Bicheng Electronics Technology Co., Ltd Cases

Introduction Taconic RF-35TC high frequency materials are PTFE based, ceramic filled fiberglass laminates which provide low dissipation factor and high thermal conductivity. The heat is diffused away from both transmission lines and surface mount components such as capacitors etc. It will not oxidize, yellow or show upward drift in dielectric constant and dissipation factor like its synthetic rubber (hydrocarbon) competitors. This material is best suited for high power applications.     Benefits RF-35TC offers several significant benefits that make it an ideal choice for RF applications.   Firstly, it features a "Best in Class" loss tangent of 0.002 at 10GHz, resulting in minimal signal loss and superior signal integrity.   Secondly, RF-35TC excels in thermal management with a true thermal conductivity of 0.6W/m/k (unclad),effectively dissipating component-generated heat.   Another key benefit lies in its stable dielectric constant (Dk) across a wide temperature spectrum, ensuring consistent electrical performance in varying environmental conditions.   RF-35TC enhances antenna gains and efficiencies, contributing to superior signal propagation and reception, thereby improving antenna performance.   Furthermore, its excellent adhesion to Very Low Profile (VLP) copper ensures robust bonding between PCB material and copper layers, enhancing reliability and durability for demanding applications.   PCB Capability (RF-35TC) PCB Material: PTFE based, ceramic filled fiberglass substrate Designation: RF-35TC Dielectric constant: 3.5 Dissipation Factor 0.002 Layer count: Single Layer, Double Layer, Multilayer, Hybrid PCB Laminate thickness: 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) Copper weight: 1oz (35µm), 2oz (70µm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, Immersion gold, Immersion silver, Immersoin tin, ENEPIG, Pure gold, OSP etc..   PCB Capability We offer a variety of capabilities for RF-35TC PCBs, including single-layer, double-layer, multi-layer, and hybrid board configurations.   RF-35TC PCBs come in a wide range of thicknesses, including standard options like 5 mils, 10 mils, 20 mils, 30 mils, and 60 mils. The finished copper on the PCB can be 1oz or 2oz.   Our high-frequency PCBs can reach a maximum size of 400mm by 500mm, allowing for single-board or multiple design panel configurations. We provide solder mask options in green, black, blue, yellow, and more in-house.   Various pad plating options are available, including bare copper, HASL, immersion gold, immersion silver, immersion tin, ENEPIG, Pure gold, and OSP etc.     Applications RF-35TC PCB is ideal for a wide range of components and systems crucial for thermal management applications, encompassing filters, couplers, power amplifiers, antennas, and satellites.   Thank you for watching. See you next time.

Introduction RO3006 circuit materials are specifically developed for high frequency applications in commercial microwave and RF systems. These materials are composed of ceramic-filled PTFE composites and are designed to provide outstanding electrical and mechanical stability at competitive prices. The advanced nature of RO3006 circuit materials ensures a consistent dielectric constant (Dk) across a wide temperature range, eliminating the abrupt change in Dk typically observed in PTFE glass materials near room temperature.     Features RO3006 offers a dielectric constant (Dk) of 6.15 +/- 0.15, ensuring reliable signal transmission and precise impedance control.   With a dissipation factor of 0.0020 at 10 GHz, RO3006 facilitates low signal loss, making it ideal for high-frequency designs.   Moreover, RO3006 features an impressively low coefficient of thermal expansion (CTE) across the X, Y, and Z axes, measuring at 17, 17, and 24 ppm/°C respectively. This characteristic ensures excellent dimensional stability and minimizes phase shift, even when subjected to varying temperature conditions   The uniform mechanical properties shared with other laminates in the RO3000 Series facilitate seamless integration into multi-layer board designs, promoting compatibility and ease of fabrication.   PCB Capability (RO3006) PCB Material: Ceramic-filled PTFE Composites Designation: RO3006 Dielectric constant: 6.15 Dissipation Factor: 0.002 10GHz Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Laminate thickness: 5mil(0.127mm), 10mil(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm ) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, Bare Copper, OSP, Pure thick gold etc..   PCB Capability Our manufacturing capabilities include single-sided, double-sided PCBs, multilayer PCBs, and hybrid PCBs, allowing flexibility in accommodating various design requirements.   We offer copper weight options of 1oz (35µm) and 2oz (70µm), providing choices to meet specific conductivity needs.   Laminate thickness options range from 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), up to 60mil (1.524mm), ensuring versatility for different applications.   The maximum size we support for PCBs is 400mm X 500mm, enabling the realization of larger designs.   We offer a range of solder mask colors, including green, black, blue, yellow, red, and more, allowing customization to suit specific requirements.   When it comes to surface finish, we offer multiple options, including immersion gold, HASL, immersion silver, immersion tin, ENEPIG, bare copper, OSP, pure thick gold and so on.     Applications RO3006 PCB finds application in various fields, including:   Automotive radar systems Global positioning satellite (GPS) antennas Power amplifiers and antennas in cellular telecommunications systems Patch antennas for wireless communications Direct broadcast satellites and so on.   Thank you. I’ll see you next time.

Introduction Rogers RO4360G2 laminates are low loss, glass-reinforced, hydrocarbon ceramic-filled thermoset materials that provide the ideal balance of performance and processing capability. RO4360G2 laminates are the first high dielectric constant (Dk) thermoset laminate that can be processed similar to FR-4.   These laminates mark a significant advancement in the field as they are not only lead-free process capable, but also provide enhanced rigidity for improved processability in multi-layer board constructions, ultimately reducing material and fabrication costs.   RO4360G2 laminates can be seamlessly combined with RO4400 series prepreg and lower-Dk RO4000 laminate in multi-layer designs, expanding their versatility.     Features Let's discuss some prominent features of RO4360G2.   It has a high Dk of 6.15 (Design Dk 6.4), allowing designers to reduce circuit dimensions in applications where size and cost are critical.   They boast a low dissipation factor of 0.0038 at 10 GHz, ensuring minimal signal loss and improved signal integrity.   The laminates also demonstrate a high thermal conductivity of 0.75 W/(m-K), effectively dissipating heat and promoting thermal management within the circuitry.   Additionally, their low Z-axis coefficient of thermal expansion of 28 ppm/°C contributes to their reliability and stability, particularly in plated through hole connections.   Finally, the laminates exhibit a high glass transition temperature (Tg) exceeding 280 °C TMA, further enhancing their durability and suitability for demanding environments.   PCB Capability (RO4360G2) PCB Material: Hydrocarbon Ceramic-filled Thermoset Materials Designation: RO4360G2 Dielectric constant: 6.15 ±0.15 Layer count: Double Layer, Multilayer, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) PCB thickness: 8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold etc..   PCB Capability (RO4360G2) Our facility boasts an extensive range of PCB manufacturing capabilities. We specialize in the production of double layer boards, multi-layer, and Hybrid PCBs, allowing us to cater to a diverse range of circuit complexities and design requirements.   When it comes to copper weight, we offer the flexibility of choosing from 1oz (35µm) and 2oz (70µm) options, enabling you to select the desired level of conductivity that aligns with your specific needs.   For PCB thickness, we provide a range of options, including 8mil (0.203mm), 12mil (0.305mm), 16mil (0.406mm), 20mil (0.508mm), 24mil (0.610mm), 32mil (0.813mm), and 60mil (1.524mm).   In terms of PCB size, our capabilities support dimensions of up to 400mm X 500mm, accommodating various form factors and allowing for larger-scale designs.   To cater to your visual preferences, we offer a diverse selection of solder mask colors, including green, black, blue, yellow, red, and more. When it comes to surface finish, we provide a range of options such as bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold, and more, ensuring you have the freedom to choose the most suitable finish for your requirements.     Applications RO4360G2 PCBs are commonly utilized in various applications, including but not limited to Base Station Power Amplifiers and Small Cell Transceivers, among others.   Thank you for watching. I’ll see you next time.

Introduction Rogers RT/duroid 5880LZ laminates are filled PTFE composites designed for exacting strip-line and micro-strip circuit applications. They are characterized by the unique filler that contributes to their low density and lightweight nature. This makes them particularly well-suited for applications that require high performance while being sensitive to weight considerations.     Features One of the key features is their low dielectric constant (Dk) of 2.00 +/- 0.04. This low DK is uniform from panel to panel and is constant over a wide frequency range.   They exhibit a low dissipation factor ranging from 0.0021 to 0.0027 at 10GHz, further enhancing their electrical performance.   RT/duroid 5880LZ possesses a low Z-axis coefficient of thermal expansion, measuring 40 ppm/°C. The low Z-axis CTE provides reliable plated through-hole quality, even in severe thermal shock applications.   Furthermore, these laminates possess a low density of 1.4 gm/cm3, which contributes to their lightweight nature. This attribute is particularly advantageous in weight-sensitive applications where reducing overall weight is crucial.   In addition to their electrical and thermal properties, RT/duroid 5880LZ laminates offer exceptional resistance to solvents and reagents commonly used in etching or plating processes. They can withstand exposure to various substances, whether hot or cold, without compromising their structural integrity or electrical performance.   PCB Capability (RT/duroid 5880LZ) PCB Material: Unique Filled PTFE Composites Designation: RT/Duroid 5880LZ Dielectric constant: 2.00 +/- 0.04 Dissipation Factor 0.0021 10GHz Layer count: Single Sided, Double Sided, Multilayer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Laminate thickness: 10mil (0.254mm), 20mil (0.508mm), 50mil (1.270mm), 100mil (2.540mm ) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold plated etc..   PCB Capability (RT/duroid 5880LZ): Our PCB manufacturing capabilities on RT/duroid 5880LZ materials are outlined in this table.   We can provide you with single sided PCB, double-sided PCBs, multilayer PCBs and hybrid configuration, accommodating diverse design requirements.   The available options for copper weight include 1oz (35µm) and 2oz (70µm), allowing flexibility in meeting specific conductivity needs.   RT/duroid 5880LZ is available in various thicknesses of 10mil (0.254mm), 20mil (0.508mm), 50mil (1.270mm), and 100mil (2.540mm), providing versatility for different applications.   The maximum size we can support is 400mm X 500mm, ensuring compatibility with larger designs.   Various solder mask color options are available, including green, black, blue, yellow, red, and more, catering your specific requirements.   Different surface finish options are available, such as bare copper, HASL, ENIG, immersion silver, immersion tin, ENEPIG, OSP, pure gold plating, among others, providing flexibility for specific requirements and compatibility with different assembly processes.     Applications RT/duroid 5880LZ PCBs find applications in a variety of fields, including airborne antenna systems, lightweight feed networks, radar systems, guidance systems, point-to-point digital radio antennas, and more.   Thank you for watching. I’ll see you next time.

Introduction Rogers RT/duroid 6002 laminates are advanced microwave materials that combine ceramic-filled PTFE with low loss and low dielectric constant. They are specifically designed for complex microwave structures. These laminates exhibit exceptional mechanical and electrical properties, making them highly reliable for use in multi-layer board constructions.     Features RT/duroid 6002 laminates have a dielectric constant of 2.94, with a tolerance of +/- .04. This property is important for maintaining signal integrity in microwave applications.   These laminates exhibit a low thermal coefficient of Dk, measuring at 12 ppm/°C. This ensures the dielectric constant remains stable over a wide temperature range, minimizing any variations in electrical performance.   The dissipation factor, or loss tangent, of the RT/duroid 6002 laminates is .0012 at a frequency of 10 GHz. This indicates the material's ability to minimize signal loss and maintain high signal quality, ensuring efficient transmission of microwave signals.   These laminates also possess a low Z-axis coefficient of thermal expansion, measuring at 24 ppm/°C. This characteristic indicates the material's stability and resistance to dimensional changes when exposed to temperature variations, reducing the risk of warping or delamination in multi-layer board constructions.   PCB Capability (RT/duroid 6002) PCB Material: Ceramic-filled PTFE composite Designation: RT/duroid 6002 Dielectric constant: 2.94 ±0.04 (process) 2.94 (design) Layer count: 1-layer, 2-layer, multi-layer, hybrid design Copper weight: 1oz (35µm), 2oz (70µm) PCB thickness: 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm), 120mil (3.048mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immserion Silver, Immersion tin, Pure gold, ENEPIG, OSP etc..   PCB Capability Our PCB manufacturing capabilities on RT/duroid 6002 material encompass the following:   We offer flexibility in layer count, ranging from 1-layer, 2-layer, to multi-layer and hybrid designs.   Our capabilities include accommodating copper weights of 1oz (35µm) and 2oz (70µm). This provides options to suit specific design and application requirements。   We offer a range of PCB thickness options to cater to different needs. This includes 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm), and 120mil (3.048mm).   Our manufacturing capabilities support PCB sizes up to a maximum of 400mm X 500mm. This provides ample space for accommodating diverse PCB designs, allowing for larger and more complex circuitry.   We offer a selection of solder mask colors, including Green, Black, Blue, Yellow, Red, and more.   Our capabilities include various surface finish options to meet different requirements. These options comprise Bare copper, HASL, ENIG, Immersion Silver, Immersion tin, Pure gold (with no nickel under gold), ENEPIG, OSP and so on.     Applications RT/duroid 6002 High Frequency PCBs find widespread application in various fields, including Phased Array Antennas, Ground Based and Airborne Radar Systems, Global Positioning System Antennas, Power Backplanes, Commercial Airline Collision Avoidance, and more.   Thank you. I’ll see you next time.

Introduction: Rogers TMM 4 is a thermoset microwave material designed to offer high plated-thru-hole reliability for strip-line and micro-strip applications. It is a composite material that combines the advantageous characteristics of ceramics, hydrocarbons, and thermoset polymers.   TMM 4 materials possess robust mechanical and chemical properties, providing many of the benefits found in both ceramic and traditional PTFE laminates. Unlike those materials, TMM 4 laminates do not require specialized production techniques. They are based on thermoset resins, ensuring reliable wire-bonding without the risk of pad lifting or substrate deformation.     Features TMM4 laminates offer several key features as follows:   It has a dielectric constant of 4.50 +/- .045, providing stable electrical properties for high-frequency applications, and a dissipation factor of .0020 at 10GHz, indicating low signal loss and efficient signal transmission.   TMM4 has a thermal coefficient of Dk of 15ppm/°K, ensuring minimal changes in electrical performance with temperature variations.   The coefficient of thermal expansion is matched to copper, with values of x = 16 ppm/°K, y = 16 ppm/°K, and z = 21 ppm/°K. This compatibility reduces the risk of stress-related issues during thermal cycling.   TMM4 laminates have a high decomposition temperature (Td) of 425 °C TGA, ensuring their stability and reliability under elevated temperature conditions.   It exhibits a thermal conductivity of 0.7 W/mk, facilitating efficient heat dissipation in high-power applications.   TMM4 shows excellent resistance to moisture-related issues with moisture absorption rates of 0.07% for a thickness of 50mil and 0.18% for a thickness of 125mil.   PCB Capability (TMM4) PCB Material: Composite of Ceramic, hydrocarbon and thermoset polymer Designator: TMM4 Dielectric constant: 4.5 ±0.045 (process); 4.7 (design) Layer count: Single Sided, Double Sided, Multi-layer, Hybrid designs Copper weight: 1oz (35µm), 2oz (70µm) Laminate thickness: 15mil (0.381mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm), 150mil (3.810mm), 200mil (5.08mm), 250mil (6.35mm), 500mil (12.7mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, Pure gold (no nickle under gold), OSP, ENEPIG   PCB Capability Our PCB manufacturing capability on TMM4 laminates is summarized in the following table.   We offer single sided, double sided, multi-layer and hybrid PCBs, providing flexibility to meet different design requirements.   We support copper weights of 1oz (35µm) and 2oz (70µm), allowing you to choose the appropriate copper weight for your specific application.   We provide a wide range of laminate thickness options to suit your needs, such as 15mil (0.381mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), up to 500mil (12.7mm).   Our manufacturing capabilities support PCB sizes up to 400mm X 500mm, providing ample space for your designs.   We offer a variety of solder mask colors to suit your preferences and requirements, such as green, black, blue, yellow, red, and more.   Our surface finish options include bare copper, HASL, ENIG, immersion tin, immersion silver, pure gold (with no nickel under gold), OSP, and ENEPIG etc.     Typical Applications TMM4 High-Frequency PCBs are commonly used in various applications including power amplifiers and combiners, filters and couplers, satellite communication systems, Global Positioning Systems (GPS) antennas, patch antennas, and chip testers etc.   Thank you for watching. I'll see you next time.

Introduction RO3003 laminates are ceramic-filled PTFE-based circuit materials that offer a combination of electrical performance, mechanical stability, and cost-effectiveness. They provide a competitive solution for commercial microwave and RF applications, where high-frequency performance and consistent electrical characteristics are essential.   With its stable dielectric constant over temperature and frequency variations, RO3003 is particularly well-suited for applications such as automotive radar (77 GHz), advanced driver assistance systems (ADAS), and 5G wireless infrastructure operating in mmWave frequency bands. These applications require precise and reliable performance, and the stability of RO3003 laminates helps ensure accurate signal propagation and optimal functionality.     Features & Benefits Now let's explore the impressive features of this product.   It features a Dk of 3.00 +/- .04, ensuring precise and consistent performance.   With a dissipation factor of only .0010 at 10 GHz, it guarantees minimal signal loss.   Additionally, it offers low X, Y, and Z axis CTE values of 17, 16, and 25 ppm/°C, respectively, promoting excellent dimensional stability.     Moving on to the benefits, its low Dk loss enables seamless utilization in applications up to 77 GHz, delivering exceptional performance.   Moreover, this product is ISO 9001 certified, ensuring top-notch quality standards.   Last but not least, its economical laminate pricing makes it a cost-effective choice without compromising on quality.   PCB Capability (RO3003) PCB Material: Ceramic-filled PTFE composites Designation: RO3003 Dielectric constant: 3.00± 0.04 Dissipation Factor 0.001 10GHz Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) PCB thickness: 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm ) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc..   PCB capability Let's dive into the key specifications of our PCB offerings.   We provide flexibility in layer count, catering to various requirements including Single Sided, Double Sided, Multi-layer PCB, and even Hybrid PCB options.   You can choose from different copper weight options, such as 1oz (35µm) or 2oz (70µm), to meet your specific needs.   The dielectric thickness options range from 5mil (0.127mm) to 60mil (1.524mm), allowing for precise customization.   Our PCB size capability extends up to 400mm X 500mm, accommodating a wide range of project sizes.   When it comes to solder mask colors, we offer choices like Green, Black, Blue, Yellow, Red, and more.   For surface finish, you have a variety of options including Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, and Pure gold, ensuring compatibility with your desired application.     Applications With its exceptional performance, RO3003 PCBs are widely utilized in various industries. It is a go-to choice for automotive radar, global positioning satellite antennas, cellular telecommunications systems, patch antennas for wireless communications, remote meter readers, and power backplanes etc.   Thank you. I’ll see you next time.

Introduction Rogers RO4003C materials feature proprietary woven glass reinforced hydrocarbon/ceramics. They offer the electrical performance equivalent to PTFE/woven glass and the manufacturability found in epoxy/glass composites.   RO4003C laminates incorporate both 1080 and 1674 glass fabric styles with all configurations, ensuring consistent electrical performance. They excel in maintaining precise control on dielectric constant (Dk) and minimizing signal loss, all while employing the same processing method as standard epoxy/glass laminates. The remarkable aspect is that these laminates achieve such high performance levels at a significantly reduced cost compared to traditional microwave laminates.     Features and Benefits With a dielectric constant (Dk) of 3.38 +/- 0.05, RO4003C laminates offer exceptional stability and consistency in signal transmission.   Additionally, boasting a dissipation factor of 0.0027 at 10 GHz, they ensure minimal signal loss, enabling high-frequency applications to thrive.   But that's not all. RO4003C laminates also exhibit a low Z-axis coefficient of thermal expansion, measuring only 46 ppm/°C. The low Z-axis CTE ensures reliable plated through-hole quality, even in severe thermal shock applications.   These properties make them ideal for multi-layer board (MLB) constructions. And impressively, these laminates can be processed using the same methods as FR-4, a common and cost-effective material in the industry. This compatibility translates to lower fabrication costs, making RO4003C laminates an economical choice without compromising on performance.   PCB Capability (RO4003C) PCB Material: Glass reinforced hydrocarbon ceramic laminates Code: RO4003C Dielectric constant: 3.38 ±0.05 (process) ; 3.55 (design) Layer count: 1 Layer, 2 Layer, Multi-layer, Hybrid type (Mixed) Copper weight: 1oz (35µm), 2oz (70µm) Laminate thickness: 8mil (0.203mm), 12mil (0.305mm), 20mil (0.508mm), 32mil (0.813mm), 60mil (1.524mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, OSP, Immersion silver, Immersion tin, ENEPIG, Pure gold etc.   PCB Capability Our manufacturing capability covers a range of layer counts, including double layer, multilayer, and hybrid PCBs, allowing you to achieve the desired complexity and functionality for your designs.   You have the flexibility to select the copper weight that suits your requirements, with options including 1oz (35µm), and 2oz (70µm), ensuring optimal conductivity and performance.   When it comes to RO4003C thickness options, we provide a range of choices to suit your specific requirements. Select from 8mil (0.203mm), 12mil (0.305mm), 16mil (0.406mm), 20mil (0.508mm), 32mil (0.813mm), and 60mil (1.524mm).   Rest assured, the maximum PCB size we can manufacture is 400mm X 500mm, accommodating a wide range of project sizes and dimensions.   For the solder mask, we offer a variety of options to match your preferences, such as green, black, blue, yellow, red, and more, ensuring both functionality and aesthetic appeal.   When it comes to surface finish, we provide multiple options to meet your specific needs, such as bare copper, HASL, ENIG, OSP, Immersion silver, Immersion tin, ENEPIG, and pure gold etc.     Applications RO4003C PCBs find widespread application in various industries and technologies, such as cellular base station antennas, power amplifiers, RF identification tags, automotive radar and sensors, as well as LNBs for direct broadcast satellites.   Thank you. I’ll see you next time.

Introduction Rogers RT/duroid 5870 high frequency laminates are PTFE composites reinforced with glass microfibers, specifically engineered for the precise demands of stripline and microstrip circuit applications. These composites possess exceptional dielectric constant uniformity due to the presence of randomly oriented microfibers.   RT/duroid 5870 laminates offer high frequency with low dielectric constant (Dk), making them well suited for high frequency/broadband applications where dispersion and losses need to be minimized. Moreover, their low dissipation factor expands the utility to frequencies in the Ku-band and above.   Features RT/duroid 5870 exhibits a low dielectric constant of 2.33 and a low dissipation factor of 0.0012, verified at 10 GHz.   Due to its PTFE properties, the material demonstrates minimal moisture absorption, as low as 0.02%. This characteristic makes it an ideal choice for environments with high moisture content.   Furthermore, RT/duroid 5870 showcases the lowest electrical loss among reinforced PTFE materials, possesses isotropic properties with uniform electrical characteristics across a range of frequencies, and exhibits excellent resistance to various chemicals.   PCB Capability (RT/duroid 5870) PCB Material: Glass Microfiber Reinforced PTFE Composites Designation: RT/duroid 5870 Dielectric constant: 2.33 ± 0.02 at 10GHz Dissipation Factor 0.0012 at 10GHz Layer count: Single layer, Double layer, Multi-layer PCB, Hybrid PCB Laminate thickness: 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 31mil (0.787mm), 62mil (1.575mm ) Copper weight: 1oz (35µm), 2oz (70µm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Red, Yellow etc. Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, Pure gold, OSP, Bare copper etc..   PCB Capability Our offerings for RT/duroid 5870 PCBs encompass single layer boards, double layer boards, multi-layer boards, and hybrid types.   These PCBs come in a wide range of thicknesses, including standard options such as 10 mils, 15 mils, 20 mils, 31 mils, and 62 mils, among others.   The finished copper on the PCBs is available in 1oz and 2oz options.   Our maximum high frequency PCB size can be 400mm by 500mm, accommodating both single boards and multiple designs on a single panel.   We offer a variety of solder mask colors, such as green, black, blue, red and yellow etc.   For surface finishes, immersion gold, HASL, immersion silver, immersion tin, ENEPIG, pure gold, OSP and bare copper are available.     Typical Applications: The versatility of RT/duroid 5870 makes it well-suited for various applications, including commercial airline broadband antennas, microstrip and stripline circuits, millimeter wave applications, military radar systems, missile guidance systems, and point-to-point digital radio antennas etc.   Thank you. I’ll see you next time.

Introduction Rogers RT/duroid 6010.2LM laminates are ceramic-PTFE composites specifically engineered for electronic and microwave circuits that demand a high dielectric constant. With its high dielectric constants (Dk), these laminates enable circuit size reduction, providing more compact and efficient designs. They are particularly well-suited for applications operating within X-band frequencies or lower due to their low loss properties.     Features The RT/duroid 6010.2LM laminate offers several advantageous features:   Dielectric Constant (Dk): With a value of 10.2 and a tight tolerance of +/- 0.25, the laminate ensures precise Dk control, resulting in consistent and repeatable circuit performance.   Low Dissipation Factor: At just .0023 at 10 GHz, the laminate minimizes signal attenuation and distortion, facilitating reliable signal transmission.   Copper Foil Options: The Rogers 6010.2LM laminate offers flexible copper foil options, allowing you to choose between Electro-Deposited (ED) copper and Reverse-Treated Foil (RTF) copper. This flexibility enables catering to specific requirements in PCB manufacturing, including considerations such as insertion loss and PIM performance.   Moisture Absorption: The laminate exhibits low moisture absorption, enhancing its resistance to environmental conditions and preserving its electrical properties over time.   Coefficient of Thermal Expansion (CTE): The CTE values for the XYZ axes are 24, 24, and 47 ppm/°C, respectively. This supports the reliability of plated through-holes in multi-layer boards by ensuring secure and robust connections between layers, contributing to the overall reliability of the circuit.   PCB Capability (RT/duroid 6010.2LM) PCB Material: Ceramic-PTFE composite Designator: RT/duroid 6010.2LM Dielectric constant: 10.2 ±0.25 (process); 10.7 (design) Layer count: Single Sided, Double Sided, Multi-layer, Hybrid Construction Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness: 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.90mm), 100mil (2.54mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, OSP, Pure gold, ENEPIG.   PCB Capability Now let’s delve into our capabilities on 6010.2 materials.   We can offer a variety of configurations to suit your needs, including Single Sided, Double Sided, Multi-layer, and Hybrid types to meet your specific design requirements.   Copper weight options include 1oz (35µm) and 2oz (70µm) and dielectric thickness includes 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.90mm), and 100mil (2.54mm).   We can accommodate the sizes up to 400mm X 500mm, and solder mask colors such as Green, Black, Blue, Yellow, Red etc are available.   We also provide a diverse range of surface finish options, including Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, OSP, Pure gold, and ENEPIG etc.     PCB and Applications The utilization of RT/duroid 6010.2LM PCBs extends to various cutting-edge applications, including Patch Antennas, Satellite Communications Systems, Power Amplifiers, Aircraft Collision Avoidance Systems, and Ground Radar Warning Systems etc.   Thank you. I’ll see you next time.

Introduction Rogers TC350 laminates are composite substrates of PTFE, highly thermally conductive ceramic fillers and woven glass reinforcement, offering outstanding thermal conductivity to enhance heat transfer, thereby reducing dielectric and insertion loss, which results in higher gains and efficiencies in amplifiers and antennas. Its increased thermal conductivity handles higher power, reduces hot-spots, and boosts device reliability.   TC350 laminates are effective in designs with limited thermal management, improving heat transfer through the laminate, lowering junction temperatures, and extending the lifespan of active components. Its lower operating temperatures and matching thermal expansion characteristics with chips enhance component attachment reliability, reducing issues like solder fatigue and joint failure.     Features and Benefits The TC350 laminate has a Dk of 3.5, ensuring precise impedance control and efficient signal transmission in high-frequency applications. It exhibits excellent thermal conductivity of 0.72W/m-K, allowing for effective heat dissipation through the laminates.   TC350 maintains low thermal coefficient of Dk at -9 ppm/°C (-40°C to 140°C) minimizing the impact of temperature changes on the PCB, ensuring reliable signal transmission.   It features a low loss tangent of 0.002 at 10GHz, resulting in minimal signal loss. This feature improves bandwidth utilization and increases the efficiency of amplifiers and antennas operating at high frequencies.   TC350 exhibits low coefficients of thermal expansion on X, Y, and Z axes (7, 7, and 23 ppm/°C, respectively), providing reliable plated through hole connections and excellent dimensional stability.   Our PCB Capability (TC350) PCB Material: Woven Fiberglass Reinforced, Ceramic Filled, PTFE Composite Designation: TC350 Dielectric constant: 3.5±0.05 Thermal Conductivity 0.72 W/m-K Dissipation Factor Df .002@10 GHz Layer count: Single Layer, Double Layer, Multi-layer, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, OSP, Immersion silver, Immersion tin, ENEPIG, Pure gold etc..   PCB Capability Our PCB manufacturing capability allows for the production of single -sided, double-sided, multi-layer boards, and hybrid PCBs.   You can choose from copper weight options of 1oz (35µm) and 2oz (70µm).   We accommodate various PCB thicknesses, including 10mil, 20mil, 25mil, 60mil, and 125mil, and the maximum PCB size we can manufacture is 400mm X 500mm.   We offer multiple solder mask options such as green, black, blue, yellow, and red, as well as different surface finish options including bare copper, HASL, ENIG, OSP, immersion silver, immersion tin, ENEPIG, pure gold and so on.     Applications TC350 finds widespread applications in power amplifiers, filters, couplers, tower-mounted amplifiers (TMA), tower-mounted boosters (TMB), microwave combiner and power dividers etc.   Thank you. See you next time.

Introduction Rogers RO4350B laminates are a proprietary blend of woven glass reinforced hydrocarbon/ceramics that offer electrical performance comparable to PTFE/woven glass and the manufacturability advantages of epoxy/glass.   RO4350B materials exhibit precise control over dielectric constant (Dk) while maintaining low loss, using the same processing method as standard epoxy/glass laminates. They are a cost-effective alternative to traditional microwave laminates and eliminate the need for specialized through-hole treatments or handling procedures required by PTFE-based materials. These materials have achieved UL 94 V-0 rating, making them suitable for active devices and high-power RF designs.     Features One of the key features of RO4350B is their low dielectric constant of 3.48 at 10 GHz. A low dielectric constant is desirable in high-frequency applications as it aids in minimizing signal loss and improving signal integrity.   RO4350B exhibits a dissipation factor of 0.0037 at 10 GHz. A low dissipation factor is crucial for minimizing signal loss and maintaining high signal quality in high-frequency circuits.   Another advantage of RO4350B is its excellent dimensional stability. It has a low Z-axis coefficient of thermal expansion at 32 ppm/°C. The expansion coefficient is similar to that of copper, which make the board's dimensions remain consistent even under varying temperature conditions.   RO4350B materials also have a high glass transition temperature (Tg) of over 280°C (536°F). The high Tg ensures that the PCB retains its structural integrity and dimensional stability even during the elevated temperatures experienced during the circuit assembly process.   Our PCB Capability (RO4350B) PCB material: Glass reinforced hydrocarbon ceramic laminates Designator: Rogers RO4350B Dielectric constant: 3.48 ±0.05 (process) 3.65 (design) Layer count: Single Layer, Double Layer, Multi-layer, Hybrid Designs Copper weight: 1oz (35µm), 2oz (70µm) Laminate thickness: 4mil (0.102mm), 6.6mil (0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion Silver, Immersion tin, OSP, ENEPIG, Pure gold etc.   PCB Capability For RO4350B PCBs, we can offer single-sided, double-sided, multi-layer, and hybrid boards.   The available thicknesses include standard options like 10 mils, 20 mils, 30 mils, and 60 mils, as well as non-standard thicknesses like 4 mils, 6.6 mils, 13.3 mils, and 16.6 mils.   The finished copper on the PCBs can be either 1oz or 2oz.   The maximum PCB size we can provide is 400mm by 500mm.   Additionally, we offer a range of solder mask colors, including green, black, red, and yellow etc.   For pads plating, we offer various options of bare copper, HASL, immersion gold, immersion silver, immersion tin, OSP, ENEPIG, pure gold and so on.     Applications RO4350B PCBs have demonstrated remarkable success in various applications over the past decades. They have been widely utilized in high-power amplifiers, microwave power amplifiers, cellular base station antennas, and more.   Thank you. See you next time!