This custom 2-layer rigid PCB is fabricated with authentic Rogers RO4360G2 high-frequency hydrocarbon ceramic laminate, engineered for stable RF performance in cellular communication hardware. With a 0.4mm finished thickness and compact 48.9mm × 95.4mm board size, this circuit board adopts industry-standard ENEPIG surface finish, green top solder mask and white top silkscreen. Built with pure through-hole vias and precise 5/7 mil fine-line routing, the board meets strict IPC-Class-2 quality standards and undergoes 100% electrical testing before shipment. Balancing reliable high-frequency performance and FR-4 compatible processability, this RO4360G2 PCB is a practical, cost-effective solution for base station power amplifiers and small cell transceiver designs.
PCB Specifications
This 2-layer RO4360G2 PCB features a simplified through-hole structure without blind vias, delivering consistent signal transmission for medium-to-high frequency RF circuits. All fabrication parameters follow standard industrial tolerances to ensure repeatable prototype and batch production results.
| Specification Item |
Parameter Details |
| Base Material |
Rogers RO4360G2 hydrocarbon ceramic laminate |
| Layer Configuration |
2-layer rigid PCB |
| Board Dimensions |
48.9mm × 95.4mm (1PCS) |
| Minimum Trace / Space |
5/7 mils |
| Minimum Hole Size |
0.4mm |
| Via Type |
Through-hole only, no blind vias |
| Finished Board Thickness |
0.4mm |
| Outer Copper Weight |
1oz (1.4 mils) |
| Via Plating Thickness |
20μm |
| Surface Finish |
ENEPIG |
| Silkscreen |
Top: White; Bottom: None |
| Solder Mask |
Top: Green; Bottom: None |
| Pre-Shipment Test |
100% full electrical testing |
PCB Stack-up Structure
The board adopts a symmetrical 2-layer stack-up with a 12mil RO4360G2 core substrate. The balanced copper and dielectric structure delivers stable thermal expansion performance and maintains consistent dielectric properties during assembly and long-term operation.
| Layer Structure |
Material & Thickness |
| Top Copper Layer |
35μm copper foil |
| Dielectric Core |
Rogers RO4360G2, 0.305mm (12mil) |
| Bottom Copper Layer |
35μm copper foil |
PCB Statistic
This RF PCB is designed for compact communication circuit layouts, with component placement optimized for small cell and power amplifier applications. T
| Statistical Item |
Quantity |
| Total Components |
20 |
| Total Pads |
34 |
| Thru Hole Pads |
18 |
| Top SMT Pads |
16 |
| Bottom SMT Pads |
0 |
| Vias |
21 |
| Nets |
2 |
About Rogers RO4360G2 Material
RO4360G2 is a glass-reinforced, hydrocarbon ceramic-filled thermoset laminate developed by Rogers. It delivers a balanced combination of high-frequency performance and manufacturability, standing out as the first high-Dk thermoset laminate that supports FR-4-like processing. The material supports lead-free assembly processes and provides improved rigidity for reliable multilayer fabrication, effectively lowering overall material and manufacturing costs. It can be freely matched with RO440 series prepregs and other low-Dk RO4000 series laminates to meet diverse multilayer RF design requirements.
RO4360G2 Properties
| RO4360G2 Typical Value |
| Property |
RO4360G2 |
Direction |
Units |
Condition |
Test Method |
| Dielectric Constant,εProcess |
6.15±0.15 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
| 2.5 GHz/23℃ |
| Dissipation Factor,tanδ |
0.0038 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
| Thermal Conductivity |
0.75 |
|
W/mK |
50℃ |
ASTM D-5470 |
| Volume Resistivity |
4.0 X 1013 |
|
Ω.cm |
Elevated T |
IPC-TM-650 2.5.17.1 |
| Surface Resistivity |
9.0 X 1012 |
|
Ω |
Elevated T |
IPC-TM-650 2.5.17.1 |
| Electrical Strength |
784 |
Z |
V/mil |
|
IPC-TM-650 2.5.6.2 |
| Tensile Strength |
131 (19) 97(14) |
X Y |
MPa (kpsi) |
40 hrs 50%RH/23 |
ASTM D638 |
| Flexural Strength |
213(31) 145(21) |
X Y |
Mpa (kpsi) |
40 hrs 50%RH/23 |
IPC-TM-650, 2.4.4 |
| Coefficient of Thermal Expansion |
13 14 28 |
X Y Z |
ppm/℃ |
-50 ℃to 288℃ After Replicated Heat Cycle |
IPC-TM-650, 2.1.41 |
| Tg |
>280 |
|
℃ TMA |
|
IPC-TM-650 2.4.24.3 |
| Td |
407 |
|
℃ |
|
ASTM D3850 using TGA |
| T288 |
>30 |
Z |
min |
30 min / 125℃ Prebake |
IPC-TM-650 2.2.24.1 |
| Moisure Absorption |
0.08 |
|
% |
50℃/48hr |
IPC-TM-650 2.6.2.1 ASTM D570 |
| Thermal Coefficient of er |
-131 @10 GHz |
Z |
ppm/℃ |
-50℃ to 150 ℃ |
IPC-TM-650, 2.5.5.5 |
| Density |
2.16 |
|
gm/cm3 |
RT |
ASTM D792 |
| Copper Peel Stength |
5.2 (0.91) |
|
pli (N/mm) |
Condtion B |
IPC-TM-650 2.4.8 |
| Flammability |
V-0 |
|
|
|
UL 94 File QMTS2. E102765 |
Product Benefits
The unique material properties and process compatibility of RO4360G2 bring practical advantages for commercial RF communication production and design:
Greater design flexibility for compact high-Dk RF circuit layouts, suitable for miniaturized communication devices
Stable plated through-hole performance, reducing failure risks during long-term high-power operation
Fully compatible with automated assembly lines, improving production efficiency for mass manufacturing
Supports lead-free processing, meeting global environmental and industrial assembly standards
Cost-effective material solution with stable supply chains and shorter lead times compared to traditional high-frequency substrates
Typical Applications
This 2-layer RO4360G2 PCB is targeted at commercial wireless communication infrastructure scenarios that demand stable high-frequency performance and cost efficiency:
- Base Station Power Amplifiers
- Small Cell Transceivers
Conclusion
This custom Rogers RO4360G2 rigid PCB offers reliable high-frequency performance for cellular communication infrastructure projects. Combining high dielectric constant, low signal loss and copper-matched thermal expansion properties, the board delivers stable electrical output for power amplifier and small cell transceiver applications. Process-compatible with standard FR-4 workflows and certified to IPC-Class-2 standards, every board passes full electrical testing before delivery. We support worldwide shipping and provide customized RO4360G2 PCB prototyping and mass production services for RF communication clients.
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