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Hybrid PCB 10mil RO4350B and S1000-2M 4-Layer 1.6mm Impedance Board

Hybrid PCB 10mil RO4350B and S1000-2M 4-Layer 1.6mm Impedance Board

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
PCB Material:
RO4350B - 0.254 Mm (10mil); S1000-2M - 1.1 Mm (43mil)
Layer Count:
4-layer
PCB Thickness:
1.6 Mm
Solder Mask:
Green
Silkscreen:
White
Surface Finish:
ENIG (Electroless Nickel Immersion Gold)
Highlight:

S1000-2M Hybrid PCB

,

1.6mm Impedance Board

,

10mil RO4350B Hybrid PCB

Product Description

When it comes to high-frequency and high-reliability electronics, the foundation of your design lies in the PCB. Our 4-layer PCB, built with Rogers RO4350B and S1000-2M materials, is meticulously designed to meet the demands of RF, microwave, and high-speed digital applications. Whether you're developing commercial airline broadband antennas, radar systems, or millimeter-wave devices, this PCB delivers unmatched performance, thermal stability, and reliability.

 

Core Specifications
Layer Count: 4

Materials: RO4350B (top layers) and S1000-2M (core)

Solder Mask: Green (Top), None (Bottom)

Silkscreen: White (Top), None (Bottom)

Surface Finish: ENIG (Electroless Nickel Immersion Gold)

Board Thickness: 1.6mm

Dimensions: 90mm x 95mm (±0.15mm)

Trace/Space: 5mil / 4mil (minimum)

Hole Size: 0.35mm (minimum)

Via Plating: 20μm thickness

Via Filling/Capping: 0.35mm vias filled and capped

Impedance Control: 50Ω on top layer (5mil/9mil trace/gap)

Edge Plating: Applied to designated areas

 

PCB Stack-Up
Our 4-layer PCB is constructed with precision to ensure optimal electrical and thermal performance:

 

Layer 1 (Top): 35μm copper

RO4350B Laminate: 0.254mm (10mil)

Layer 2 (Inner): 35μm copper

Prepreg (1080 RC63%): 0.0644mm (2.5mil)

Layer 3 (Inner): 35μm copper

S1000-2M Core: 1.1mm (43mil)

Layer 4 (Bottom): 35μm copper

 

Why RO4350B?
RO4350B is a game-changer for RF and microwave applications, offering:

 

Consistent Dk: 3.48 ±0.05 @ 10GHz/23°C

Ultra-Low Loss: Dissipation factor of 0.0037 @ 10GHz/23°C

Exceptional Thermal Stability: Tg >280°C (536°F)

Low CTE: Matches copper for excellent dimensional stability (X/Y: 10/12 ppm/°C, Z: 32 ppm/°C)

Minimal Water Absorption: 0.06% for reliable performance in humid conditions

Thermal Conductivity: 0.69 W/m/°K for efficient heat dissipation

UL 94 V-0 Rating: Ideal for high-power RF designs

 

RO4350B Typical Value
Property RO4350B Direction Units Condition Test Method
Dielectric Constant,εProcess 3.48±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.66 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0037
0.0031
Z   10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +50 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.2 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 5.7 x109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 16,767(2,432)
14,153(2,053)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 203(29.5)
130(18.9)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 255
(37)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 10
12
32
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 390   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.69   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.86   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 0.88
(5.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability (3)V-0       UL 94
Lead-free Process Compatible Yes        

 

Why S1000-2M?
S1000-2M complements RO4350B with its robust mechanical and thermal properties:

 

Low Z-Axis CTE: Enhances through-hole reliability

 

High Heat Resistance: Tg of 180°C (DSC)

 

Anti-CAF Performance: Ensures long-term reliability in high-density designs

 

Low Water Absorption: Maintains stability in challenging environments

 

UV Blocking/AOI Compatibility: Supports automated optical inspection

 

Quality Assurance
We are committed to delivering PCBs that meet the highest standards of quality and reliability. Our manufacturing process adheres to IPC-Class-2 compliance, ensuring robust performance for a wide range of industrial applications.

 

All constructions are supplied in Gerber RS-274-X format, guaranteeing compatibility with your production systems. Before shipment, every PCB undergoes 100% electrical testing to verify functionality and eliminate defects.

 

With global availability, we are ready to ship our high-quality PCBs to your location, no matter where you are in the world. Trust us to provide the precision and reliability your projects demand.

 

Hybrid PCB 10mil RO4350B and S1000-2M 4-Layer 1.6mm Impedance Board 0

 

Ideal Applications
This PCB is perfect for:

 

Commercial Airline Broadband Antennas

Microstrip and Stripline Circuits

Millimeter-Wave Devices

Radar and Guidance Systems

Point-to-Point Digital Radio Antennas

 

Why Choose Us?
Cutting-Edge Materials: RO4350B and S1000-2M deliver superior electrical and thermal performance.

 

Precision Engineering: Features like impedance control, via filling, and edge plating ensure reliability.

 

Global Support: We ship high-quality PCBs worldwide, ensuring timely delivery.

 

Proven Reliability: Compliant with IPC-Class-2 standards, our PCBs are built to withstand the toughest conditions.

 

Contact Us Today!
If you're looking for a high-performance PCB solution for RF, microwave, or high-speed digital applications, this 4-layer PCB is the answer. Reach out to us today to discuss your requirements or request a quote.

 

Hybrid PCB 10mil RO4350B and S1000-2M 4-Layer 1.6mm Impedance Board 1

products
PRODUCTS DETAILS
Hybrid PCB 10mil RO4350B and S1000-2M 4-Layer 1.6mm Impedance Board
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
PCB Material:
RO4350B - 0.254 Mm (10mil); S1000-2M - 1.1 Mm (43mil)
Layer Count:
4-layer
PCB Thickness:
1.6 Mm
Solder Mask:
Green
Silkscreen:
White
Surface Finish:
ENIG (Electroless Nickel Immersion Gold)
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

S1000-2M Hybrid PCB

,

1.6mm Impedance Board

,

10mil RO4350B Hybrid PCB

Product Description

When it comes to high-frequency and high-reliability electronics, the foundation of your design lies in the PCB. Our 4-layer PCB, built with Rogers RO4350B and S1000-2M materials, is meticulously designed to meet the demands of RF, microwave, and high-speed digital applications. Whether you're developing commercial airline broadband antennas, radar systems, or millimeter-wave devices, this PCB delivers unmatched performance, thermal stability, and reliability.

 

Core Specifications
Layer Count: 4

Materials: RO4350B (top layers) and S1000-2M (core)

Solder Mask: Green (Top), None (Bottom)

Silkscreen: White (Top), None (Bottom)

Surface Finish: ENIG (Electroless Nickel Immersion Gold)

Board Thickness: 1.6mm

Dimensions: 90mm x 95mm (±0.15mm)

Trace/Space: 5mil / 4mil (minimum)

Hole Size: 0.35mm (minimum)

Via Plating: 20μm thickness

Via Filling/Capping: 0.35mm vias filled and capped

Impedance Control: 50Ω on top layer (5mil/9mil trace/gap)

Edge Plating: Applied to designated areas

 

PCB Stack-Up
Our 4-layer PCB is constructed with precision to ensure optimal electrical and thermal performance:

 

Layer 1 (Top): 35μm copper

RO4350B Laminate: 0.254mm (10mil)

Layer 2 (Inner): 35μm copper

Prepreg (1080 RC63%): 0.0644mm (2.5mil)

Layer 3 (Inner): 35μm copper

S1000-2M Core: 1.1mm (43mil)

Layer 4 (Bottom): 35μm copper

 

Why RO4350B?
RO4350B is a game-changer for RF and microwave applications, offering:

 

Consistent Dk: 3.48 ±0.05 @ 10GHz/23°C

Ultra-Low Loss: Dissipation factor of 0.0037 @ 10GHz/23°C

Exceptional Thermal Stability: Tg >280°C (536°F)

Low CTE: Matches copper for excellent dimensional stability (X/Y: 10/12 ppm/°C, Z: 32 ppm/°C)

Minimal Water Absorption: 0.06% for reliable performance in humid conditions

Thermal Conductivity: 0.69 W/m/°K for efficient heat dissipation

UL 94 V-0 Rating: Ideal for high-power RF designs

 

RO4350B Typical Value
Property RO4350B Direction Units Condition Test Method
Dielectric Constant,εProcess 3.48±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.66 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0037
0.0031
Z   10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +50 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.2 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 5.7 x109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 16,767(2,432)
14,153(2,053)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 203(29.5)
130(18.9)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 255
(37)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 10
12
32
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 390   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.69   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.86   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 0.88
(5.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability (3)V-0       UL 94
Lead-free Process Compatible Yes        

 

Why S1000-2M?
S1000-2M complements RO4350B with its robust mechanical and thermal properties:

 

Low Z-Axis CTE: Enhances through-hole reliability

 

High Heat Resistance: Tg of 180°C (DSC)

 

Anti-CAF Performance: Ensures long-term reliability in high-density designs

 

Low Water Absorption: Maintains stability in challenging environments

 

UV Blocking/AOI Compatibility: Supports automated optical inspection

 

Quality Assurance
We are committed to delivering PCBs that meet the highest standards of quality and reliability. Our manufacturing process adheres to IPC-Class-2 compliance, ensuring robust performance for a wide range of industrial applications.

 

All constructions are supplied in Gerber RS-274-X format, guaranteeing compatibility with your production systems. Before shipment, every PCB undergoes 100% electrical testing to verify functionality and eliminate defects.

 

With global availability, we are ready to ship our high-quality PCBs to your location, no matter where you are in the world. Trust us to provide the precision and reliability your projects demand.

 

Hybrid PCB 10mil RO4350B and S1000-2M 4-Layer 1.6mm Impedance Board 0

 

Ideal Applications
This PCB is perfect for:

 

Commercial Airline Broadband Antennas

Microstrip and Stripline Circuits

Millimeter-Wave Devices

Radar and Guidance Systems

Point-to-Point Digital Radio Antennas

 

Why Choose Us?
Cutting-Edge Materials: RO4350B and S1000-2M deliver superior electrical and thermal performance.

 

Precision Engineering: Features like impedance control, via filling, and edge plating ensure reliability.

 

Global Support: We ship high-quality PCBs worldwide, ensuring timely delivery.

 

Proven Reliability: Compliant with IPC-Class-2 standards, our PCBs are built to withstand the toughest conditions.

 

Contact Us Today!
If you're looking for a high-performance PCB solution for RF, microwave, or high-speed digital applications, this 4-layer PCB is the answer. Reach out to us today to discuss your requirements or request a quote.

 

Hybrid PCB 10mil RO4350B and S1000-2M 4-Layer 1.6mm Impedance Board 1

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