Bicheng Electronics Technology Co., Ltd Cases

Introduction Rogers RO3035 laminates are ceramic-filled, PTFE based high frequency circuit materials. These laminates are specifically designed to excel in high-frequency applications and allow designers to develop multi-layer board designs without warping or decreased reliability. One of the key advantages is their expansion coefficient, which is carefully matched to that of copper. This matching ensures exceptional dimensional stability, preventing warping or distortions in the PCBs.     Features: RO3035 high-frequency material features a dielectric constant (Dk) of 3.50 +/- 0.05, ensuring precise signal transmission and efficient performance. With a dissipation factor of only 0.0015 at 10 GHz, they minimize signal loss and maintain excellent signal integrity.   RO3035 laminates exhibit a low coefficient of thermal expansion (CTE) in the X, Y, and Z axes, measuring 17 ppm/°C, 17 ppm/°C, and 24 ppm/°C, respectively. This dimensional stability enhances the PCBs' reliability and prevents warping or distortions in multi-layer board designs.     Benefits: RO3035 materials come with several notable benefits that make them an ideal choice for high-frequency applications.   They can be effectively utilized in applications up to 30-40 GHz, offering exceptional performance in demanding frequency ranges.   They exhibit a lower operating temperature, enabling increased reliability, particularly in power amplifier circuits where heat dissipation is crucial.   And lastly, RO3035 laminates are available with rolled copper. The smoother copper surface is contributing to achieving higher signal integrity, lower insertion loss, and better overall performance.   PCB Capability (RO3035) PCB Material: Ceramic-filled PTFE Composites Designation: RO3035 Dielectric constant: 3.5 Dissipation Factor 0.0015 10GHz Layer count: Single Sided PCB, Double Sided PCB, Multilayer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Laminate thickness: 5mil(0.127mm), 10mil(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm ) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Immersin gold, Immersion silver, Immersion tin, HASL, ENEPIG, OSP, Pure gold plated, Bare copper etc..   PCB Capabilities We can provide you with single layer board, double layer board, multi-layer board and hybrid PCBs.   You can choose thickness for 5 mils, 10 mils, 20 mils, 30 mils and 60 mils with one ounce and two ounces.   Dimension within 400mm by 500mm is well suited for manufacture.   We also offer a wide range of colors for solder mask, including green, black, blue, yellow and red etc.   For surface finishes, Immersion gold, immersion silver, immersion tin and HASL, ENEPIG, OSP etc are available for options.     Applications RO3035 PCBs find applications in various high-frequency and advanced technology fields. It provides design solutions for 5G, millimeter wave sub 6GHz and massive MiMo applications etc.   Thank you. I’ll see you next time.

Introduction Rogers RT/duroid 6035HTC high frequency circuit materials are ceramic filled PTFE composites for use in high power RF and microwave applications. It offers outstanding performance for high-power applications. These laminates exhibit a thermal conductivity nearly 2.4 times higher than the standard RT/duroid 6000 products. They feature copper foil (ED and reverse treated) with exceptional long-term thermal stability. Moreover, Rogers' advanced filler system enhances drill-ability, resulting in reduced drilling expenses compared to conventional high thermally conductive laminates that utilize alumina fillers.     Features RT/duroid 6035HTC offers a dielectric constant of 3.50 with precise tolerance of +/- .05, ensuring consistent and reliable operation.   It features a low dissipation factor of .0013 at 10GHz, minimizing signal loss and ensuring efficient signal transmission at high frequencies.   RT/duroid 6035HTC exhibits high thermal conductivity of 1.44 W/m/K at 80°C, enabling effective heat dissipation and temperature management, which is particularly advantageous for high-power applications.   Utilizing thermally stable low profile and reverse treat copper foil, RT/duroid 6035HTC exhibits reduced insertion loss, features excellent thermal stability of traces, maintaining stable electrical characteristics even under varying temperature conditions.   PCB Capability (RT/duroid 6035HTC) PCB Material: Ceramic-filled PTFE composites Designation: RT/duroid 6035HTC Dielectric constant: 3.50±0.05 Layer count: Double Layer, Multilayer, Hybrid PCB Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) Laminate thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, Pure gold, OSP etc..   PCB Capability We offer a wide range of PCB manufacturing capabilities to cater to your specific requirements   Layer count: We provide options for Single layer, double layer, Multi-layer and Hybrid PCBs.   Copper weight: 1oz (35 µm) and 2oz (35µm) are available.   Laminate thickness: There are 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), and 60mil (1.524mm) available, accommodating various design and mechanical constraints.   PCB size: Our maximum circuit dimensions are up to 400mm X 500mm, offering versatility for different project sizes.   Solder mask colors: It includes Green, Black, Blue, Yellow, Red, and more.   Surface finishes: Options including Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, Pure gold and OSP etc.     Applications RT/duroid 6035HTC PCBs are well-suited for a range of applications in the field of high-power RF and microwave electronics. These applications include high-power RF amplifiers, microwave power amplifiers, couplers, filters, combiners, power dividers, and more.   Thank you, and see you next time!

Introduction RT/duroid 5880 laminates are composite materials composed of PTFE and random glass fibers, known for their outstanding properties. They are specifically engineered for applications that demand high frequency and broadband capabilities. These laminates possess a low dielectric constant (Dk) and low dielectric loss, making them ideal for reliable and precise signal transmission. RT/duroid 5880 maintains Dk uniformity through randomly oriented microfibers that reinforce the PTFE composites.     Features RT/duroid 5880 features a dielectric constant (Dk) of 2.20 +/- .02, ensuring consistent signal propagation. Its low dissipation factor of .0009 at 10GHz minimizes energy loss during transmission, maintaining high signal integrity.   This material's moisture absorption is impressively low at 0.02%, making it well-suited for high humidity environments, as it retains its electrical and mechanical properties under such conditions.   The RT/duroid 5880 exhibits isotropic behavior, enabling uniform signal propagation in all directions, making it ideal for applications requiring multi-directional signal transmission.   In addition to its electrical properties, the RT/duroid 5880 laminate is easy to work with, allowing for efficient cutting, shaping, and machining. It exhibits resistance to solvents and reagents used in etching or plating processes, ensuring durability in harsh chemical environments.   As a well-established material, RT/duroid 5880 offers the lowest electrical loss among reinforced PTFE materials, enhancing signal integrity.   PCB Capability (RT/duroid 5880) PCB Material: Glass Microfiber Reinforced PTFE Composites Designation: RT/duroid 5880 Dielectric constant: 2.2 ± 0.02 at 10GHz Dissipation Factor 0.0009 at 10GHz Layer count: Single Sided, Double Sided, Multilayer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Laminate thickness: 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 31mil (0.787mm), 62mil (1.575mm ) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, OSP, Bare copper, Pure gold, ENEPIG etc..   PCB Capability We provide a comprehensive range of PCB capabilities, including double-sided boards, multi-layer boards, and hybrid designs.   Our PCBs can be fully customized to meet your requirements, with options for copper weights of 1oz and 2oz, dielectric thicknesses ranging from 6mil to 127mil, and sizes up to 400mm X 500mm.   In addition, we offer a wide selection of solder mask colors to suit your preferences, including green, black, blue, yellow, red, and more.   You can also choose from a variety of surface finishes, such as immersion gold, HASL, immersion silver, immersion tin, OSP, bare copper, pure gold, and ENEPIG, ensuring compatibility with your specific needs.     Applications RT/duroid 5880 PCB is commonly used in various applications such as commercial airline broadband antennas, microstrip and stripline circuits, millimeter wave applications, military radar systems, missile guidance systems, and point-to-point digital radio antennas.   Thank you. See you next time.

Introduction Wangling’s F4BM high frequency materials are PTFE glass fiber cloth copper clad laminates that combine glass fiber cloth, PTFE resin, and PTFE film through a meticulous manufacturing process.   These series laminates offer improved electrical performance compared to F4B due to their wider range of dielectric constants, low dielectric loss, increased insulation resistance, and enhanced stability. Consequently, they can serve as replacements for similar foreign products.   F4BM is cladded with forward-rotating ED copper foil, making it suitable for applications without PIM (Passive Intermodulation) concerns.     Features You have the flexibility to choose from a range of DK (dielectric constant) options spanning from 2.17 to 3.0.   The DF (dissipation factor) falls within the range of 0.001 to 0.0018.   There is a wide selection of thickness options to accommodate your specific requirements and the availability of diverse sizes allows for cost savings.   All these characteristics make it well-suited for commercial applications, large-scale production, and cost-effectiveness.   PCB Capability (F4BM) PCB Material: PTFE glass fiber cloth copper clad laminates Designation (F4BM ) F4BM DK (10GHz) DF (10 GHz) F4BM217 2.17±0.04 0.0010 F4BM220 2.20±0.04 0.0010 F4BM233 2.33±0.04 0.0011 F4BM245 2.45±0.05 0.0012 F4BM255 2.55±0.05 0.0013 F4BM265 2.65±0.05 0.0013 F4BM275 2.75±0.05 0.0015 F4BM294 2.94±0.06 0.0016 F4BM300 3.00±0.06 0.0017 Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) Dielectric thickness (or overall thickness) 0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..   PCB Capability Our comprehensive PCB manufacturing capabilities cover a wide range of aspects.   We can provide Single Sided, Double Sided, Multilayer, and Hybrid PCBs to meet your specific needs.   You have the flexibility to choose from copper weights of 1oz (35µm) and 2oz (70µm) for your PCBs.   Additionally, we offer a variety of dielectric thickness options, ranging from 0.8mm to 12.0mm, including specific measurements such as 1.524mm and 1.575mm.   Our capabilities extend to PCB sizes up to 400mm X 500mm, ensuring we can accommodate your size requirements.   To customize the appearance of your PCBs, we provide a selection of solder mask colors, including Green, Black, Blue, Yellow, Red, and more.   Furthermore, we offer multiple surface finish options, such as Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG, and more.     Applications F4BM PCB finds it’s wide range of applications, such as phase shifter, passive device, power divider, coupler, combiner, feed network, phased array antenna, satellite communications, base station antenna and radar etc.   Thank you. I’ll see you next time.