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Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module

Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module
Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module

Large Image :  Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-313.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: Polyimide Layer Count: 2 Layers
PCB Thickness: 0.25mm PCB Size: 105mm X 42.3mm = 1 Type = 1 Piece
Solder Mask: Yellow Coverlay Silkscreen: NO
Copper Weight: Outer Layer 70μm/ Inner Layer 0 μm Surface Finish: Immersion Gold

 

Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module

(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)

 

General description

This is a type of 2 Layer flexible printed circuit (FPC) built on 2oz polyimide for the application of Interface Module.

 

Basic specifications

Base material: Polyimide 25μm

Layer count: 2 layers

Type: Individual FPC

Format: 105mm x 42.3mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 70μm/ Inner layer 0 μm

Solder mask / Legend: Yellow coverlay / No.

Final PCB height: 0.25 mm

Standard: IPC 6012 Class 2

Packing: 100 pieces are packed for shipment.

Lead time: 10 working days

Shelf life: 6 months

 

Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module 0

 

Features and benefits

Reliability increased;

Controllability of electrical parameter design;

The end can be whole soldered;

SMT process is resistant to reflow soldering, resistant to rework;

Professional and experienced engineers check your production files

Competitive price;

No MOQ, low cost for prototypes and small runs quantity;

8000 types of PCB's per month;

 

Applications

Thin-film switch, contact belt of inkjet printer, industrial control interphone, medical keypad soft board, contact belt of inkjet printer projector soft board

 

Specifications of Standard 2 Layer FCCL

Specifications Thickness (µm) Copper Type Applications
Polyimide Film Copper Foil
SF202 0506DR 12.5 6 RA Fine-line
SF20200509DR 12 9 RA
SF202 0509DT 12 9 RTF
SF202 0812DR 20 12 RA Side switch
SF202 1012DR 25 12 RA
SF202 0545DT 12.5 45 RTF Wireless Charge
SF202 1045DT 25 45 RTF
SF202 0550DT 12.5 50 RTF
SF202 1050DT 25 50 RTF
SF202 0570DT 12.5 70 RTF
SF202 1070DT 25 70 RTF
SF202 101850DT 25 18, 50 RTF
SF202 101870DT 25 18,70 RTF

 

Clarifications of FPC

According to the combination of base material and copper foil, flexible circuit board can be divided into two types: flexible board with adhesive and flexible board without adhesive. The price of non-adhesive flexible PCB is much higher than that of adhesive flexible PCB, but its flexibility, bonding force between copper foil and substrate and flatness of solder are also better than that of adhesive flexible PCB. So it is only used in the high demand situations, such as the: COF (CHIP ON FLEX, flexible board with bare chip, the high flatness of the pad) and so on. Because its price is high, most of the flexible PCBs used in the market are still adhesive flexible circuit board. Because the flexible circuit board is mainly used in the situation where bending is required, if the design or process is not reasonable, it is easy to produce micro-cracks, welding and other defects.

 

Economy of using FPC

If the circuit design is relatively simple, the total volume is small, and the space is suitable, the traditional internal connection is much cheaper. Flexible circuits are a good design option if the circuit is complex, processes many signals or has special electrical or mechanical requirements. When the size and performance of applications exceed the capacity of rigid circuits, flexible assembly is the most economical. A 12mil pad with a 5mil through hole and a flexible circuit with 3mil lines and spacing can be fabricated on a thin film. Therefore, it is more reliable to mount the chip directly on the film. There is no flame retardant that could be an ion source. These films may be protective and solidified at higher temperatures to obtain higher glass transition temperatures. Flexible materials are less costly than rigid materials because they are free of connectors.

 
Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module 1
 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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