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Introduction
AD300D laminates are ceramic-filled, glass-reinforced PTFE-based materials designed to offer a controlled dielectric constant, low loss performance, and excellent passive intermodulation (PIM) performance. They are specifically engineered and manufactured to meet the demands of today’s wireless antenna markets.This PTFE resin based material is compatible with standard PTFE fabrication and provides a cost-effective construction to improve electrical and mechanical performance.
Features
The AD300D laminates demonstrate an outstanding passive intermodulation (PIM) value of -159 dBc at 30 mil and -163 dBc at 60 mil, measured with reflected 43 dBm swept tones at 1900 MHz. This low PIM performance enhances antenna efficiency and reduces yield loss due to PIM-related issues.
AD300D features controlled dielectric constant of 2.94 at 10 GHz, and low dissipation factor of 0.0021 at 10 GHz, 23°C, and 50% relative humidity.
Additionally, the thermal coefficient of the dielectric constant is measured at -73 ppm/°C across a temperature range of 0-100°C at 10 GHz, underscoring its stability under varying thermal conditions.
Boasting remarkable thermal resilience, AD300D surpasses a decomposition temperature (Td) exceeding 500°C.
Its coefficient of thermal expansion stands at 24 ppm/°C in the X-axis, 23 ppm/°C in the Y-axis, and 98 ppm/°C in the Z-axis within a temperature range of -55 to 288°C.
Furthermore, AD300D offers robust adhesion and durability, showcasing over 60 minutes of resistance to delamination at 288°C.
The material's moisture absorption rate is minimal, at just 0.04% under E1/105 + D48/50 conditions.
| PCB Material: | Ceramic-filled, glass-reinforced PTFE-based Composites |
| Designation: | AD300D |
| Dielectric constant: | 2.94 (10 GHz) |
| Dissipation factor: | 0.0021 (10 GHz) |
| Layer count: | Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), 120mil (3.048mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare copper, Pure gold etc.. |
PCB Capability
Our PCB manufacturing capabilities for AD300D encompass a wide range, including single-sided, double-sided, multi-layer, and hybrid PCBs.
You can select copper weight options of 1 oz (35 µm) or 2 oz (70 µm) based on your specific requirements.
Dielectric thickness is available from 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), and 120mil (3.048mm).
With a maximum PCB size of 400 mm x 500 mm, we accommodate either a single board within these dimensions or multiple designs on a panel of the same size.
We offer a variety of solder mask options including Green, Black, Blue, Yellow, Red, and more to suit your preferences.
Furthermore, we provide an array of surface finish choices such as Immersion Gold, HASL, Immersion Silver, Immersion Tin, OSP, ENEPIG, Bare Copper, and Pure Gold to cater to diverse needs and specifications.
Applications
AD300D PCBs are versatile and well-suited for a diverse range of applications, including Cellular infrastructure base station antennas, Automotive telematics antenna systems and Commercial satellite radio antenna.