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6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

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Hybrid PCB on RO4350B and High TG FR4 material 4-layer Blind Vias

Hybrid PCB on RO4350B and High TG FR4 material 4-layer Blind Vias

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Customer Reviews
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias
6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

Large Image :  6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-332.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
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6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

Description
Base Material: RO4350B + High Tg FR-4 (S1000-2M) Layer Count: 6 Layers
PCB Thickness: 1.3mm PCB Size: 30.55mm X 37.7mm (1 Piece) With Tolerance Of ±0.15mm
Silkscreen: White Solder Mask: Green
Copper Weight: 1oz (1.4 Mils) For Inner/outter Layers Surface Finish: Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Highlight:

6-layer hybrid PCB RO4350B

,

high Tg FR-4 PCB

,

blind vias multilayer PCB

6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias
This 6-layer hybrid PCB combines Rogers RO4350B (high-frequency laminate) and High Tg FR-4 (S1000-2M) to optimize performance for high-frequency, mission-critical applications.
PCB Specification
Construction Parameter Specification
Base Material RO4350B + High Tg FR-4 (S1000-2M)
Layer Count 6-layer
Board Dimensions 30.55mm x 37.7mm (1 piece) with tolerance of ±0.15mm
Minimum Trace/Space 4 mils / 4 mils
Minimum Hole Size 0.25mm
Vias (Special Types) Blind vias (L1-L2)
Finished Board Thickness 1.3mm
Finished Copper Weight (Inner/Outer Layers) 1oz (1.4 mils)
Via Plating Thickness 20 μm
Surface Finish Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Top Silkscreen White
Bottom Silkscreen White
Top Solder Mask No
Bottom Solder Mask Green
Quality Assurance (Electrical Testing) 100% Electrical test performed prior to shipment
Hybrid PCB Stack-up
Layer Sequence Layer Type Specification Thickness
1 Copper Layer (Top) Copper_layer_1 35 μm
2 Laminate RO4350B 0.102mm (4mil)
3 Copper Layer Copper_layer_2 35 μm
4 Prepreg 1080 RC63% + 7628 (43%) 0.254mm (10mil)
5 Copper Layer Copper_layer_3 35 μm
6 Core Material S1000-2M 0.254mm (10mil)
7 Copper Layer Copper_layer_4 35 μm
8 Prepreg 1080 RC63% + 7628 (43%) 0.254mm (10mil)
9 Copper Layer Copper_layer_5 35 μm
10 Core Material S1000-2M 0.254mm (10mil)
11 Copper Layer (Bottom) Copper_layer_6 35 μm
What is a Hybrid PCB?
A hybrid PCB (also known as a mixed-material PCB) is a specialized circuit board that integrates two or more distinct base materials in its stack-up, each selected to optimize specific performance attributes. Unlike single-material PCBs, which must compromise on certain properties, hybrid PCBs leverage the strengths of each material to address diverse design requirements.
6-layer hybrid PCB with RO4350B and High Tg FR-4 materials
Rogers RO4350B Material Overview
Rogers RO4350B is a proprietary laminate composed of woven glass reinforcement blended with hydrocarbon/ceramic compounds, striking a balance between PTFE/woven glass-like electrical performance and the manufacturing simplicity of epoxy/glass materials.
Tailored for high-frequency applications, RO4350B laminates offer tightly controlled dielectric constant (Dk) and maintain ultra-low signal loss--all while being processable using standard epoxy/glass manufacturing workflows. A cost-effective alternative to traditional microwave laminates, RO4350B eliminates the need for specialized through-hole treatments or handling procedures required by PTFE-based materials. It also holds a UL 94 V-0 flammability rating, making it suitable for active electronic devices and high-power RF designs.
RO4350B Properties
Property Specification
Material Type Proprietary woven glass reinforced hydrocarbon/ceramic laminate
Dielectric Constant (Dk) 3.48 ±0.05 (measured at 10GHz/23°C)
Dissipation Factor (Df) 0.0037 (measured at 10GHz/23°C)
Thermal Conductivity 0.69 W/m/°K
Coefficient of Thermal Expansion (CTE) X-axis: 10 ppm/°C
Y-axis: 12 ppm/°C
Z-axis: 32 ppm/°C
Glass Transition Temperature (Tg) >280°C (536°F)
Moisture Absorption 0.06% (max)
Flammability Rating UL 94 V-0
Core Features (S1000-2M High Tg FR-4)
  • Reduced Z-axis CTE, enhancing through-hole reliability in demanding environments
  • Superior mechanical processability paired with exceptional thermal resistance
  • Lead-free soldering compatibility, aligning with modern manufacturing standards
  • Glass Transition Temperature (Tg): 180°C (per DSC testing); UV-blocking properties for AOI compatibility
  • Outstanding high-heat endurance for stable performance in elevated temperature conditions
  • Excellent Anti-CAF (Conductive Anodic Filtration) performance, mitigating long-term reliability risks
  • Minimal moisture absorption, ensuring durability in humid operating environments
Typical Applications
  • Commercial Airline Broadband Antennas
  • Microstrip and Stripline Circuits
  • Millimeter Wave Systems
  • Radar & Guidance Systems
  • Point-to-Point Digital Radio Antennas
Hybrid PCB application in RF systems

Tag:

Hybrid High TG PCB,

13.3mil High TG PCB,

13.3mil 3 Layer PCB Board

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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