| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Standard Packaging: | Vacuum bags+Cartons |
| Delivery Period: | 8-9 working days |
| Payment Method: | T/T |
| Supply Capacity: | 5000PCS per month |
Rogers High Frequency PCB Made on RT/duroid 5870 with 10mil, 20mil, 31mil and 62mil Coating with Immersion Gold
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Hello Everyone,
Today, we introduce high frequency PCB built on RT/duroid 5870 laminates.
RT/duroid 5870 is glass microfiber reinforced PTFE composite of Rogers Corporation, which is designed for exacting stripline and microstrip circuit applications.
![]()
Let's see the reasons for using RT/duroid 5870 material.
1) The randomly oriented microfibers result in exceptional dielectric constant uniformity.
2) The dielectric constant of RT/duroid 5870 laminates is uniform from panel to panel and is constant over a wide frequency range.
3) Its low dissipation factor extends the usefulness of RT/duroid 5870 laminates to Ku-band and above.
4) Designed for microstrip and stripline application
Our PCB Capability (RT/duroid 5870)
| PCB Capability | |
| PCB Material: | Glass microfiber reinforced PTFE composites |
| Designator: | RT/duroid 5870 |
| Dielectric constant: | 2.33 ±0.02 (process) |
| 2.33 (design) | |
| Layer count: | 1 Layer, 2 Layer, Multilayer, Hybrid type (Mixed) |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil (0.508mm) |
| 31mil (0.787mm), 62mil (1.575mm) | |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin, OSP. |
RT/duroid 5870 is often used in double sided PCB, multilayer PCB and hybrid PCB.It's available in a variety of thicknesses for double sided PCB, such as 10mil, 20mil, 31mil and 62mil. Surface finishes are bare copper, HASL, ENIG, Immersion tine and OSP for option.
![]()
The typical applications are
-microstrip and stripline circuits
-commercial airline broadband antenna
-radar systems
-millimeter wave applications
-point to point digital radio antenna etc.
The basic colour of RT/duroid 5870 PCB is black.
Appendix: Properties of RT/duroid 5870
| RT/duroid 5870 Typical Value | ||||||
| Property | RT/duroid 5870 | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 2.33 2.33±0.02 spec. |
Z | N/A | C24/23/50 C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 |
|
| Dielectric Constant,εDesign | 2.33 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0005 0.0012 |
Z | N/A | C24/23/50 C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 |
|
| Thermal Coefficient of ε | -115 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 | |
| Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 | |
| Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 | |
| Specific Heat | 0.96(0.23) | N/A | j/g/k (cal/g/c) |
N/A | Calculated | |
| Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
| 1300(189) | 490(71) | X | ||||
| 1280(185) | 430(63) | Y | ||||
| Ultimate Stress | 50(7.3) | 34(4.8) | X | |||
| 42(6.1) | 34(4.8) | Y | ||||
| Ultimate Strain | 9.8 | 8.7 | X | % | ||
| 9.8 | 8.6 | Y | ||||
| Compressive Modulus | 1210(176) | 680(99) | X | MPa(kpsi) | A | ASTM D 695 |
| 1360(198) | 860(125) | Y | ||||
| 803(120) | 520(76) | Z | ||||
| Ultimate Stress | 30(4.4) | 23(3.4) | X | |||
| 37(5.3) | 25(3.7) | Y | ||||
| 54(7.8) | 37(5.3) | Z | ||||
| Ultimate Strain | 4 | 4.3 | X | % | ||
| 3.3 | 3.3 | Y | ||||
| 8.7 | 8.5 | Z | ||||
| Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 | |
| Thermal Conductivity | 0.22 | Z | W/m/k | 80℃ | ASTM C 518 | |
| Coefficient of Thermal Expansion | 22 28 173 |
X Y Z |
ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 | |
| Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 | |
| Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 | |
| Copper Peel | 27.2(4.8) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil after solder float |
IPC-TM-650 2.4.8 | |
| Flammability | V-0 | N/A | N/A | N/A | UL 94 | |
| Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A | |
![]()
We specialize in providing you with prototype, small batches and mass production service.
If you have any questions, please feel free to contact us.
Thank you for your reading.
| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Standard Packaging: | Vacuum bags+Cartons |
| Delivery Period: | 8-9 working days |
| Payment Method: | T/T |
| Supply Capacity: | 5000PCS per month |
Rogers High Frequency PCB Made on RT/duroid 5870 with 10mil, 20mil, 31mil and 62mil Coating with Immersion Gold
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Hello Everyone,
Today, we introduce high frequency PCB built on RT/duroid 5870 laminates.
RT/duroid 5870 is glass microfiber reinforced PTFE composite of Rogers Corporation, which is designed for exacting stripline and microstrip circuit applications.
![]()
Let's see the reasons for using RT/duroid 5870 material.
1) The randomly oriented microfibers result in exceptional dielectric constant uniformity.
2) The dielectric constant of RT/duroid 5870 laminates is uniform from panel to panel and is constant over a wide frequency range.
3) Its low dissipation factor extends the usefulness of RT/duroid 5870 laminates to Ku-band and above.
4) Designed for microstrip and stripline application
Our PCB Capability (RT/duroid 5870)
| PCB Capability | |
| PCB Material: | Glass microfiber reinforced PTFE composites |
| Designator: | RT/duroid 5870 |
| Dielectric constant: | 2.33 ±0.02 (process) |
| 2.33 (design) | |
| Layer count: | 1 Layer, 2 Layer, Multilayer, Hybrid type (Mixed) |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil (0.508mm) |
| 31mil (0.787mm), 62mil (1.575mm) | |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin, OSP. |
RT/duroid 5870 is often used in double sided PCB, multilayer PCB and hybrid PCB.It's available in a variety of thicknesses for double sided PCB, such as 10mil, 20mil, 31mil and 62mil. Surface finishes are bare copper, HASL, ENIG, Immersion tine and OSP for option.
![]()
The typical applications are
-microstrip and stripline circuits
-commercial airline broadband antenna
-radar systems
-millimeter wave applications
-point to point digital radio antenna etc.
The basic colour of RT/duroid 5870 PCB is black.
Appendix: Properties of RT/duroid 5870
| RT/duroid 5870 Typical Value | ||||||
| Property | RT/duroid 5870 | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 2.33 2.33±0.02 spec. |
Z | N/A | C24/23/50 C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 |
|
| Dielectric Constant,εDesign | 2.33 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0005 0.0012 |
Z | N/A | C24/23/50 C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 |
|
| Thermal Coefficient of ε | -115 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 | |
| Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 | |
| Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 | |
| Specific Heat | 0.96(0.23) | N/A | j/g/k (cal/g/c) |
N/A | Calculated | |
| Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
| 1300(189) | 490(71) | X | ||||
| 1280(185) | 430(63) | Y | ||||
| Ultimate Stress | 50(7.3) | 34(4.8) | X | |||
| 42(6.1) | 34(4.8) | Y | ||||
| Ultimate Strain | 9.8 | 8.7 | X | % | ||
| 9.8 | 8.6 | Y | ||||
| Compressive Modulus | 1210(176) | 680(99) | X | MPa(kpsi) | A | ASTM D 695 |
| 1360(198) | 860(125) | Y | ||||
| 803(120) | 520(76) | Z | ||||
| Ultimate Stress | 30(4.4) | 23(3.4) | X | |||
| 37(5.3) | 25(3.7) | Y | ||||
| 54(7.8) | 37(5.3) | Z | ||||
| Ultimate Strain | 4 | 4.3 | X | % | ||
| 3.3 | 3.3 | Y | ||||
| 8.7 | 8.5 | Z | ||||
| Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 | |
| Thermal Conductivity | 0.22 | Z | W/m/k | 80℃ | ASTM C 518 | |
| Coefficient of Thermal Expansion | 22 28 173 |
X Y Z |
ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 | |
| Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 | |
| Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 | |
| Copper Peel | 27.2(4.8) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil after solder float |
IPC-TM-650 2.4.8 | |
| Flammability | V-0 | N/A | N/A | N/A | UL 94 | |
| Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A | |
![]()
We specialize in providing you with prototype, small batches and mass production service.
If you have any questions, please feel free to contact us.
Thank you for your reading.