2-Layer 2.54mm Thick Rogers TMM3 EPIG Finish RF Microwave PCB

This 2-layer Rogers TMM3 rigid PCB is a high-performance thermoset microwave circuit board engineered for stable and reliable RF/microwave operation. Fabricated with authentic Rogers TMM3 ceramic thermoset polymer composite substrate, the board features a full finished thickness of 2.54mm and 1 oz (1.4 mils) outer copper weight. It adopts nickel-free EPIG surface finish to deliver superior conductivity and pure signal transmission performance, paired with 20 μm uniform via plating for consistent circuit connectivity. Built with a no-blind-via structure and large 2.5mm minimum hole size, the PCB applies full non-silkscreen and non-solder-mask configuration on both sides. 

PCB Specification

This industrial-grade 2-layer rigid PCB structure delivers uniform mechanical stability and consistent electrical performance for high-frequency microwave operation. The symmetrical layer configuration eliminates structural imbalance risks and supports high-yield, reliable fabrication for standard RF circuit applications.

PCB Stack-up Structure:

PCB Statistic

Rogers TMM3 Material Introduction

Rogers TMM3 is a high-performance ceramic thermoset polymer composite laminate belonging to the TMM thermoset microwave material series. It is engineered for high-reliability plated thru-hole stripline and microstrip microwave circuitry, integrating the core advantages of rigid ceramic substrates and conventional PTFE microwave laminates without requiring complex specialized fabrication techniques.

Formulated with premium thermoset resin systems, TMM3 maintains stable structural rigidity at elevated temperatures and avoids softening deformation. This inherent thermal stability enables reliable wire bonding procedures with zero risks of pad lifting or substrate delamination during electronic packaging processes. The material supports standard PCB manufacturing workflows and requires no sodium napthanate pre-treatment before electroless plating, greatly improving fabrication efficiency and process compatibility.

Superior Electrical & Thermal Properties

TMM3 Material Benefits & Advantages

Surpassing standard FR4 and conventional microwave substrates, Rogers TMM3 PCB features outstanding mechanical robustness and full-process fabrication adaptability, ideal for stable long-term high-frequency RF operation.

Excellent mechanical stability: Unique material composition effectively resists creep and cold flow under continuous operating stress

Superior chemical tolerance: Strong resistance to standard PCB process chemicals and etchants, minimizing substrate damage and improving production yield

Simplified metallization workflow: Eliminates sodium napthanate pre-treatment for electroless plating, streamlining manufacturing procedures

High thermal cycling reliability: Copper-matched thermal expansion properties prevent structural fracture and PTH failure during temperature changes

Strict quality control: 100% full electrical inspection after production eliminates functional defects for consistent batch quality

Typical Applications

With ultra-low signal loss, excellent dielectric stability and reliable mechanical durability, TMM3 microwave PCBs are widely deployed in high-precision RF and microwave industrial systems:

• Precision chip testers and industrial testing equipment
• Microwave dielectric polarizers and optical lenses
• RF filters, signal couplers and power divider components
• GPS (Global Positioning System) antenna systems
• High-stability patch antenna assemblies
• RF power amplifiers and combiners
• General high-frequency RF and microwave circuitry
• Commercial and industrial satellite communication systems

Quality & Service Guarantee

All Rogers TMM3 high-frequency PCBs are fabricated in strict compliance with IPC-Class-2 industrial quality standards. Processed with standard Gerber RS-274-X design files, these circuit boards deliver precise dimensional accuracy and stable electrical consistency for professional high-frequency circuitry. Every finished PCB undergoes comprehensive electrical performance verification prior to shipment to ensure zero functional defects. Supported by global logistics and professional technical services, these reliable TMM3 microwave PCB solutions serve industrial manufacturing and high-end R&D scenarios worldwide.