Bicheng Electronics Technology Co., Ltd Cases

Introduction Taconic’s TLX-9 high-frequency material is a composite of PTFE fiberglass laminates, representing the pinnacle of innovation in copper-clad PTFE/woven glass technology.   It features excellent mechanical and thermal properties, a low dissipation factor, and a low and stable dielectric constant with tight control, while also meeting the UL 94 V-0 flammability rating. Additionally, TLX-9 laminates can be sheared, drilled, milled, and plated using standard methods applicable to PTFE/woven fiberglass materials.   Features Now, let's explore the key features and typical values of TLX-9 that highlight its impressive capabilities.   First, the Dielectric Constant at 10 GHz is 2.50. This means TLX-9 performs well in high-frequency applications, helping to keep signals stable and reducing distortion.   Next is the Dissipation Factor, also at 10 GHz, which is just 0.0019. This low value indicates that there is minimal signal loss, ensuring efficient transmission of high-frequency signals.   Regarding Moisture Absorption, TLX-9 absorbs less than 0.02% moisture. This low rate enhances reliability, especially in humid environments.   The Dielectric Breakdown strength exceeds 60 kV, making TLX-9 suitable for high-voltage applications like radar and microwave devices.   For Resistivity, TLX-9 has a Volume Resistivity of 10^7 Mohm/cm and a Surface Resistivity of 10^7 Mohm. These high values demonstrate its effectiveness as an insulator, preventing electrical leakage.   The Peel Strength for 1 oz copper is 12.0 lbs per linear inch, indicating strong adhesion that keeps the copper cladding secure during use.   In terms of Thermal Expansion, the X-Y Coefficient of Thermal Expansion (CTE) is 9 and 12 ppm/°C, while the Z CTE ranges from 130 to 145 ppm/°C. These low values help TLX-9 maintain its size and shape despite temperature changes, which is crucial for precision in electronics.   Finally, TLX-9 meets the UL-94 V-0 flammability rating making it a safe choice for critical applications in aerospace and military sectors.   PCB Material: PTFE fiberglass Designation: TLX-9 Dielectric constant: 2.5±0.04 Layer count: Single Layer,Double Layer, Multi-layer, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness: 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil(0.762mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Red, Yellow etc. Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, Pure gold, ENEPIG etc..   PCB Capability For PCB capability on TLX-9, you can choose from a variety options including single-sided, double-sided, multilayer, and hybrid designs.   The material is available in thicknesses of 5, 10, 20, and 30 mils.   Finished copper for track lines can be specified as either 1 oz. or 2 oz.   The maximum PCB size is 400 mm by 500 mm, suitable for single boards or multiple designs on a panel.   You can choose from solder mask colors of green, black, blue, red, and yellow, among others.   For surface finishes, immersion gold, HASL, immersion silver, immersion tin, bare copper, OSP, pure gold, and ENEPIG are available.   Applications The TLX-9 PCB is employed in a range of advanced applications, such as Low Noise Amplifiers (LNAs), Low Noise Block Converters (LNBs), Low Noise Converters (LNCs), large format antennas for Personal Communications Service (PCS) and Personal Communications Network (PCN), as well as High Power Amplifiers.

Introduction The Rogers TMM13i isotropic thermoset microwave material is a ceramic thermoset polymer composite tailored for high reliability in plated thru-hole strip-line and micro-strip applications. It features an isotropic dielectric constant (Dk) and integrates the advantageous properties of both ceramic and PTFE substrates, while allowing for the convenience of soft substrate processing methods.   Features TMM13i laminates have a low thermal coefficient of dielectric constant of -70 ppm/°C, which ensures consistent dielectric performance over a wide temperature range, making it ideal for applications with expected temperature fluctuations.   The material’s isotropic coefficients of thermal expansion of 19, 19 and 20ppm/°C on X, Y and Z direction, very closely matched to copper, allow for production of high reliability plated through holes, and low etch shrinkage values.   Furthermore, TMM13i features a high dielectric constant of 12.85±0.35, allowing for the miniaturization of components and facilitating the development of more compact electronic devices.   Its low dissipation factor of 0.0019 at 10 GHz further enhances efficiency by minimizing energy loss, making it ideal for microwave circuits.   PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites Designation: TMM13i Dielectric constant: 12.85±0.35 Layer count: Single Layer,Double Layer, Multi-layer, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, ENEPIG, Pure gold etc..   PCB Capability We are excited to present our PCB manufacturing capabilities using TMM13i material.   Our facility accommodates a diverse range of configurations, including single-layer, double-layer, multilayer, and hybrid PCBs, ensuring we can meet the unique requirements of your projects.   Copper weight options of 1 oz (35 µm) and 2 oz (70 µm) are available to cater to the specific electrical conductivity needs of your applications.   Additionally, multiple dielectric thicknesses are allowed by our manufacturing process, ranging from 15 mil (0.381 mm) to an impressive 500 mil (12.7 mm).   We can accommodate large sizes up to 400 mm x 500 mm, making them suitable for a wide range of applications.   To complement your design, we provide a selection of solder mask colors, including green, black, blue, yellow, and red, allowing you to align with your branding or functional needs.   For optimal performance and reliability, we offer an array of surface finish options, including bare copper, HASL, ENIG, OSP, immersion tin, immersion silver, ENEPIG, and pure gold.   Applications TMM13i PCB is well-suited for various applications, such as chip testers, dielectric polarizers, lenses, filters, couplers, RF and microwave circuitry, and satellite communication systems etc.

Introduction Rogers’ AD250C antenna laminates are high-performance, specialty materials designed specifically to meet the needs of today's wireless antenna markets.   These laminates are made from glass-reinforced, PTFE-based materials that offer a controlled dielectric constant, low loss performance, and excellent passive intermodulation (PIM) characteristics. The woven glass reinforcement enhances circuit processability, enabling efficient circuit board production with high yields.   AD250C antenna materials come with options for standard electrodeposited (ED) or reverse treated ED copper foil, allowing for choices that help minimize circuit losses and improve antenna PIM.   Features AD250C antenna materials offer several notable features:   These materials have an impressively low loss tangent of 0.0013 at 10 GHz and base station frequencies, ensuring minimal signal degradation.   They provide a dielectric constant (Dk) of 2.50, with a tolerance of +/- 0.04, enabling precise control over signal propagation characteristics.   The use of low-profile copper helps to reduce conductive losses, enhancing overall antenna efficiency.   AD250C exhibits very low moisture absorption of 0.04%, ensuring consistent performance and integrity across diverse environmental conditions.   A very high copper peel strength of 14.8 lbs/in ensures reliable adhesion between the copper and the substrate, enhancing the antenna’s durability and performance in challenging applications.   PCB Material: PTFE based Woven Fiberglass/Ceramic Filled Composites Designation: AD250C Dielectric constant: 2.50 (10 GHz) Dissipation factor 0.0013 (10 GHz) Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Red, Yellow etc. Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare copper, Pure gold etc..   PCB Capability In terms of PCB capability, we offer a comprehensive range of options for AD250C. Our portfolio includes single-sided boards, double-sided boards, multi-layer boards, and hybrid types.   The standard thicknesses are available, including 20 mils, 30 mils, and 60 mils, allowing flexibility to meet specific requirements.   The finished copper on track lines or pads can be 1oz and 2oz, catering to various conductivity needs.   Our maximum PCB size reaches an impressive size of 400mm by 500mm. This allows for the fabrication of a single board or the inclusion of different designs within a single panel.   At our facility, we provide solder mask options in green, black, blue, red, yellow, and more.   Additionally, we offer various plating for pads, including immersion gold, HASL, immersion silver, immersion tin, OSP, ENEPIG, bare copper or pure gold.   Applications With its exceptional characteristics, AD250C PCB finds application in a wide range of industries, such as Cellular infrastructure base station antenna, Automotive telematics antenna Systems, and Commercial satellite radio antenna etc.

Introduction RF-35 is an organic-ceramic laminate from Taconic's ORCER product line, utilizing woven glass reinforcement. It leverages Taconic’s expertise in ceramic fill technology and coated PTFE fiberglass. RF-35 utilizes 7628-style fiberglass, offering exceptional value and performance. It is available in thickness increments of 10 mils (0.254 mm).   RF-35 is an ideal option for cost-effective, high-volume commercial microwave and radio frequency applications. It offers excellent peel strength for both half ounces and 1 ounce copper, outperforming standard epoxy materials, which is crucial for rework scenarios. Additionally, its ultra-low moisture absorption rate and low dissipation factor help minimize phase shift across frequencies.   Main Parameters Now, let's explore the key parameters evaluated by IPC and ASTM.   The dielectric constant at 1.9 GHz, according to IPC-TM 650 2.5.5, is 3.50 and the dissipation factor at the same frequency is 0.0018. Both parameters feature low value, making it ideal for high frequency applications, where signal integrity is crucial.   The moisture absorption at 0.060 inches, as per IPC-TM 650 2.6.2.1, is only 0.02%, indicating extremely low moisture absorption.   The peel strength for 1/2 oz. copper, according to IPC-TM 650 2.4.8, is greater than 8.0 lbs/linear inch. For 1 oz. copper, it exceeds 10.0 lbs/linear inch, as per IPC-TM 650 2.4.8.   The dielectric breakdown, as per IPC-TM 650 2.5.6, measures 41 kV.   The x y CTE measured by ASTM D 3386 (TMA) is 19 and 24 ppm/°C, while the z CTE is 64 ppm/°C.   Finally, RF-35 has a flammability rating of UL-94 V-0, ensuring it meets safety standards.   PCB Material: PTFE Ceramic Fiberglass Designation: RF-35 Dielectric constant: 3.5 @1.9 GHz Dissipation Factor 0.0018 @1.9 GHz Layer count: Single Layer, Double Layer, Multilayer, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Laminate thickness: 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, ENEIPIG, Pure gold, OSP etc..   PCB Capability Our manufacturing capabilities for RF-35 are extensive and versatile, accommodating a range of specifications to meet diverse project requirements.   We can produce single-layer, double-layer, multilayer, and hybrid PCBs, allowing for flexibility in design and application. Copper weight options include 1oz (35µm) and 2oz (70µm).   We provide laminate thickness options of 5 mil (0.127 mm), 10 mil (0.254 mm), 20 mil (0.508 mm), 30 mil (0.762 mm), and 60 mil (1.524 mm), catering to different mechanical and electrical requirements.   PCB sizes up to 400 mm x 500 mm are available, whether for a single board or multiple sizes in a panel, ensuring versatility for a variety of applications.   Additionally, we provide a selection of solder masks in multiple colors, including green, black, blue, yellow, and red.   A range of surface finishes are available from us, including bare copper, HASL, ENIG, immersion silver, immersion tin, ENEPIG, pure gold, OSP, and more.   Applications RF-35 PCB demonstrates a strong suitability for applications in power amplifiers, as well as in filters, couplers, and passive components.

Introduction Thermoset laminate materials, including FR-4, are susceptible to oxidation over time and with increased temperatures. This can lead to a slight rise in both the dielectric constant and dissipation factor of the circuit substrate. Rogers' RO4835 laminate offers enhanced stability at elevated temperatures and is more resistant to oxidation than other hydrocarbon materials.   It offers electrical and mechanical properties similar to those of RO4350B laminates, making it suitable for high-frequency applications and cost-effective circuit manufacturing. These laminates are low-loss materials that work well with standard epoxy/glass (FR-4) processes.   Features RO4835 is RoHS compliant, meeting environmental standards and making it suitable for applications requiring UL 94 V-0 certification for flame retardancy.   They are available with Rogers proprietary LoPro Reverse treated copper foil, which is perfect for applications that required low insertion loss.   RO4835's dielectric constant of 3.48 with tight tolerances ensures consistent electrical performance, critical for signal integrity in RF and microwave circuits.   But that’s not all . RO4835 exhibits low signal loss with a dissipation factor of 0.0037 at 10 GHz, making it a reliable choice for high-frequency applications where minimal loss is essential.   Additionally, it features exceptional CTE values of 10, 12, and 31 ppm/°C in the X, Y, and Z directions, respectively.   PCB Material Hydrocarbon Ceramic Laminates Designation RO4835 Dielectric Constant 3.48 (10 GHz) Dissipation Factor 0.0037 (10 GHz) Layer Count Single Sided PCB, Double Sided PCB, Multilayer PCB, Hybrid PCB Copper Weight: 1oz (35µm), 2oz (70µm) Dielectric Thickness (ED copper) 6.6mil (0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) Dielectric Thickness (LoPro copper) 4mil (0.102mm), 7.3mil (0.186mm), 10.7mil (0.272mm), 20.7mil (0.526mm), 30.7mil (0.780mm), 60.7mil (1.542mm) PCB Size ≤400mm X 500mm Solder Mask Green, Black, Blue, Yellow, Red etc. Surface Finish Bare copper, HASL, Immersion gold, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..   PCB Capability Our PCB manufacturing capabilities encompass a variety of layer configurations, including single-sided, double-sided, multi-layer, and hybrid PCBs.   For copper weight, 1oz (35µm) and 2oz (70µm) are available for RO4835 PCBs to meet diverse conductivity needs.   The dielectric thickness is flexible, ranging from 6.6 mil (0.168 mm) to 60 mil (1.524 mm) for ED copper, and from 4 mil (0.102 mm) to 60.7 mil (1.542 mm) for LoPro copper, allowing for customized design specifications.   For panel dimension, we can accommodate a maximum PCB size of up to 400mm x 500mm.   We provide multiple solder mask colors, including green, black, blue, yellow, and red, enabling customization to suit visual preferences.   Finally, we offer various surface finish options such as bare copper, HASL, immersion gold, immersion silver, immersion tin, OSP, and pure gold plating, ensuring compatibility with different assembly processes.   Applications The RO4835 PCB is commonly used in various applications, including automotive radar and sensors, point-to-point microwave communication, power amplifiers, phased-array radar, and RF components.

Introduction Rogers’ TC600 is a PTFE-based composite reinforced with woven fiberglass and ceramic fillers, specifically designed as a substrate for printed circuit boards. It offers superior heat transfer due to its "Best-In-Class" thermal conductivity, while minimizing dielectric and insertion losses. These reduced losses contribute to enhanced efficiency and performance in amplifiers and antennas.   The enhanced thermal conductivity allows for greater power handling, minimizes hot spots, and boosts device reliability. This improved heat transfer within the substrate complements designs using coins, heat sinks or thermal vias, giving designers additional design margin in heat management.   Features Let's delve into the exceptional properties of the TC600.   To begin, it boasts a high dielectric constant (DK) of 6.15, facilitating circuit size reduction. Additionally, it showcases an impressively low dissipation factor of 0.002 at 10 GHz, effectively minimizing signal loss.   Furthermore, the TC600 exhibits high thermal conductivity of 1.1W/mK on the Z-axis and 1.4W/mK on the X and Y axes, ensuring optimal heat management and reliability in challenging environments.   With a TCDk value of -75 ppm/°C, the TC600 maintains a stable dielectric constant over a wide temperature range of -40-150°C at 10 GHz. This stability helps the designers of power amplifier and antennas to maximize gain and minimize bandwidth loss due to dielectric constant fluctuations with temperature variations.   Moreover, the TC600 laminate offers a low Z-Direction Coefficient of Thermal Expansion (CTE) of 35 ppm/°C, guaranteeing unparalleled reliability for plated through holes.   PCB Material: Ceramic Filled PTFE/Woven Fiberglass Designation: TC600 Dielectric constant: 6.15 (10 GHz) Dissipation Factor: 0.002 (10 GHz) Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness: 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, Immersion gold, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold plated etc..   PCB Capability Explore our advanced PCB manufacturing capabilities, customized to meet your diverse requirements.   Layer Count: From Double-Sided PCBs to intricate Multilayer PCBs and Hybrid PCBs, we offer a range of options to suit your specific project needs.   Copper Weight: Choose from 1oz (35µm) or 2oz (70µm) copper weight to customize the conductivity and performance of your circuit boards.   Dielectric Thickness: Select from a variety of dielectric thickness including 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), and 60mil (1.524mm) to achieve the desired insulation and signal integrity for your application.   PCB Size: Our manufacturing capabilities support PCB sizes up to 400mm x 500mm, providing flexibility for a wide range of project sizes.   Solder Mask: Customize your PCB with solder mask colors such as Green, Black, Blue, Yellow, Red, and more.   Surface Finish: We offer a variety of surface finish including Bare Copper, HASL, Immersion gold, Immersion Silver, Immersion Tin, ENEPIG, OSP, and Pure Gold Plated finishes, ensuring optimal conductivity and protection for your PCBs.   Typical Applications The TC600 PCB is commonly utilized in:   Power amplifiers, filters, and couplers, Microwave combiners and power dividers in avionics systems, Small-sized antennas, Antennas for digital audio broadcasting (DAB) and satellite radio, Antennas for GPS and handheld RFID readers etc.

Introduction Rogers DiClad 880 high frequency laminates are PTFE-based composites with woven fiberglass reinforcement. By using fewer plies of woven fiberglass and a higher ratio of PTFE content, DiClad 880 achieves lower dielectric constant and lower dissipation factors at a similar thickness to other laminates.   They are frequently used in filter, coupler and low noise amplifier applications, where Dk uniformity is critical and also used in power dividers and combiners, where low loss is important.   Features One of the key features of the DiClad 880 laminates is their dielectric constant (Dk) of 2.17 or 2.20. This low Dk is complemented by a dissipation factor of 0.0009 at 10GHz, which is impressive for a PTFE-based composite material.   The woven fiberglass reinforcement in DiClad 880 offers enhanced dimensional stability compared to nonwoven fiberglass reinforced PTFE laminates with similar dielectric constants, exhibiting a coefficient of thermal expansion of 25 ppm/°C in the X direction and 34 ppm/°C in the Y direction.   DiClad 880 also has very low moisture absorption at 0.02% and meets UL 94-V0 flammability standards.   Additionally, it demonstrates excellent outgassing properties, with a Total Mass Loss of 0.01%, Collected Volatiles at 0.01%, and no Water Vapor Recovery.   On the other hand, when choosing materials, we also need to consider the uncertainties associated with its high TCDK of -160 ppm/°C and low thermal conductivity of 0.25 W/MK..   PCB Material Woven Fiberglass Reinforced, PTFE-based Composites Designation DiClad 880 Dielectric constant 2.20 (10 GHz) Dissipation factor 0.0009 (10 GHz) Layer count Single Sided, Double Sided, Multi-layer, Hybrid PCB Copper weight 1oz (35µm), 2oz (70µm) Dielectric thickness 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) PCB size ≤400mm X 500mm Solder mask Green, Black, Blue, Yellow, Red etc. Surface finish Immersion gold, HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare Copper, Pure gold plated etc..   PCB Capability Let’s explore our PCB manufacturing capabilities on DiClad 880 materials.   Layer Count: Whether you require single-sided, double-sided, multi-layer, or hybrid PCBs, we have you covered.   Copper Weight: We offer copper weights of 1 oz (35 µm) and 2 oz (70 µm) to ensure optimal performance for your applications.   Dielectric Thickness: Choose from dielectric thicknesses of 20 mil (0.508 mm), 30 mil (0.762 mm), or 60 mil (1.524 mm) to suit your design requirements.   The maximum PCB size that can be accommodated is 400 mm x 500 mm.   We provide a variety of solder mask colors, including green, black, blue, yellow, and red, allowing for customization and aesthetic appeal.   Surface finish options include immersion gold (ENIG), HASL, immersion silver, immersion tin, OSP, ENEPIG, bare copper, and pure gold plating, providing flexibility to meet your specific needs.   Applications DiClad 880 PCB is well-suited for a variety of high-frequency circuit applications due to its excellent electrical properties and performance. In addition to the applications we mentioned at the beginning, it is also used in Military Radar Feed Networks, Commercial Phased Array Networks, Low Loss Base Station Antennas, and Digital Radio Antennas etc.

Rogers TMM10 thermoset microwave materials are ceramic thermoset polymer composites designed for high plated-thru-hole reliability stripline and microstrip applications.   It combines the advantages of both PTFE and ceramic substrates without being constrained by their mechanical properties and production techniques.   Features TMM10 features a dielectric constant (Dk) of 9.20 +/- .23, allowing for more compact designs and providing the possibility of miniaturization.   With a Dissipation factor of .0022 at 10GHz, TMM10 minimizes signal loss for efficient performance.   Its thermal coefficient of Dk of -38 ppm/°K enhances stability across temperature variations.   The coefficient of thermal expansion is 21 ppm/°K on X and Y axis, 20 ppm/°K on Z direction, the copper matched CTE allows for production of high reliability plated through holes, and low etch shrinkage values.   Furthermore, the thermal conductivity of TMM10 is 0.76 W/mK, which is approximately twice that of traditional PTFE/ceramic laminates, facilitating heat removal.   TMM10 offers mechanical properties that effectively resist creep and cold flow, ensuring long-term stability in diverse applications.   PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites Designation: TMM10 Dielectric constant: 9.20 ±0.23 Layer count: Single Layer, Double Layer, Multilayer, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion Silver, Immersion Tin, ENEPIG, Pure Gold, OSP etc..   PCB Capability At Bicheng, we pride ourselves on our advanced manufacturing capabilities for TMM10 laminates, offering a wide range of options to meet diverse project requirements.   We are able to provide you with single-layer, double-layer, multilayer, and hybrid PCBs, ensuring flexibility and customization for various applications.   Copper weights of 1oz (35µm) and 2oz (70µm) are available to accommodate different performance needs.   The PCB thickness options range from 15mil (0.381mm) to an impressive 500mil (12.70mm), allowing us to support both compact and robust designs.   Our PCB size capability extends up to 400mm x 500mm, making us well-equipped for larger projects.   We offer a variety of solder mask colors including green, black, blue, yellow, and red, alongside multiple surface finishes such as bare copper, HASL, ENIG, immersion silver, immersion tin, ENEPIG, pure gold, and OSP.   Applications The TMM10 PCB is commonly used in various applications, including chip testers, dielectric polarizers, satellite communication systems, GPS antennas, and patch antennas etc.  

Introduction Rogers’ RO3210 high-frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass, designed to deliver exceptional electrical efficiency and mechanical strength at competitive prices.   As an extension of the RO3000 series, RO3210 materials are specifically engineered to enhance mechanical stability, making them a standout choice in the industry.     Features and Benefits RO3210 materials boast a dielectric constant (Dk) of 10.2, with tolerance of ± 0.5, allowing for more compact designs and providing the possibility of miniaturization.   With a dissipation factor of .0027 at 10 GHz, it minimizes signal loss and distortion.   RO3210 features a high thermal conductivity of 0.81 W/mK and excellent CTE value on X, Y and Z axis.   The RO3210 material offers exceptional dimensional stability, elevating the precision and reliability of the final PCBs and bolstering production yields.     Its surface smoothness facilitates finer line etching tolerances, enabling the creation of intricate circuit designs with heightened accuracy.   Moreover, the RO3210 is adept at integrating into epoxy multi-layer board hybrid designs, providing a blend of versatility and reliability for intricate and sophisticated circuit configurations.   PCB Capability (RO3210) PCB Material: Ceramic-filled Laminates Reinforced with Woven Fiberglass Designation: RO3210 Dielectric constant: 10.2±0.5 Layer count: Single Layer, Double Layer, Multilayer, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) PCB thickness: 25mil(0.635mm), 50mil (1.27mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, Immersion tin, Immersion silver, Immersion gold, Pure gold, ENEPIG, OSP etc..   PCB Capabilities We specialize in manufacturing high-quality PCBs using RO3210 material, customized to meet a diverse range of specifications for your unique projects.   We can provide you with single-layer to complex multi-layer and hybrid PCB designs.   This board is available with two distinct copper weight options: 1oz (35µm) and 2oz (70µm), allowing you to choose the level of conductivity that aligns best with your specific requirements.   You have the choice between two thickness options: 25 mils (0.635mm) and 50 mils (1.27mm), providing versatility in design and functionality.   Our capabilities extend to PCBs with a maximum size of 400mm X 500mm, ensuring compatibility with a wide range of board dimensions.   We provide solder masks in various colors like green, black, blue, yellow and red etc.   A variety of surface finishes such as bare copper, HASL, immersion tin, immersion silver, immersion gold, pure gold, ENEPIG, OSP are available in house.   Applications RO3210 PCBs are extensively utilized in a diverse range of fields, including automotive collision avoidance systems, automotive GPS antennas, wireless telecommunications systems, microstrip patch antennas for wireless communications, and direct broadcast satellites etc.   Thank you. I’ll see you next time.

Introduction Rogers RO4730G3 antenna grade laminates are a reliable, low-cost alternative to conventional PTFE-based laminates. The resin systems of RO4730G3 dielectric materials provide the necessary mechanical and electrical properties for ideal antenna performance.   RO4730G3 antenna grade laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing. These materials do not require the special treatment needed on traditional PTFE-based laminates for plated through-hole preparation. RO4730G3 laminates are an affordable alternative to conventional PTFE-based antenna materials, allowing for designers to optimize cost and performance.     Features RO4730G3 features a dielectric constant of 3.0 with a tight tolerance of just ±0.05. This precise and consistent dielectric property ensures optimal signal integrity and predictable impedance control in your circuit designs.   Additionally, it delivers exceptional dissipation factors of just 0.0028, enabling efficient signal transmission and minimizing energy losses in the high-frequency designs.   RO4730G3 exhibits a remarkably low Z-axis coefficient of thermal expansion (CTE) at just 35.2 ppm/°C. This low CTE helps minimize the risk of delamination and improves the long-term reliability of your circuits, even under demanding thermal conditions.   Complementing its low CTE, RO4730G3 also boasts a low temperature coefficient of dielectric constant (TCDk) of just 34 ppm/°C. This exceptional thermal stability ensures your circuit's performance remains consistent, even as temperatures fluctuate.   Finally, RO4730G3 features an exceptionally high glass transition temperature (Tg) of greater than 280°C. This high Tg ensures the material can withstand the elevated temperatures encountered during manufacturing and operation, further enhancing the long-term reliability of the circuits.   PCB Capability (RO4730G3) PCB Material: Hydrocarbon ceramic woven glass Designator: RO4730G3 Dielectric constant: 3.0 ±0.05 (process); 2.98 (design) Layer count: 1-layer, 2-layer, Multi-layer, Hybrid configuration Copper weight: 1oz (35µm), 2oz (70µm) Laminate thickness (LoPro Copper): 5.7mil(0.145mm), 10.7mil(0.272mm), 20.7mil(0.526mm, 30.7mil(0.780mm), 60.7mil(1.542mm) Laminate thickness (ED Copper) 20mil(0.508mm), 30mil(0.762mm), 60mil(1.524mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion tin, Immersion silver, ENEPIG, Pure gold, OSP,etc.   PCB Capability (RO4730G3) Our RO4730G3 PCBs are custom-made to meet a wide range of specifications to suit your project needs.   Choose from a variety of layer counts including single layer, double layer, multi-layer, and hybrid configurations. Copper weights available in 1oz (35µm) and 2oz (70µm).   The laminate thickness options include LoPro Copper at 5.7mil to 60.7mil and ED Copper at 20mil to 60mil, providing flexibility for diverse applications.   Maximum PCB size of 400mm X 500mm ensures compatibility with various designs. Customize your boards with solder mask colors such as green, black, blue, yellow, and red, among others.   Select from surface finishes like bare copper, HASL, ENIG, immersion tin, immersion silver, ENEPIG, pure gold, OSP, and more.     Applications The RO4730G3 is typically for the applications of Cellular Base Station Antennas.   Thank you. I’ll see you next time.

Introduction Taconic TLX-8 is a PTFE microwave substrate reinforced with high-volume fiberglass, making it an excellent choice for low layer count microwave designs and ensuring reliability across a wide range of RF applications.   In the domain of RF microwave substrates, TLX-8 emerges as a dependable choice with its fiberglass reinforcement providing crucial mechanical strength, especially in challenging environments that PCBs may encounter, including:   Resisting creep for PCBs bolted to housings experiencing high vibration levels during space launches; Enduring high temperatures within engine modules; Demonstrating radiation resistance in space; Withstanding extreme conditions at sea for warship antennas; and Maintaining functionality across a broad temperature range for altimeter substrates during flights.     Features TLX-8 features a low and stable dielectric constant of 2.55±0.04 at 1Mhz, ensuring consistent electrical properties in microwave designs.   It features a low dissipation factor of 0.0018 at 10GHz, indicating minimal energy loss during signal transmission.   TLX-8 excels in outgassing properties, showcasing a Total Mass Loss (TML) of 0.03% and Collected Volatile Condensable Materials (CVCM) percentage of 0.00%. The material's Water Vapor Regain (WVR) of 0.01% underscores its ability to absorb moisture effectively, making it ideal for environments with fluctuating humidity levels.   Additionally, the material has low moisture absorption of 0.02%, which is crucial for maintaining performance in humid environments.   Moreover, TLX-8 has a UL 94 V-0 rating, meeting stringent flammability standards and ensuring safety in various applications.   PCB Capability (TLX-8) PCB Material: PTFE Fiberglass Composites Designation: TLX-8 Dielectric constant: 2.55 ± 0.04 1MHz Dissipation Factor 0.0018 10GHz Layer count: Single Sided, Double Sided Copper weight: 1oz (35µm), 2oz (70µm) PCB thickness: 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm), 110mil(2.79mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold etc..   PCB Capability Our manufacturing capability for TLX-8 encompasses a diverse range of specifications to meet various design requirements.   We offer fabrication for single-sided and double-sided PCBs with copper weights ranging from 1oz (35µm) to 2oz (70µm).   PCB thickness options include 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm), and 110mil (2.79mm), ensuring flexibility for different applications.   In terms of size, we can accommodate PCBs up to 400mm X 500mm, providing ample space for your designs.   Our solder mask options include popular colors such as green, black, blue, yellow, and red, allowing for customization based on your preferences.   For surface finishes, we offer a variety of choices to suit your specific needs, including bare copper, HASL, ENIG, immersion silver, immersion tin, ENEPIG , OSP, and pure gold.     PCB Applications TLX-8 PCBs are ideal for use in radar systems, mobile communications, microwave test equipment, microwave transmission devices and RF components due to its reliable properties and consistent performance.   Thank you. I’ll see you next time.

Introduction Rogers RT/duroid 6006 stands out as a ceramic-PTFE composite meticulously crafted for electronic and microwave circuit applications that demand a superior dielectric constant. These materials are engineered to offer a high level of dielectric constant (Dk), facilitating the reduction of circuit size with remarkable efficiency. Known for their minimal loss characteristics, RT/duroid 6006 excels in operations within the X-band spectrum or lower frequencies. Its precise Dk and thickness control ensure consistent circuit performance.     Features The outstanding characteristics of RT/duroid 6006 encompass a dielectric constant (Dk) of 6.15 +/- 0.15 and an impressively low dissipation factor of only 0.0027 at 10GHz, guaranteeing minimal signal attenuation.   Clad with both standard and reverse treated electrodeposited copper foil, RT/duroid 6006 laminates offer choices for reducing insertion loss or enhancing peel strength.   Furthermore, Their low moisture absorption rate and ability to support reliable plated through-holes in multi-layer boards elevate them as a top-tier choice for electronic and microwave circuits.   PCB Capability (RT/duroid 6006) PCB Material: Ceramic-PTFE Composites Designation: RT/duroid 6006 Dielectric constant: 6.15 ± 0.15 @10GHz Dissipation Factor 0.0027 @10GHz Layer count: Single Sided, Double Sided, Multi-layer, Hybrid Configuration Copper weight: 1oz (35µm), 2oz (70µm) PCB thickness: 5mil (0.127mm), 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.905mm), 100mil(2.54mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold etc..   PCB Capability (RT/duroid 6006) Our manufacturing capabilities are extensive and versatile, covering a wide range of specifications to meet diverse needs.   We excel in producing PCBs with various layer counts, including Single Sided, Double Sided, Multi-layer, and Hybrid Configurations.   You can choose from copper weights of 1oz (35µm) or 2oz (70µm) and select PCB thicknesses from standard 25 mils, 50 mils and 75 mils.   Additional non-standard thicknesses available from 5 mils to 200 mils in increments of 5 mils.   Our production capabilities extend to PCB sizes up to 400mm x 500mm, offering flexibility for different project requirements.   When it comes to aesthetics and functionality, we provide a spectrum of solder mask colors such as Green, Black, Blue, Yellow, and Red, among others.   Additionally, our surface finish options are comprehensive, including Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold, and so on.     Applications RT/duroid 6006 PCBs find their place in a variety of applications, such as patch antennas, satellite communication systems, power amplifiers, aircraft collision avoidance systems, and ground radar warning systems etc.   Thank you. I’ll see you next time.