enhances conductivity while preserving a compact design, making it ideal for space-constrained environments.   Low Z-Direction CTE: With a coefficient of thermal expansion (CTE) of 50 ppm/°C in the Z-direction, this material offers excellent dimensional stability across temperature variations, ensuring consistent performance under a wide range of operating conditions.   PCB Material: Glass-reinforced, PTFE based Composites Designation: AD255C Dielectric constant: 2.55 (10 GHz) Dissipation Factor 0.0014 (10 GHz) Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness: 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), 125mil (3.175mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red, Purple etc. Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare copper, Pure gold etc..   PCB Capability We offer a diverse range of PCB manufacturing capabilities to meet your project specifications, including double-sided PCBs, multi-layer PCBs, and hybrid boards.   Copper weight options available in 1oz (35µm) and 2oz (70µm), as well as various dielectric thickness options ranging from 20mil (0.508mm) to 125mil (3.175mm).   The maximum PCB size we can accommodate is 400mm x 500mm, whether as a single board within these dimensions or multiple designs on a panel of this size.   In terms of solder mask options, we provide a selection of colors such as Green, Black, Blue, Yellow, Red, Purple, and more.   Moreover, we offer a range of surface finish options, including Immersion gold, HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare copper, Pure gold plated, and others to suit various preferences and requirements.   Applications Typical applications of AD255C PCBs include Cellular infrastructure base station antenna, Automotive telematics antenna systems and Commercial satellite radio antenna etc.

Introduction Rogers RO3010 advanced circuit materials are ceramic-filled PTFE composites that provide a higher dielectric constant with outstanding stability.   RO3010 laminates are not only competitively priced but also deliver exceptional mechanical and electrical reliability. This stability makes it easier to design broadband components, allowing for a wide range of applications across various frequencies. Plus, this material’s characteristics make RO3010 laminates excellent for circuit miniaturization.   Features & Benefits The RO3010 features a dielectric constant (Dk) of 10.2 ± .30 at 10 GHz, along with an impressively low dissipation factor of just 0.0022 at the same frequency.   Additionally, this material has a low coefficient of thermal expansion (CTE) of 13 ppm/°C in the X-axis, 11 ppm/°C in the Y-axis, and 16 ppm/°C in the Z-axis. The RO3010's impressive dimensional stability, with its CTE closely matched to copper, helps minimize phase shift and maintain consistent performance even under fluctuating temperature conditions.   Furthermore, it comes with the assurance of ISO 9001 certification, reflecting top-quality standards and reliability.   And if you're working with multi-layer board designs, this material is a fantastic choice, providing the stability and versatility you need for complex circuitry.   PCB Material: Ceramic-filled PTFE composites Designation: RO3010 Dielectric constant: 10.2±0.3 Layer count: Single Layer, Double Layer, Multilayer, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) PCB thickness: 5mil (0.127mm), 10mil (0.254mm), 25mil(0.635mm), 50mil (1.27mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, Immersion tin, Immersion silver, Immersion gold, Pure gold, ENEPIG, OSP etc..   PCB Capability I’m excited to showcase our advanced PCB capabilities using RO3010 material.   We support single-layer, double-layer, multilayer, and hybrid PCBs, providing flexibility to meet your design needs. You can choose from copper weights ranging from 1oz (35 μm) to 2oz (70 μm).   We offer a range of thicknesses: 5 mil (0.127 mm), 10 mil (0.254 mm), 25 mil (0.635 mm), and 50 mil (1.27 mm) to suit various applications.   Our maximum PCB size is 400 mm x 500 mm, accommodating a wide variety of projects.   Additionally, we provide various solder mask options, including green, black, blue, yellow, and red, along with surface finishes such as bare copper, HASL, immersion tin, immersion silver, ENIG, pure gold, ENEPIG, and OSP to meet your specific requirements.   Applications RO3010 PCBs are widely used in various applications, including: Automotive radar systems,Global positioning satellite antennas, Cellular telecommunications systems, Patch antennas for wireless communications, and Direct broadcast satellites etc.

Introduction Rogers Kappa 438 was developed to address the growing performance demands of the wireless market, which traditional FR-4 materials could not meet. As wireless data usage has surged, the need for higher network capacity and reliability has become crucial. Kappa 438 offers superior dielectric properties, lower loss, and tighter tolerances, making it ideal for advanced RF applications, including small cells and carrier-grade Wi-Fi.   Kappa 438 laminates were designed using a glass reinforced hydrocarbon ceramic system that offers superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes.   Features Kappa 438 laminates offer dielectric constants (Dk) of 4.38 at 2.5GHz, which is tailored to FR-4 industry standard norms, facilitating smooth integration into existing designs that demand improved electrical performance.   Kappa 438 has tighter Dk and thickness tolerances compared to traditional FR-4, enabling more precise circuit design and improved signal integrity.   Additionally, Kappa 438 boasts low X Y and Z-axis coefficient of thermal expansion (CTE) of 13, 16, and 42 ppm/°C respectively, allowing for greater dimensional stability and plated through hole reliability under varying thermal conditions.   The high glass transition temperature (Tg) of over 280°C (TMA) ensures that Kappa 438 can withstand demanding thermal environments, making it suitable for a wide range of applications.   Furthermore, it meets UL 94-V0 flame retardant requirements, providing enhanced safety and reliability in critical electronic systems.   PCB Material: Glass Reinforced Hydrocarbon Ceramic Designation: Kappa 438 Dielectric constant: 4.38 at 2.5GHz Layer count: Single Layer, Double Layer, Multilayer, Hybrid PCB Copper weight: 1oz (35 µm), 2oz (70µm) PCB thickness: 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersoin silver, Immersion tin, OSP, ENEPIG, Pure gold etc..   PCB Capability We are proud to offer a comprehensive range of PCB manufacturing capabilities to meet the diverse needs of our clients.   Our expertise spans across various layer counts, including single-layer, double-layer, multilayer, and hybrid PCBs.   Our manufacturing process supports multiple copper weights, with options of 1 oz (35 µm) and 2 oz (70 µm).   We also offer a variety of PCB thicknesses, ranging from 10 mils (0.254 mm) to 60 mils (1.524 mm), catering to different design requirements.   In terms of size, our PCBs can be produced up to 400 mm x 500 mm, making them suitable for a wide array of electronic devices.   We provide a selection of solder mask colors, including green, black, blue, yellow, and red.   For surface finishes, we offer an extensive array of options such as bare copper, HASL, ENIG, immersion silver, immersion tin, OSP, ENEPIG, and pure gold.   Applications Kappa 438 PCBs are used for a variety of advanced applications, including: Carrier Grade WiFi, Licensed Assisted Access (LAA), Small Cell and Distributed Antenna Systems (DAS), Vehicle to Vehicle/Vehicle to Infrastructure Communications (V2X), and Internet of Things (IoT) etc.

Introduction TLY-5Z laminates are advanced composite materials blending glass-filled PTFE with woven fiberglass reinforcement. This glass-filled structure is specifically designed for low-density applications, such as aerospace, where minimizing weight is crucial. These laminates offer exceptional dimensional stability unattainable with unreinforced PTFEs. Their low-density composition results in minimal Z-axis expansion, a characteristic not typically found in PTFE-rich composites. Compared to traditional low dielectric constant PTFE composites, TLY-5Z demonstrates superior thermal stability against z-axis expansion-induced stress on plated through holes.   Features Following the introduction above, we will delve into the specific features of TLY-5Z as defined by the IPC standard.   The material possesses a specific gravity of 1.92 g/cm³, in accordance with IPC-650 2.3.5.   At 10 GHz, the dielectric constant is recorded at 2.20, with a tolerance of ±0.04, as specified in IPC-650 2.5.5.5.1.   Moreover, the dissipation factor at this frequency stands at 0.0015, as outlined in IPC-650 2.5.5.5.1..   The coefficient of thermal expansion (CTE) for TLY-5Z is 30 ppm/°C in the X direction and 40 ppm/°C in the Y direction, within the temperature range of 25°C to 260°C, as detailed in IPC-650 2.4.41.   TLY-5Z exhibits half the thermal expansion of PTFE-rich substrates, enhancing drilling capabilities and enabling thermal cycling. Ground stitching along transmission lines can be effortlessly achieved, ensuring thermal reliability.   The material demonstrates a moisture absorption rate of just 0.03%, according to IPC-650 2.6.2.1, and holds a UL-94 flammability rating of V-0.   PCB Material: Composites of Ceramic, PTFE and Woven Fiberglass Designation: TLY-5Z Dielectric constant: 2.20 +/- 0.04 (10GHz) Dissipation Factor 0.0015 (10GHz) Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB Copper weight: 1oz (35 µm), 2oz (70µm) Laminate thickness: 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm ) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold plated etc..   PCB capability In our PCB capabilities with TLY-5Z, we offer various options to cater to your specific needs:   We can produce Single Sided, Double Sided, Multilayer, and Hybrid PCBs.   Choose from copper weights of 1oz (35 µm) or 2oz (70µm) based on your requirements.   Laminate thickness options include 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), and 60mil (1.524mm).   PCB sizes up to 400mm X 500mm are supported.   Select from a range of solder mask colors such as Green, Black, Blue, Yellow, Red, and more.   Various surface finish options are available including Bare Copper, HASL, ENIG, Immersion Silver, Immersion Tin, ENEPIG, OSP, and Pure Gold Plated, ensuring a finish that meets your needs.   Applications TLY-5Z PCBs are commonly utilized in aerospace components, lightweight antennas for aircraft, RF passive components etc.

Introduction RF-60TC is a PTFE-based, ceramic-filled fiberglass substrate specifically designed for high-power RF and microwave applications. This material is engineered to operate at lower temperatures in high-power settings while delivering improved gains and efficiencies in miniaturized antenna applications within the 6.15 DK market. This advanced properties results from the enhanced dielectric heat dissipation and exceptionally low dielectric losses.   Features Let's explore the exceptional features of RF-60TC:   Firstly, it boasts impressive thermal conductivity values: 0.9 W/m·K for unclad materials, 1.00 W/m·K for 0.5oz, and 1.05 W/m·K for 1oz material. These values enhance design flexibility, extend component lifespan, and ensure long-term reliability.   With a dielectric constant of 6.15 ± 0.15 at 10 GHz, RF-60TC aids in device miniaturization, optimizing space efficiency.   At 10 GHz, the dissipation factor stands at 0.002 according to IPC-650 2.5.5.5.1, ensuring efficient signal transmission.   RF-60TC exhibits a CTE value of X at 9.9, Y at 9.9, and Z at 40 ppm/°C. Its low CTE and enhanced dimensional stability enable the construction of high layer count multilayer PCBs with improved plated through hole reliability.   The material's moisture absorption rate is a minimal 0.03%, meeting IPC-650 2.6.2.1 standards for environmental stability.   Lastly, RF-60TC complies with the UL 94 V-0 flammability rating, ensuring high safety standards.   PCB Material: PTFE based, ceramic filled fiberglass Designation: RF-60TC Dielectric constant: 6.15± 0.15 @10 GHz Dissipation factor: 0.002 @10 GHz Layer count: Single Layer, Double Layer, Multilayer, Hybrid PCB Copper weight: 1oz (35 µm), 2oz (70µm) PCB thickness: 5mil (0.127mm), 10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30mil (0.762mm), 60mil (1.524mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold etc..   PCB Capability In this section, we'll showcase our extensive capabilities and the wide options available to meet your PCB requirements:   Layer Count: Whether you're looking for a Single Layer, Double Layer, Multilayer, or Hybrid PCB, we've got you covered with our expertise.   Copper Weight: Choose from 1oz (35 µm) or 2oz (70µm) copper weight options to meet your conductivity requirements.   PCB Thickness: Select from a range of thicknesses including 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), and 60mil (1.524mm) for optimal design flexibility.   PCB Size: We can accommodate PCB sizes up to 400mm X 500mm.   Solder Mask: Customize your PCBs with a selection of colors like Green, Black, Blue, Yellow, Red, and more.   Surface Finish: Choose from a variety of surface finishes including Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold, and more to ensure the perfect finish for your applications.   Applications RF-60TC PCBs are widely utilized in high power amplifiers, miniaturized antennas, GPS, Patch, and RFID reader systems, filters, couplers, and dividers, as well as satellite communication technologies.

Introduction Rogers DiClad 870 laminates are woven fiberglass reinforced, PTFE-based composites that offer lower dielectric constant and dissipation factors by using fewer plies of woven fiberglass and a higher ratio of PTFE content.   The woven fiberglass reinforcement in DiClad 870 provides greater dimensional stability than nonwoven fiberglass reinforced PTFE based laminates of similar dielectric constants. The coated fiberglass plies in DiClad 870 materials are aligned in the same direction.   Features Here are some standout features of DiClad 870 materials.   They exhibit a dielectric constant of 2.33 at both 1MHz and 10 GHz, ensuring reliable signal transmission.   At 10 GHz, these laminates showcase a low dissipation factor of 0.0013, maintaining signal integrity.   DiClad 870 boasts a strong copper peel strength of 14 Lbs/in using 35 μm foil per IPC TM-650 2.4.8 test method, ensuring robust copper adhesion.   The moisture absorption rate is a exceptionally low at 0.02%, guaranteeing stability in various environmental conditions.   Lastly, DiClad 870 meets UL 94-V0 flammability standards, ensuring high safety and fire resistance.   PCB material: Woven Fiberglass reinforced PTFE Laminates Designation: DiClad 870 Dielectric constant: 2.33 Layer count: Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB Dielectric thickness: 31mil(0.787mm), 93mil (2.286mm), 125mil (3.175mm) Copper weight: 1oz (35µm), 2oz (70µm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Red, Yellow etc. Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG, Pure gold etc..   PCB Capability In this section, we'll delve into the diverse capabilities we offer for your DiClad 870 PCBs.   Our services cover a range of layer counts, from single-sided to double-sided, multi-layer, and hybrid PCBs, allowing for versatility in your designs.   When it comes to dielectric thickness, we provide options such as 31mil (0.787mm), 93mil (2.286mm), and 125mil (3.175mm), catering to various project requirements.   You can select from different copper weights like 1oz (35µm) and 2oz (70µm) to suit your conductivity needs.   With a maximum PCB size of 400mm X 500mm, we offer ample space for your designs, whether for a single board or multiple designs within a single panel.   Our solder mask options include a variety of colors such as Green, Black, Blue, Red, Yellow, and more, allowing you to personalize your PCBs.   For surface finishes, we provide a range of choices including Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG, and Pure gold.   Applications DiClad 870 PCBs are frequently used in filter, coupler, and low noise amplifier applications, where dielectric constant uniformity is critical. They are also used in power dividers, combiners, and base station antenna, where low loss is important.   In Radar Feed Networks, Commercial Phased Array Networks, Guidance Systems, and Digital Radio Antennas, you can also find the presence of DiClad 870 PCBs.