English
Introduction
Rogers Kappa 438 was developed to address the growing performance demands of the wireless market, which traditional FR-4 materials could not meet. As wireless data usage has surged, the need for higher network capacity and reliability has become crucial. Kappa 438 offers superior dielectric properties, lower loss, and tighter tolerances, making it ideal for advanced RF applications, including small cells and carrier-grade Wi-Fi.
Kappa 438 laminates were designed using a glass reinforced hydrocarbon ceramic system that offers superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes.
Features
Kappa 438 laminates offer dielectric constants (Dk) of 4.38 at 2.5GHz, which is tailored to FR-4 industry standard norms, facilitating smooth integration into existing designs that demand improved electrical performance.
Kappa 438 has tighter Dk and thickness tolerances compared to traditional FR-4, enabling more precise circuit design and improved signal integrity.
Additionally, Kappa 438 boasts low X Y and Z-axis coefficient of thermal expansion (CTE) of 13, 16, and 42 ppm/°C respectively, allowing for greater dimensional stability and plated through hole reliability under varying thermal conditions.
The high glass transition temperature (Tg) of over 280°C (TMA) ensures that Kappa 438 can withstand demanding thermal environments, making it suitable for a wide range of applications.
Furthermore, it meets UL 94-V0 flame retardant requirements, providing enhanced safety and reliability in critical electronic systems.
| PCB Material: | Glass Reinforced Hydrocarbon Ceramic |
| Designation: | Kappa 438 |
| Dielectric constant: | 4.38 at 2.5GHz |
| Layer count: | Single Layer, Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 1oz (35 µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersoin silver, Immersion tin, OSP, ENEPIG, Pure gold etc.. |
PCB Capability
We are proud to offer a comprehensive range of PCB manufacturing capabilities to meet the diverse needs of our clients.
Our expertise spans across various layer counts, including single-layer, double-layer, multilayer, and hybrid PCBs.
Our manufacturing process supports multiple copper weights, with options of 1 oz (35 µm) and 2 oz (70 µm).
We also offer a variety of PCB thicknesses, ranging from 10 mils (0.254 mm) to 60 mils (1.524 mm), catering to different design requirements.
In terms of size, our PCBs can be produced up to 400 mm x 500 mm, making them suitable for a wide array of electronic devices.
We provide a selection of solder mask colors, including green, black, blue, yellow, and red.
For surface finishes, we offer an extensive array of options such as bare copper, HASL, ENIG, immersion silver, immersion tin, OSP, ENEPIG, and pure gold.
Applications
Kappa 438 PCBs are used for a variety of advanced applications, including: Carrier Grade WiFi, Licensed Assisted Access (LAA), Small Cell and Distributed Antenna Systems (DAS), Vehicle to Vehicle/Vehicle to Infrastructure Communications (V2X), and Internet of Things (IoT) etc.