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LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided

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China Bicheng Electronics Technology Co., Ltd certification
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Customer Reviews
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

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Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

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Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

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LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided

LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided

Large Image :  LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-332.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
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LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided

Description
Base Material: Rogers RO4003C Low Profile (LoPro) Layer Count: 2 Layers
PCB Thickness: 0.65mm PCB Size: 64mm X 68.4mm Per Piece (1PCS)
Silkscreen: White Solder Mask: Green
Copper Weight: 1oz (1.4 Mils) For Outer Layers Surface Finish: Silver Underplating + Gold Plating
Highlight:

Rogers PCB board 20.7mil substrate

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Double-sided LoPro RO4003C PCB

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Rogers PCB with high-frequency performance

LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
This two-layer PCB is meticulously crafted for high-frequency radio frequency (RF) and high-speed digital applications. It utilizes Rogers RO4003C Low Profile (LoPro) material, a hydrocarbon ceramic laminate featuring proprietary reverse-treated foil technology. This combination enables the PCB to achieve superior signal integrity, minimize conductor losses, and ensure cost-efficient manufacturing processes.
PCB Specification
Parameter Details
Base Material Rogers RO4003C Low Profile (LoPro) - Hydrocarbon ceramic laminate with reverse-treated foil
Layer Count 2-Layer (rigid structure)
Board Dimensions 64mm x 68.4mm per piece (1PCS)
Minimum Trace/Space 5 mils (trace) / 5 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; via plating thickness = 20 μm
Finished Board Thickness 0.65mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Silver underplating + Gold plating
Silkscreen White silkscreen on top layer, no silkscreen on bottom layer
Solder Mask Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance 100% electrical testing conducted prior to shipment
Rogers RO4003C Low Profile Material Introduction
Rogers RO4003C Low Profile (LoPro) is a game-changing hydrocarbon ceramic laminate that redefines cost-effective high-performance PCB design. Its core innovation lies in proprietary reverse-treated foil technology: this allows the foil to bond directly to standard RO4003C dielectric, creating a laminate with drastically reduced conductor loss--while preserving all the desirable attributes of standard RO4003C (e.g., low dielectric loss, FR-4 process compatibility).
Unlike traditional high-frequency materials (e.g., PTFE-based laminates) that require specialized via preparation (e.g., sodium etch), RO4003C LoPro works with standard epoxy/glass (FR-4) fabrication processes. This eliminates extra manufacturing steps, slashes costs, and makes it accessible to most PCB factories. It's designed to bridge the gap between high-performance RF materials and cost-effective digital substrates, making it ideal for mixed-signal applications.
RO4003C Low Profile PCB sample
RO4003C Low Profile Key Features
Feature Specification
Material Composition Hydrocarbon ceramic laminate with reverse-treated foil
Dielectric Constant (Dk) 3.38 ± 0.05 at 10GHz/23°C
Dissipation Factor (DF) 0.0027 at 10GHz/23°C
Thermal Performance - Decomposition Temp (Td): >425°C
- Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity 0.64 W/mK
Coefficient of Thermal Expansion (CTE) - X-axis: 11 ppm/°C
- Y-axis: 14 ppm/°C
- Z-axis: 46 ppm/°C (-55 to 288°C)
Process Compatibility Lead-free process compatible; standard FR-4 fabrication compatible
Additional Attribute CAF (Conductive Anodic Filament) resistant
Material Benefits
RO4003C LoPro's properties translate to tangible advantages for the PCB, solving key challenges in high-speed/RF design and cost-sensitive manufacturing:
  • Ultra-Low Insertion Loss: Reduced conductor loss enables reliable operation beyond 40 GHz.
  • Minimized Passive Intermodulation (PIM): Low PIM levels prevent signal distortion in high-power RF systems.
  • FR-4 Process Compatibility: Uses standard fabrication workflows (no specialized via treatment) to cut manufacturing costs and lead times.
  • Thermal Resilience: High Tg (>280°C) and Td (>425°C) withstand lead-free soldering and high-temperature operating environments.
  • Copper-Matched CTE: X/Y-axis CTE (11/14 ppm/°C) matches copper, eliminating solder joint stress during thermal cycling.
  • CAF Resistance: Protects against conductive anodic filament formation.
  • Design Flexibility: Supports both multi-layer PCBs (for complex digital circuits) and 2-layer designs, adapting to diverse project needs.
Some Typical Applications
  • Digital applications such as servers, routers, and high speed back planes
  • Cellular base station antennas and power amplifiers
  • LNB's for direct broadcast satellites
  • RF Identification Tags
RO4003C Low Profile PCB application example

Tag:

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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