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| PCB Material: | RO4350B - 0.254 Mm (10mil); S1000-2M - 1.1 Mm (43mil) | Layer Count: | 4-layer |
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| PCB Thickness: | 1.6 Mm | Solder Mask: | Green |
| Silkscreen: | White | Surface Finish: | ENIG (Electroless Nickel Immersion Gold) |
| Highlight: | S1000-2M Hybrid PCB,1.6mm Impedance Board,10mil RO4350B Hybrid PCB |
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When it comes to high-frequency and high-reliability electronics, the foundation of your design lies in the PCB. Our 4-layer PCB, built with Rogers RO4350B and S1000-2M materials, is meticulously designed to meet the demands of RF, microwave, and high-speed digital applications. Whether you're developing commercial airline broadband antennas, radar systems, or millimeter-wave devices, this PCB delivers unmatched performance, thermal stability, and reliability.
Core Specifications
Layer Count: 4
Materials: RO4350B (top layers) and S1000-2M (core)
Solder Mask: Green (Top), None (Bottom)
Silkscreen: White (Top), None (Bottom)
Surface Finish: ENIG (Electroless Nickel Immersion Gold)
Board Thickness: 1.6mm
Dimensions: 90mm x 95mm (±0.15mm)
Trace/Space: 5mil / 4mil (minimum)
Hole Size: 0.35mm (minimum)
Via Plating: 20μm thickness
Via Filling/Capping: 0.35mm vias filled and capped
Impedance Control: 50Ω on top layer (5mil/9mil trace/gap)
Edge Plating: Applied to designated areas
PCB Stack-Up
Our 4-layer PCB is constructed with precision to ensure optimal electrical and thermal performance:
Layer 1 (Top): 35μm copper
RO4350B Laminate: 0.254mm (10mil)
Layer 2 (Inner): 35μm copper
Prepreg (1080 RC63%): 0.0644mm (2.5mil)
Layer 3 (Inner): 35μm copper
S1000-2M Core: 1.1mm (43mil)
Layer 4 (Bottom): 35μm copper
Why RO4350B?
RO4350B is a game-changer for RF and microwave applications, offering:
Consistent Dk: 3.48 ±0.05 @ 10GHz/23°C
Ultra-Low Loss: Dissipation factor of 0.0037 @ 10GHz/23°C
Exceptional Thermal Stability: Tg >280°C (536°F)
Low CTE: Matches copper for excellent dimensional stability (X/Y: 10/12 ppm/°C, Z: 32 ppm/°C)
Minimal Water Absorption: 0.06% for reliable performance in humid conditions
Thermal Conductivity: 0.69 W/m/°K for efficient heat dissipation
UL 94 V-0 Rating: Ideal for high-power RF designs
| RO4350B Typical Value | |||||
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0037 0.0031 |
Z | 10 GHz/23℃ 2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432) 14,153(2,053) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5) 130(18.9) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255 (37) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.5 | X,Y | mm/m (mil/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10 12 32 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 390 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.69 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
| Density | 1.86 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 0.88 (5.0) |
N/mm (pli) |
after solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
| Flammability | (3)V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Why S1000-2M?
S1000-2M complements RO4350B with its robust mechanical and thermal properties:
Low Z-Axis CTE: Enhances through-hole reliability
High Heat Resistance: Tg of 180°C (DSC)
Anti-CAF Performance: Ensures long-term reliability in high-density designs
Low Water Absorption: Maintains stability in challenging environments
UV Blocking/AOI Compatibility: Supports automated optical inspection
Quality Assurance
We are committed to delivering PCBs that meet the highest standards of quality and reliability. Our manufacturing process adheres to IPC-Class-2 compliance, ensuring robust performance for a wide range of industrial applications.
All constructions are supplied in Gerber RS-274-X format, guaranteeing compatibility with your production systems. Before shipment, every PCB undergoes 100% electrical testing to verify functionality and eliminate defects.
With global availability, we are ready to ship our high-quality PCBs to your location, no matter where you are in the world. Trust us to provide the precision and reliability your projects demand.
Ideal Applications
This PCB is perfect for:
Commercial Airline Broadband Antennas
Microstrip and Stripline Circuits
Millimeter-Wave Devices
Radar and Guidance Systems
Point-to-Point Digital Radio Antennas
Why Choose Us?
Cutting-Edge Materials: RO4350B and S1000-2M deliver superior electrical and thermal performance.
Precision Engineering: Features like impedance control, via filling, and edge plating ensure reliability.
Global Support: We ship high-quality PCBs worldwide, ensuring timely delivery.
Proven Reliability: Compliant with IPC-Class-2 standards, our PCBs are built to withstand the toughest conditions.
Contact Us Today!
If you're looking for a high-performance PCB solution for RF, microwave, or high-speed digital applications, this 4-layer PCB is the answer. Reach out to us today to discuss your requirements or request a quote.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
