Bicheng Electronics Technology Co., Ltd Cases

Shot 1: Introduction Rogers RT/duroid 5870 high frequency laminates are PTFE composites reinforced with glass microfibers, specifically engineered for the precise demands of stripline and microstrip circuit applications. These composites possess exceptional dielectric constant uniformity due to the presence of randomly oriented microfibers.   RT/duroid 5870 laminates offer high frequency with low dielectric constant (Dk), making them well suited for high frequency/broadband applications where dispersion and losses need to be minimized. Moreover, their low dissipation factor expands the utility to frequencies in the Ku-band and above.   Shot 2: Features RT/duroid 5870 exhibits a low dielectric constant of 2.33 and a low dissipation factor of 0.0012, verified at 10 GHz.   Due to its PTFE properties, the material demonstrates minimal moisture absorption, as low as 0.02%. This characteristic makes it an ideal choice for environments with high moisture content.   Furthermore, RT/duroid 5870 showcases the lowest electrical loss among reinforced PTFE materials, possesses isotropic properties with uniform electrical characteristics across a range of frequencies, and exhibits excellent resistance to various chemicals.   PCB Capability (RT/duroid 5870) PCB Material: Glass Microfiber Reinforced PTFE Composites Designation: RT/duroid 5870 Dielectric constant: 2.33 ± 0.02 at 10GHz Dissipation Factor 0.0012 at 10GHz Layer count: Single layer, Double layer, Multi-layer PCB, Hybrid PCB Laminate thickness: 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 31mil (0.787mm), 62mil (1.575mm ) Copper weight: 1oz (35µm), 2oz (70µm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Red, Yellow etc. Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, Pure gold, OSP, Bare copper etc..   Short 3: PCB Capability Our offerings for RT/duroid 5870 PCBs encompass single layer boards, double layer boards, multi-layer boards, and hybrid types.   These PCBs come in a wide range of thicknesses, including standard options such as 10 mils, 15 mils, 20 mils, 31 mils, and 62 mils, among others.   The finished copper on the PCBs is available in 1oz and 2oz options.   Our maximum high frequency PCB size can be 400mm by 500mm, accommodating both single boards and multiple designs on a single panel.   We offer a variety of solder mask colors, such as green, black, blue, red and yellow etc.   For surface finishes, immersion gold, HASL, immersion silver, immersion tin, ENEPIG, pure gold, OSP and bare copper are available.     Shot 4:Some Typical Applications: The versatility of RT/duroid 5870 makes it well-suited for various applications, including commercial airline broadband antennas, microstrip and stripline circuits, millimeter wave applications, military radar systems, missile guidance systems, and point-to-point digital radio antennas etc.   Thank you. I’ll see you next time.

Shot 1: Introduction Rogers RT/duroid 6010.2LM laminates are ceramic-PTFE composites specifically engineered for electronic and microwave circuits that demand a high dielectric constant. With its high dielectric constants (Dk), these laminates enable circuit size reduction, providing more compact and efficient designs. They are particularly well-suited for applications operating within X-band frequencies or lower due to their low loss properties.     Shot 2: Features The RT/duroid 6010.2LM laminate offers several advantageous features:   Dielectric Constant (Dk): With a value of 10.2 and a tight tolerance of +/- 0.25, the laminate ensures precise Dk control, resulting in consistent and repeatable circuit performance.   Low Dissipation Factor: At just .0023 at 10 GHz, the laminate minimizes signal attenuation and distortion, facilitating reliable signal transmission.   Copper Foil Options: The Rogers 6010.2LM laminate offers flexible copper foil options, allowing you to choose between Electro-Deposited (ED) copper and Reverse-Treated Foil (RTF) copper. This flexibility enables catering to specific requirements in PCB manufacturing, including considerations such as insertion loss and PIM performance.   Moisture Absorption: The laminate exhibits low moisture absorption, enhancing its resistance to environmental conditions and preserving its electrical properties over time.   Coefficient of Thermal Expansion (CTE): The CTE values for the XYZ axes are 24, 24, and 47 ppm/°C, respectively. This supports the reliability of plated through-holes in multi-layer boards by ensuring secure and robust connections between layers, contributing to the overall reliability of the circuit.   PCB Capability (RT/duroid 6010.2LM) PCB Material: Ceramic-PTFE composite Designator: RT/duroid 6010.2LM Dielectric constant: 10.2 ±0.25 (process); 10.7 (design) Layer count: Single Sided, Double Sided, Multi-layer, Hybrid Construction Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness: 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.90mm), 100mil (2.54mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, OSP, Pure gold, ENEPIG.   Shot 3: PCB Capability Now let’s delve into our capabilities on 6010.2 materials.   We can offer a variety of configurations to suit your needs, including Single Sided, Double Sided, Multi-layer, and Hybrid types to meet your specific design requirements.   Copper weight options include 1oz (35µm) and 2oz (70µm) and dielectric thickness includes 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.90mm), and 100mil (2.54mm).   We can accommodate the sizes up to 400mm X 500mm, and solder mask colors such as Green, Black, Blue, Yellow, Red etc are available.   We also provide a diverse range of surface finish options, including Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, OSP, Pure gold, and ENEPIG etc.     Shot 4: PCB and Applications The utilization of RT/duroid 6010.2LM PCBs extends to various cutting-edge applications, including Patch Antennas, Satellite Communications Systems, Power Amplifiers, Aircraft Collision Avoidance Systems, and Ground Radar Warning Systems etc.   Thank you. I’ll see you next time.

Shot 1: Introduction Rogers TC350 laminates are composite substrates of PTFE, highly thermally conductive ceramic fillers and woven glass reinforcement, offering outstanding thermal conductivity to enhance heat transfer, thereby reducing dielectric and insertion loss, which results in higher gains and efficiencies in amplifiers and antennas. Its increased thermal conductivity handles higher power, reduces hot-spots, and boosts device reliability.   TC350 laminates are effective in designs with limited thermal management, improving heat transfer through the laminate, lowering junction temperatures, and extending the lifespan of active components. Its lower operating temperatures and matching thermal expansion characteristics with chips enhance component attachment reliability, reducing issues like solder fatigue and joint failure.     Shot 2: Features and Benefits The TC350 laminate has a Dk of 3.5, ensuring precise impedance control and efficient signal transmission in high-frequency applications. It exhibits excellent thermal conductivity of 0.72W/m-K, allowing for effective heat dissipation through the laminates.   TC350 maintains low thermal coefficient of Dk at -9 ppm/°C (-40°C to 140°C) minimizing the impact of temperature changes on the PCB, ensuring reliable signal transmission.   It features a low loss tangent of 0.002 at 10GHz, resulting in minimal signal loss. This feature improves bandwidth utilization and increases the efficiency of amplifiers and antennas operating at high frequencies.   TC350 exhibits low coefficients of thermal expansion on X, Y, and Z axes (7, 7, and 23 ppm/°C, respectively), providing reliable plated through hole connections and excellent dimensional stability.   Our PCB Capability (TC350) PCB Material: Woven Fiberglass Reinforced, Ceramic Filled, PTFE Composite Designation: TC350 Dielectric constant: 3.5±0.05 Thermal Conductivity 0.72 W/m-K Dissipation Factor Df .002@10 GHz Layer count: Single Layer, Double Layer, Multi-layer, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, OSP, Immersion silver, Immersion tin, ENEPIG, Pure gold etc..   Shot 3: PCB Capability Our PCB manufacturing capability allows for the production of single -sided, double-sided, multi-layer boards, and hybrid PCBs.   You can choose from copper weight options of 1oz (35µm) and 2oz (70µm).   We accommodate various PCB thicknesses, including 10mil, 20mil, 25mil, 60mil, and 125mil, and the maximum PCB size we can manufacture is 400mm X 500mm.   We offer multiple solder mask options such as green, black, blue, yellow, and red, as well as different surface finish options including bare copper, HASL, ENIG, OSP, immersion silver, immersion tin, ENEPIG, pure gold and so on.     Shot 4: Applications TC350 finds widespread applications in power amplifiers, filters, couplers, tower-mounted amplifiers (TMA), tower-mounted boosters (TMB), microwave combiner and power dividers etc.   Thank you. See you next time.

Shot 1：Brief introduction Rogers RO4350B laminates are a proprietary blend of woven glass reinforced hydrocarbon/ceramics that offer electrical performance comparable to PTFE/woven glass and the manufacturability advantages of epoxy/glass.   RO4350B materials exhibit precise control over dielectric constant (Dk) while maintaining low loss, using the same processing method as standard epoxy/glass laminates. They are a cost-effective alternative to traditional microwave laminates and eliminate the need for specialized through-hole treatments or handling procedures required by PTFE-based materials. These materials have achieved UL 94 V-0 rating, making them suitable for active devices and high-power RF designs.     Shot 2：Features One of the key features of RO4350B is their low dielectric constant of 3.48 at 10 GHz. A low dielectric constant is desirable in high-frequency applications as it aids in minimizing signal loss and improving signal integrity.   RO4350B exhibits a dissipation factor of 0.0037 at 10 GHz. A low dissipation factor is crucial for minimizing signal loss and maintaining high signal quality in high-frequency circuits.   Another advantage of RO4350B is its excellent dimensional stability. It has a low Z-axis coefficient of thermal expansion at 32 ppm/°C. The expansion coefficient is similar to that of copper, which make the board's dimensions remain consistent even under varying temperature conditions.   RO4350B materials also have a high glass transition temperature (Tg) of over 280°C (536°F). The high Tg ensures that the PCB retains its structural integrity and dimensional stability even during the elevated temperatures experienced during the circuit assembly process.   Our PCB Capability (RO4350B) PCB material: Glass reinforced hydrocarbon ceramic laminates Designator: Rogers RO4350B Dielectric constant: 3.48 ±0.05 (process) 3.65 (design) Layer count: Single Layer, Double Layer, Multi-layer, Hybrid Designs Copper weight: 1oz (35µm), 2oz (70µm) Laminate thickness: 4mil (0.102mm), 6.6mil (0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion Silver, Immersion tin, OSP, ENEPIG, Pure gold etc.   Shot 3：PCB Capability For RO4350B PCBs, we can offer single-sided, double-sided, multi-layer, and hybrid boards.   The available thicknesses include standard options like 10 mils, 20 mils, 30 mils, and 60 mils, as well as non-standard thicknesses like 4 mils, 6.6 mils, 13.3 mils, and 16.6 mils.   The finished copper on the PCBs can be either 1oz or 2oz.   The maximum PCB size we can provide is 400mm by 500mm.   Additionally, we offer a range of solder mask colors, including green, black, red, and yellow etc.   For pads plating, we offer various options of bare copper, HASL, immersion gold, immersion silver, immersion tin, OSP, ENEPIG, pure gold and so on.     Shot 4：Applications RO4350B PCBs have demonstrated remarkable success in various applications over the past decades. They have been widely utilized in high-power amplifiers, microwave power amplifiers, cellular base station antennas, and more.   Thank you. See you next time!

Shot 1: Introduction Rogers RO3035 laminates are ceramic-filled, PTFE based high frequency circuit materials. These laminates are specifically designed to excel in high-frequency applications and allow designers to develop multi-layer board designs without warping or decreased reliability. One of the key advantages is their expansion coefficient, which is carefully matched to that of copper. This matching ensures exceptional dimensional stability, preventing warping or distortions in the PCBs.     Shot 2: Features: RO3035 high-frequency material features a dielectric constant (Dk) of 3.50 +/- 0.05, ensuring precise signal transmission and efficient performance. With a dissipation factor of only 0.0015 at 10 GHz, they minimize signal loss and maintain excellent signal integrity.   RO3035 laminates exhibit a low coefficient of thermal expansion (CTE) in the X, Y, and Z axes, measuring 17 ppm/°C, 17 ppm/°C, and 24 ppm/°C, respectively. This dimensional stability enhances the PCBs' reliability and prevents warping or distortions in multi-layer board designs.     Shot 3: Benefits: RO3035 materials come with several notable benefits that make them an ideal choice for high-frequency applications.   They can be effectively utilized in applications up to 30-40 GHz, offering exceptional performance in demanding frequency ranges.   They exhibit a lower operating temperature, enabling increased reliability, particularly in power amplifier circuits where heat dissipation is crucial.   And lastly, RO3035 laminates are available with rolled copper. The smoother copper surface is contributing to achieving higher signal integrity, lower insertion loss, and better overall performance.   PCB Capability (RO3035) PCB Material: Ceramic-filled PTFE Composites Designation: RO3035 Dielectric constant: 3.5 Dissipation Factor 0.0015 10GHz Layer count: Single Sided PCB, Double Sided PCB, Multilayer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Laminate thickness: 5mil(0.127mm), 10mil(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm ) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Immersin gold, Immersion silver, Immersion tin, HASL, ENEPIG, OSP, Pure gold plated, Bare copper etc..   Shot 4: PCB Capabilities We can provide you with single layer board, double layer board, multi-layer board and hybrid PCBs.   You can choose thickness for 5 mils, 10 mils, 20 mils, 30 mils and 60 mils with one ounce and two ounces.   Dimension within 400mm by 500mm is well suited for manufacture.   We also offer a wide range of colors for solder mask, including green, black, blue, yellow and red etc.   For surface finishes, Immersion gold, immersion silver, immersion tin and HASL, ENEPIG, OSP etc are available for options.     Shot 5: Applications RO3035 PCBs find applications in various high-frequency and advanced technology fields. It provides design solutions for 5G, millimeter wave sub 6GHz and massive MiMo applications etc.   Thank you. I’ll see you next time.

Shot 1: Introduction Rogers RT/duroid 6035HTC high frequency circuit materials are ceramic filled PTFE composites for use in high power RF and microwave applications. It offers outstanding performance for high-power applications. These laminates exhibit a thermal conductivity nearly 2.4 times higher than the standard RT/duroid 6000 products. They feature copper foil (ED and reverse treated) with exceptional long-term thermal stability. Moreover, Rogers' advanced filler system enhances drill-ability, resulting in reduced drilling expenses compared to conventional high thermally conductive laminates that utilize alumina fillers.     Shot 2: Features RT/duroid 6035HTC offers a dielectric constant of 3.50 with precise tolerance of +/- .05, ensuring consistent and reliable operation.   It features a low dissipation factor of .0013 at 10GHz, minimizing signal loss and ensuring efficient signal transmission at high frequencies.   RT/duroid 6035HTC exhibits high thermal conductivity of 1.44 W/m/K at 80°C, enabling effective heat dissipation and temperature management, which is particularly advantageous for high-power applications.   Utilizing thermally stable low profile and reverse treat copper foil, RT/duroid 6035HTC exhibits reduced insertion loss, features excellent thermal stability of traces, maintaining stable electrical characteristics even under varying temperature conditions.   PCB Capability (RT/duroid 6035HTC) PCB Material: Ceramic-filled PTFE composites Designation: RT/duroid 6035HTC Dielectric constant: 3.50±0.05 Layer count: Double Layer, Multilayer, Hybrid PCB Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) Laminate thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, Pure gold, OSP etc..   Shot 3: PCB Capability We offer a wide range of PCB manufacturing capabilities to cater to your specific requirements   Layer count: We provide options for Single layer, double layer, Multi-layer and Hybrid PCBs.   Copper weight: 1oz (35 µm) and 2oz (35µm) are available.   Laminate thickness: There are 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), and 60mil (1.524mm) available, accommodating various design and mechanical constraints.   PCB size: Our maximum circuit dimensions are up to 400mm X 500mm, offering versatility for different project sizes.   Solder mask colors: It includes Green, Black, Blue, Yellow, Red, and more.   Surface finishes: Options including Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, Pure gold and OSP etc.     Shot 4: Applications RT/duroid 6035HTC PCBs are well-suited for a range of applications in the field of high-power RF and microwave electronics. These applications include high-power RF amplifiers, microwave power amplifiers, couplers, filters, combiners, power dividers, and more.   Thank you, and see you next time!

Shot 1: Introduction RT/duroid 5880 laminates are composite materials composed of PTFE and random glass fibers, known for their outstanding properties. They are specifically engineered for applications that demand high frequency and broadband capabilities. These laminates possess a low dielectric constant (Dk) and low dielectric loss, making them ideal for reliable and precise signal transmission. RT/duroid 5880 maintains Dk uniformity through randomly oriented microfibers that reinforce the PTFE composites.     Shot 2: Features RT/duroid 5880 features a dielectric constant (Dk) of 2.20 +/- .02, ensuring consistent signal propagation. Its low dissipation factor of .0009 at 10GHz minimizes energy loss during transmission, maintaining high signal integrity.   This material's moisture absorption is impressively low at 0.02%, making it well-suited for high humidity environments, as it retains its electrical and mechanical properties under such conditions.   The RT/duroid 5880 exhibits isotropic behavior, enabling uniform signal propagation in all directions, making it ideal for applications requiring multi-directional signal transmission.   In addition to its electrical properties, the RT/duroid 5880 laminate is easy to work with, allowing for efficient cutting, shaping, and machining. It exhibits resistance to solvents and reagents used in etching or plating processes, ensuring durability in harsh chemical environments.   As a well-established material, RT/duroid 5880 offers the lowest electrical loss among reinforced PTFE materials, enhancing signal integrity.   PCB Capability (RT/duroid 5880) PCB Material: Glass Microfiber Reinforced PTFE Composites Designation: RT/duroid 5880 Dielectric constant: 2.2 ± 0.02 at 10GHz Dissipation Factor 0.0009 at 10GHz Layer count: Single Sided, Double Sided, Multilayer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Laminate thickness: 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 31mil (0.787mm), 62mil (1.575mm ) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, OSP, Bare copper, Pure gold, ENEPIG etc..   Shot 3: PCB Capability We provide a comprehensive range of PCB capabilities, including double-sided boards, multi-layer boards, and hybrid designs.   Our PCBs can be fully customized to meet your requirements, with options for copper weights of 1oz and 2oz, dielectric thicknesses ranging from 6mil to 127mil, and sizes up to 400mm X 500mm.   In addition, we offer a wide selection of solder mask colors to suit your preferences, including green, black, blue, yellow, red, and more.   You can also choose from a variety of surface finishes, such as immersion gold, HASL, immersion silver, immersion tin, OSP, bare copper, pure gold, and ENEPIG, ensuring compatibility with your specific needs.     Shot 4: Applications RT/duroid 5880 PCB is commonly used in various applications such as commercial airline broadband antennas, microstrip and stripline circuits, millimeter wave applications, military radar systems, missile guidance systems, and point-to-point digital radio antennas.   Thank you. See you next time.

Shot 1: brief introduction Wangling’s F4BM high frequency materials are PTFE glass fiber cloth copper clad laminates that combine glass fiber cloth, PTFE resin, and PTFE film through a meticulous manufacturing process.   These series laminates offer improved electrical performance compared to F4B due to their wider range of dielectric constants, low dielectric loss, increased insulation resistance, and enhanced stability. Consequently, they can serve as replacements for similar foreign products.   F4BM is cladded with forward-rotating ED copper foil, making it suitable for applications without PIM (Passive Intermodulation) concerns.     Shot 2: Features You have the flexibility to choose from a range of DK (dielectric constant) options spanning from 2.17 to 3.0.   The DF (dissipation factor) falls within the range of 0.001 to 0.0018.   There is a wide selection of thickness options to accommodate your specific requirements and the availability of diverse sizes allows for cost savings.   All these characteristics make it well-suited for commercial applications, large-scale production, and cost-effectiveness.   PCB Capability (F4BM) PCB Material: PTFE glass fiber cloth copper clad laminates Designation (F4BM ) F4BM DK (10GHz) DF (10 GHz) F4BM217 2.17±0.04 0.0010 F4BM220 2.20±0.04 0.0010 F4BM233 2.33±0.04 0.0011 F4BM245 2.45±0.05 0.0012 F4BM255 2.55±0.05 0.0013 F4BM265 2.65±0.05 0.0013 F4BM275 2.75±0.05 0.0015 F4BM294 2.94±0.06 0.0016 F4BM300 3.00±0.06 0.0017 Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) Dielectric thickness (or overall thickness) 0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..   Shot 3: PCB Capability Our comprehensive PCB manufacturing capabilities cover a wide range of aspects.   We can provide Single Sided, Double Sided, Multilayer, and Hybrid PCBs to meet your specific needs.   You have the flexibility to choose from copper weights of 1oz (35µm) and 2oz (70µm) for your PCBs.   Additionally, we offer a variety of dielectric thickness options, ranging from 0.8mm to 12.0mm, including specific measurements such as 1.524mm and 1.575mm.   Our capabilities extend to PCB sizes up to 400mm X 500mm, ensuring we can accommodate your size requirements.   To customize the appearance of your PCBs, we provide a selection of solder mask colors, including Green, Black, Blue, Yellow, Red, and more.   Furthermore, we offer multiple surface finish options, such as Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG, and more.     Shot 4: Applications F4BM PCB finds it’s wide range of applications, such as phase shifter, passive device, power divider, coupler, combiner, feed network, phased array antenna, satellite communications, base station antenna and radar etc.   Thank you. I’ll see you next time.