| MOQ: | 1PCS |
| Price: | USD9.99-99.99/PCS |
| Standard Packaging: | Vacuum bags+Cartons |
| Delivery Period: | 8-9 working days |
| Payment Method: | T/T |
| Supply Capacity: | 5000PCS per month |
When it comes to high-frequency and high-reliability electronics, the foundation of your design lies in the PCB. Our 4-layer PCB, built with Rogers RO4350B and S1000-2M materials, is meticulously designed to meet the demands of RF, microwave, and high-speed digital applications. Whether you're developing commercial airline broadband antennas, radar systems, or millimeter-wave devices, this PCB delivers unmatched performance, thermal stability, and reliability.
Core Specifications
Layer Count: 4
Materials: RO4350B (top layers) and S1000-2M (core)
Solder Mask: Green (Top), None (Bottom)
Silkscreen: White (Top), None (Bottom)
Surface Finish: ENIG (Electroless Nickel Immersion Gold)
Board Thickness: 1.6mm
Dimensions: 90mm x 95mm (±0.15mm)
Trace/Space: 5mil / 4mil (minimum)
Hole Size: 0.35mm (minimum)
Via Plating: 20μm thickness
Via Filling/Capping: 0.35mm vias filled and capped
Impedance Control: 50Ω on top layer (5mil/9mil trace/gap)
Edge Plating: Applied to designated areas
PCB Stack-Up
Our 4-layer PCB is constructed with precision to ensure optimal electrical and thermal performance:
Layer 1 (Top): 35μm copper
RO4350B Laminate: 0.254mm (10mil)
Layer 2 (Inner): 35μm copper
Prepreg (1080 RC63%): 0.0644mm (2.5mil)
Layer 3 (Inner): 35μm copper
S1000-2M Core: 1.1mm (43mil)
Layer 4 (Bottom): 35μm copper
Why RO4350B?
RO4350B is a game-changer for RF and microwave applications, offering:
Consistent Dk: 3.48 ±0.05 @ 10GHz/23°C
Ultra-Low Loss: Dissipation factor of 0.0037 @ 10GHz/23°C
Exceptional Thermal Stability: Tg >280°C (536°F)
Low CTE: Matches copper for excellent dimensional stability (X/Y: 10/12 ppm/°C, Z: 32 ppm/°C)
Minimal Water Absorption: 0.06% for reliable performance in humid conditions
Thermal Conductivity: 0.69 W/m/°K for efficient heat dissipation
UL 94 V-0 Rating: Ideal for high-power RF designs
| RO4350B Typical Value | |||||
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0037 0.0031 |
Z | 10 GHz/23℃ 2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432) 14,153(2,053) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5) 130(18.9) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255 (37) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.5 | X,Y | mm/m (mil/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10 12 32 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 390 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.69 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
| Density | 1.86 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 0.88 (5.0) |
N/mm (pli) |
after solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
| Flammability | (3)V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Why S1000-2M?
S1000-2M complements RO4350B with its robust mechanical and thermal properties:
Low Z-Axis CTE: Enhances through-hole reliability
High Heat Resistance: Tg of 180°C (DSC)
Anti-CAF Performance: Ensures long-term reliability in high-density designs
Low Water Absorption: Maintains stability in challenging environments
UV Blocking/AOI Compatibility: Supports automated optical inspection
Quality Assurance
We are committed to delivering PCBs that meet the highest standards of quality and reliability. Our manufacturing process adheres to IPC-Class-2 compliance, ensuring robust performance for a wide range of industrial applications.
All constructions are supplied in Gerber RS-274-X format, guaranteeing compatibility with your production systems. Before shipment, every PCB undergoes 100% electrical testing to verify functionality and eliminate defects.
With global availability, we are ready to ship our high-quality PCBs to your location, no matter where you are in the world. Trust us to provide the precision and reliability your projects demand.
![]()
Ideal Applications
This PCB is perfect for:
Commercial Airline Broadband Antennas
Microstrip and Stripline Circuits
Millimeter-Wave Devices
Radar and Guidance Systems
Point-to-Point Digital Radio Antennas
Why Choose Us?
Cutting-Edge Materials: RO4350B and S1000-2M deliver superior electrical and thermal performance.
Precision Engineering: Features like impedance control, via filling, and edge plating ensure reliability.
Global Support: We ship high-quality PCBs worldwide, ensuring timely delivery.
Proven Reliability: Compliant with IPC-Class-2 standards, our PCBs are built to withstand the toughest conditions.
Contact Us Today!
If you're looking for a high-performance PCB solution for RF, microwave, or high-speed digital applications, this 4-layer PCB is the answer. Reach out to us today to discuss your requirements or request a quote.
![]()
| MOQ: | 1PCS |
| Price: | USD9.99-99.99/PCS |
| Standard Packaging: | Vacuum bags+Cartons |
| Delivery Period: | 8-9 working days |
| Payment Method: | T/T |
| Supply Capacity: | 5000PCS per month |
When it comes to high-frequency and high-reliability electronics, the foundation of your design lies in the PCB. Our 4-layer PCB, built with Rogers RO4350B and S1000-2M materials, is meticulously designed to meet the demands of RF, microwave, and high-speed digital applications. Whether you're developing commercial airline broadband antennas, radar systems, or millimeter-wave devices, this PCB delivers unmatched performance, thermal stability, and reliability.
Core Specifications
Layer Count: 4
Materials: RO4350B (top layers) and S1000-2M (core)
Solder Mask: Green (Top), None (Bottom)
Silkscreen: White (Top), None (Bottom)
Surface Finish: ENIG (Electroless Nickel Immersion Gold)
Board Thickness: 1.6mm
Dimensions: 90mm x 95mm (±0.15mm)
Trace/Space: 5mil / 4mil (minimum)
Hole Size: 0.35mm (minimum)
Via Plating: 20μm thickness
Via Filling/Capping: 0.35mm vias filled and capped
Impedance Control: 50Ω on top layer (5mil/9mil trace/gap)
Edge Plating: Applied to designated areas
PCB Stack-Up
Our 4-layer PCB is constructed with precision to ensure optimal electrical and thermal performance:
Layer 1 (Top): 35μm copper
RO4350B Laminate: 0.254mm (10mil)
Layer 2 (Inner): 35μm copper
Prepreg (1080 RC63%): 0.0644mm (2.5mil)
Layer 3 (Inner): 35μm copper
S1000-2M Core: 1.1mm (43mil)
Layer 4 (Bottom): 35μm copper
Why RO4350B?
RO4350B is a game-changer for RF and microwave applications, offering:
Consistent Dk: 3.48 ±0.05 @ 10GHz/23°C
Ultra-Low Loss: Dissipation factor of 0.0037 @ 10GHz/23°C
Exceptional Thermal Stability: Tg >280°C (536°F)
Low CTE: Matches copper for excellent dimensional stability (X/Y: 10/12 ppm/°C, Z: 32 ppm/°C)
Minimal Water Absorption: 0.06% for reliable performance in humid conditions
Thermal Conductivity: 0.69 W/m/°K for efficient heat dissipation
UL 94 V-0 Rating: Ideal for high-power RF designs
| RO4350B Typical Value | |||||
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0037 0.0031 |
Z | 10 GHz/23℃ 2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432) 14,153(2,053) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5) 130(18.9) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255 (37) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.5 | X,Y | mm/m (mil/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10 12 32 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 390 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.69 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
| Density | 1.86 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 0.88 (5.0) |
N/mm (pli) |
after solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
| Flammability | (3)V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Why S1000-2M?
S1000-2M complements RO4350B with its robust mechanical and thermal properties:
Low Z-Axis CTE: Enhances through-hole reliability
High Heat Resistance: Tg of 180°C (DSC)
Anti-CAF Performance: Ensures long-term reliability in high-density designs
Low Water Absorption: Maintains stability in challenging environments
UV Blocking/AOI Compatibility: Supports automated optical inspection
Quality Assurance
We are committed to delivering PCBs that meet the highest standards of quality and reliability. Our manufacturing process adheres to IPC-Class-2 compliance, ensuring robust performance for a wide range of industrial applications.
All constructions are supplied in Gerber RS-274-X format, guaranteeing compatibility with your production systems. Before shipment, every PCB undergoes 100% electrical testing to verify functionality and eliminate defects.
With global availability, we are ready to ship our high-quality PCBs to your location, no matter where you are in the world. Trust us to provide the precision and reliability your projects demand.
![]()
Ideal Applications
This PCB is perfect for:
Commercial Airline Broadband Antennas
Microstrip and Stripline Circuits
Millimeter-Wave Devices
Radar and Guidance Systems
Point-to-Point Digital Radio Antennas
Why Choose Us?
Cutting-Edge Materials: RO4350B and S1000-2M deliver superior electrical and thermal performance.
Precision Engineering: Features like impedance control, via filling, and edge plating ensure reliability.
Global Support: We ship high-quality PCBs worldwide, ensuring timely delivery.
Proven Reliability: Compliant with IPC-Class-2 standards, our PCBs are built to withstand the toughest conditions.
Contact Us Today!
If you're looking for a high-performance PCB solution for RF, microwave, or high-speed digital applications, this 4-layer PCB is the answer. Reach out to us today to discuss your requirements or request a quote.
![]()