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Introduction
RF-35 is an organic-ceramic laminate from Taconic's ORCER product line, utilizing woven glass reinforcement. It leverages Taconic’s expertise in ceramic fill technology and coated PTFE fiberglass. RF-35 utilizes 7628-style fiberglass, offering exceptional value and performance. It is available in thickness increments of 10 mils (0.254 mm).
RF-35 is an ideal option for cost-effective, high-volume commercial microwave and radio frequency applications. It offers excellent peel strength for both half ounces and 1 ounce copper, outperforming standard epoxy materials, which is crucial for rework scenarios. Additionally, its ultra-low moisture absorption rate and low dissipation factor help minimize phase shift across frequencies.
Main Parameters
Now, let's explore the key parameters evaluated by IPC and ASTM.
The dielectric constant at 1.9 GHz, according to IPC-TM 650 2.5.5, is 3.50 and the dissipation factor at the same frequency is 0.0018. Both parameters feature low value, making it ideal for high frequency applications, where signal integrity is crucial.
The moisture absorption at 0.060 inches, as per IPC-TM 650 2.6.2.1, is only 0.02%, indicating extremely low moisture absorption.
The peel strength for 1/2 oz. copper, according to IPC-TM 650 2.4.8, is greater than 8.0 lbs/linear inch. For 1 oz. copper, it exceeds 10.0 lbs/linear inch, as per IPC-TM 650 2.4.8.
The dielectric breakdown, as per IPC-TM 650 2.5.6, measures 41 kV.
The x y CTE measured by ASTM D 3386 (TMA) is 19 and 24 ppm/°C, while the z CTE is 64 ppm/°C.
Finally, RF-35 has a flammability rating of UL-94 V-0, ensuring it meets safety standards.
| PCB Material: | PTFE Ceramic Fiberglass |
| Designation: | RF-35 |
| Dielectric constant: | 3.5 @1.9 GHz |
| Dissipation Factor | 0.0018 @1.9 GHz |
| Layer count: | Single Layer, Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Laminate thickness: | 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, ENEIPIG, Pure gold, OSP etc.. |
PCB Capability
Our manufacturing capabilities for RF-35 are extensive and versatile, accommodating a range of specifications to meet diverse project requirements.
We can produce single-layer, double-layer, multilayer, and hybrid PCBs, allowing for flexibility in design and application.
Copper weight options include 1oz (35µm) and 2oz (70µm).
We provide laminate thickness options of 5 mil (0.127 mm), 10 mil (0.254 mm), 20 mil (0.508 mm), 30 mil (0.762 mm), and 60 mil (1.524 mm), catering to different mechanical and electrical requirements.
PCB sizes up to 400 mm x 500 mm are available, whether for a single board or multiple sizes in a panel, ensuring versatility for a variety of applications.
Additionally, we provide a selection of solder masks in multiple colors, including green, black, blue, yellow, and red.
A range of surface finishes are available from us, including bare copper, HASL, ENIG, immersion silver, immersion tin, ENEPIG, pure gold, OSP, and more.
Applications
RF-35 PCB demonstrates a strong suitability for applications in power amplifiers, as well as in filters, couplers, and passive components.