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Introduction
The Rogers TMM13i isotropic thermoset microwave material is a ceramic thermoset polymer composite tailored for high reliability in plated thru-hole strip-line and micro-strip applications. It features an isotropic dielectric constant (Dk) and integrates the advantageous properties of both ceramic and PTFE substrates, while allowing for the convenience of soft substrate processing methods.
Features
TMM13i laminates have a low thermal coefficient of dielectric constant of -70 ppm/°C, which ensures consistent dielectric performance over a wide temperature range, making it ideal for applications with expected temperature fluctuations.
The material’s isotropic coefficients of thermal expansion of 19, 19 and 20ppm/°C on X, Y and Z direction, very closely matched to copper, allow for production of high reliability plated through holes, and low etch shrinkage values.
Furthermore, TMM13i features a high dielectric constant of 12.85±0.35, allowing for the miniaturization of components and facilitating the development of more compact electronic devices.
Its low dissipation factor of 0.0019 at 10 GHz further enhances efficiency by minimizing energy loss, making it ideal for microwave circuits.
| PCB Material: | Ceramic, Hydrocarbon, Thermoset Polymer Composites |
| Designation: | TMM13i |
| Dielectric constant: | 12.85±0.35 |
| Layer count: | Single Layer,Double Layer, Multi-layer, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness: | 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, ENEPIG, Pure gold etc.. |
PCB Capability
We are excited to present our PCB manufacturing capabilities using TMM13i material.
Our facility accommodates a diverse range of configurations, including single-layer, double-layer, multilayer, and hybrid PCBs, ensuring we can meet the unique requirements of your projects.
Copper weight options of 1 oz (35 µm) and 2 oz (70 µm) are available to cater to the specific electrical conductivity needs of your applications.
Additionally, multiple dielectric thicknesses are allowed by our manufacturing process, ranging from 15 mil (0.381 mm) to an impressive 500 mil (12.7 mm).
We can accommodate large sizes up to 400 mm x 500 mm, making them suitable for a wide range of applications.
To complement your design, we provide a selection of solder mask colors, including green, black, blue, yellow, and red, allowing you to align with your branding or functional needs.
For optimal performance and reliability, we offer an array of surface finish options, including bare copper, HASL, ENIG, OSP, immersion tin, immersion silver, ENEPIG, and pure gold.
Applications
TMM13i PCB is well-suited for various applications, such as chip testers, dielectric polarizers, lenses, filters, couplers, RF and microwave circuitry, and satellite communication systems etc.