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Rogers RO4003C PCB Board 4-Layer with 60mm x 60mm Size and 4.8mm Thickness for High-Frequency Applications

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Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

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Rogers RO4003C PCB Board 4-Layer with 60mm x 60mm Size and 4.8mm Thickness for High-Frequency Applications

Rogers RO4003C PCB Board 4-Layer with 60mm x 60mm Size and 4.8mm Thickness for High-Frequency Applications
Rogers RO4003C PCB Board 4-Layer with 60mm x 60mm Size and 4.8mm Thickness for High-Frequency Applications Rogers RO4003C PCB Board 4-Layer with 60mm x 60mm Size and 4.8mm Thickness for High-Frequency Applications

Large Image :  Rogers RO4003C PCB Board 4-Layer with 60mm x 60mm Size and 4.8mm Thickness for High-Frequency Applications

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-052.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Contact Now

Rogers RO4003C PCB Board 4-Layer with 60mm x 60mm Size and 4.8mm Thickness for High-Frequency Applications

Description
Base Material: Rogers' RO4003C Layer Count: 4-layer
PCB Thickness: 4.8mm PCB Size: 60mm X 60mm Per Piece, With A Tolerance Of +/- 0.15mm
Copper Weight: 1oz (1.4 Mils) For Both Inner And Outer Layers Surface Finish: Electroless Nickel Immersion Gold (ENIG)
Highlight:

4-layer Rogers PCB Board

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60mm x 60mm size Rogers RO4003C PCB

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4.8mm thickness High-Frequency PCB

Rogers RO4003C PCB 4-Layer with countersunk holes
This high-performance 4-layer PCB is engineered using Rogers' RO4003C material--a woven glass reinforced hydrocarbon/ceramic laminate--to deliver exceptional electrical performance and manufacturability, making it ideal for high-frequency and RF applications.
PCB Construction Details
Parameter Details
Base Material Rogers' RO4003C, a proprietary woven glass reinforced hydrocarbon/ceramic material combining PTFE/woven glass electrical performance with epoxy/glass manufacturability.
Layer Count 4-layer rigid PCB, optimized for complex high-frequency signal routing and multi-layer functionality.
Board Dimensions 60mm x 60mm per piece, with a tolerance of +/- 0.15mm for precise assembly fit.
Minimum Trace/Space 4/5 mils, enabling fine signal routing critical for high-frequency operations.
Minimum Hole Size 0.4mm, accommodating small components and ensuring reliable interconnections.
Finished Board Thickness 4.8mm, providing robust structural integrity for demanding applications.
Finished Copper Weight 1oz (1.4 mils) for both inner and outer layers, ensuring low resistance and efficient current handling.
Surface Finish Electroless Nickel Immersion Gold (ENIG), offering excellent corrosion resistance, solderability, and stable electrical contact.
Silkscreen Black silkscreen on the top layer for clear component labeling; no silkscreen on the bottom layer.
Solder Mask No solder mask on either top or bottom layers.
Special Features Includes countersunk holes (conical, 90-degree) for secure mounting.
Quality Assurance Undergoes 100% electrical testing prior to shipment, ensuring faultless performance and compliance with design specifications.
PCB Stack-up
The 5-layer rigid PCB features a precise stack-up designed for optimal signal integrity and thermal stability:
Layer Specification
Copper Layer 1 35 μm, providing a solid conductive path for high-frequency signals.
Rogers 4003C Core 0.508mm (20mil) thickness, forming the top insulating layer with stable dielectric properties.
Copper Layer 2 35 μm, facilitating intermediate signal routing.
Prepreg RO4450F (x2) 0.204mm total thickness, ensuring reliable adhesion between layers.
Rogers 4003C Core 1.524mm (60mil) thickness, serving as a central insulating layer.
Prepreg RO4450F (x2) 0.204mm total thickness, maintaining layer bonding.
Rogers 4003C Core 1.524mm (60mil) thickness, enhancing structural rigidity and insulation.
Prepreg RO4450F (x2) 0.204mm total thickness, ensuring layer integrity.
Copper Layer 3 35 μm, supporting additional signal and power routing.
Rogers 4003C Core 0.508mm (20mil) thickness, forming the bottom insulating layer.
Copper Layer 4 35 μm, mirroring the top layer for balanced electrical performance.

RO4003C PCB board close-up showing layer structure and countersunk holes

Artwork and Standards
Artwork Supplied:
Gerber RS-274-X, the industry-standard format for PCB manufacturing, ensuring compatibility with production processes.
Quality Standard:
Manufactured to IPC-Class-2 specifications, guaranteeing high quality and reliability for general and high-frequency electronics.
RO4003C Material Overview
Rogers' RO4003C is a woven glass reinforced hydrocarbon/ceramic laminate that combines the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. It is available in configurations using 1080 and 1674 glass fabrics, all meeting the same electrical performance standards.
Unlike PTFE-based materials, RO4003C requires no special through-hole treatments or handling procedures, simplifying manufacturing. It is non-brominated and not UL 94 V-0 rated.

RO4003C material sample showing laminate structure

Key Features of RO4003C
  • Dielectric Constant: 3.38 +/-0.05 at 10GHz, ensuring consistent signal propagation.
  • Dissipation Factor: 0.0027 at 10GHz and 0.0021 at 2.5GHz, minimizing signal loss across frequencies.
  • Thermal Coefficient of Dielectric Constant: +40 ppm/°C, maintaining stability over temperature ranges.
  • Thermal Conductivity: 0.71 W/m/°K, enabling efficient heat dissipation.
  • CTE: X-axis: 11ppm/°C, Y-axis: 14ppm/°C, Z-axis: 46ppm/°C, ensuring dimensional stability and compatibility with copper.
  • Moisture Absorption: 0.06%, maintaining performance in humid environments.
  • Tg: >280°C (536°F), ensuring stable expansion characteristics during processing.
Benefits of the PCB
  • Ideal for Multi-Layer Constructions: RO4003C's properties support complex multi-layer board designs, critical for high-frequency applications.
  • Cost-Effective Manufacturing: Processes like FR-4 at a fraction of the cost of conventional microwave laminates, reducing production expenses.
  • High-Volume Compatibility: Designed for performance-sensitive, high-volume applications without compromising on quality.
  • Reliable Through-Holes: Low Z-axis CTE ensures reliable plated through-hole quality, even in severe thermal shock conditions.
  • Dimensional Stability: CTE similar to copper enhances stability, making it suitable for mixed dielectric multi-layer boards.
Typical Applications
This PCB is well-suited for:
  • Cellular Base Station Antennas and Power Amplifiers
  • RF Identification Tags
  • Automotive Radar and Sensors
  • Low-Noise Blocks (LNB's) for Direct Broadcast Satellites
Availability:
This PCB is available for worldwide shipping, ensuring accessibility for global manufacturing and project requirements.

RO4003C PCB in application showing mounted components

Tag:

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)

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