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Introduction
Rogers AD255C laminates are a sophisticated blend of a fluoropolymer resin system, carefully selected ceramic elements, and fiberglass reinforcement. By leveraging the exceptional thermal properties of fluoropolymer resin, alongside the strategic integration of ceramic materials and fiberglass reinforcement, AD255C materials stand out for their reduced loss, lower thermal expansion characteristics, and minimized passive intermodulation (PIM) effects. This unique combination results in a specialized RF laminate material that excels in a variety of microwave and RF applications within telecommunication infrastructure.
Features
The AD255C boasts several remarkable features, including:
Very Low Loss PTFE and Ceramic Filled Composite: This advanced composite merges PTFE with ceramic fillers, resulting in exceptionally low signal loss, making it perfect for high-frequency applications.
Exceptional Loss Tangent: With a loss tangent of only 0.0014 at 10 GHz and base station frequencies, this material guarantees efficient signal transmission, minimizing energy waste and enhancing overall performance.
Dielectric Constant of 2.55: The material features a dielectric constant of 2.55, providing reliable electrical insulation with tight tolerances, which is vital for maintaining signal integrity in sensitive applications.
Low Profile Copper: The inclusion of low profile copper enhances conductivity while preserving a compact design, making it ideal for space-constrained environments.
Low Z-Direction CTE: With a coefficient of thermal expansion (CTE) of 50 ppm/°C in the Z-direction, this material offers excellent dimensional stability across temperature variations, ensuring consistent performance under a wide range of operating conditions.
| PCB Material: | Glass-reinforced, PTFE based Composites |
| Designation: | AD255C |
| Dielectric constant: | 2.55 (10 GHz) |
| Dissipation Factor | 0.0014 (10 GHz) |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness: | 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), 125mil (3.175mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red, Purple etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare copper, Pure gold etc.. |
PCB Capability
We offer a diverse range of PCB manufacturing capabilities to meet your project specifications, including double-sided PCBs, multi-layer PCBs, and hybrid boards.
Copper weight options available in 1oz (35µm) and 2oz (70µm), as well as various dielectric thickness options ranging from 20mil (0.508mm) to 125mil (3.175mm).
The maximum PCB size we can accommodate is 400mm x 500mm, whether as a single board within these dimensions or multiple designs on a panel of this size.
In terms of solder mask options, we provide a selection of colors such as Green, Black, Blue, Yellow, Red, Purple, and more.
Moreover, we offer a range of surface finish options, including Immersion gold, HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare copper, Pure gold plated, and others to suit various preferences and requirements.
Applications
Typical applications of AD255C PCBs include Cellular infrastructure base station antenna, Automotive telematics antenna systems and Commercial satellite radio antenna etc.