The 2-layer Rogers TMM10i rigid RF PCB is a high-performance isotropic thermoset microwave circuit board built for high-reliability plated through-hole stripline and microstrip applications. Constructed with authentic Rogers TMM10i ceramic thermoset polymer composite substrate and standard 1oz outer copper cladding, this 0.8mm thin high-frequency PCB features premiumENIG surface finishing, dual-sided black solder mask, and double-layer white silkscreen. Delivering consistent isotropic Dk performance, copper-matched thermal expansion, superior chemical inertness, and stable wire-bonding capability, this high-Dk RF PCB serves as a dependable solution for satellite communication, GPS antenna systems, microwave filters, and RF power amplifiers.
What Is Rogers TMM10i? Advanced Substrate Introduction
Rogers TMM10i is an isotropic thermoset microwave material composed of ceramic-filled polymer composite, specifically engineered to maximize plated through-hole reliability for stripline and microstrip microwave circuits. It features a uniform, isotropic dielectric constant that eliminates directional electrical inconsistency. As part of Rogers premium TMM material series, TMM10i successfully merges the high rigidity of ceramic substrates and the stable RF performance of PTFE materials, while maintaining the easy processing characteristics of conventional soft dielectric laminates.
Unlike traditional high-frequency PCB materials, Rogers TMM10i does not require sodium napthanate pretreatment before electroless plating, which streamlines the fabrication workflow, reduces processing risks, and improves production yield. Its robust thermoset resin structure enables consistent, high-quality wire bonding, while outstanding anti-creep mechanical properties and chemical resistance ensure long-term operational stability in harsh manufacturing and application environments.
Core Features of Rogers TMM10i PCB Material
Rogers TMM10i high-frequency laminate integrates excellent electrical uniformity, superior thermal stability, and precise dimensional control, fully meeting the rigorous design requirements of modern high-precision microwave and RF circuits:
| Core Feature |
Technical Parameter |
| Stable Isotropic Dielectric Constant |
Dk value of 9.80 ± 0.245 |
| Ultra-Low Dissipation Factor |
Df of 0.0020 at 10GHz |
| Excellent Thermal Dk Stability |
Thermal coefficient of Dk: -43 ppm/°K |
| Copper-Matched CTE |
Thermal expansion well-matched to copper foil |
| Superior Thermal Resistance |
Decomposition Temperature (Td): 425°C (TGA test) |
| Uniform Multi-Axis CTE |
19ppm/K (X/Y-axis), 20ppm/K (Z-axis) |
| Reliable Thermal Conductivity |
Thermal conductivity: 0.76W/mK |
| Versatile Thickness Availability |
0.0015”–0.500” thickness range, ±0.0015” tolerance |
Key Performance Benefits of Rogers TMM10i PCB
Rogers TMM10i thermoset microwave material offers unique mechanical, chemical, and processing advantages that make it ideal for high-end, high-reliability RF and microwave PCB production:
Enhanced Mechanical Stability: Resists creep deformation and cold flow under sustained mechanical stress and high-temperature environments, maintaining long-term structural consistency
Superior Chemical Resistance: Withstands exposure to various industrial processing chemicals during PCB fabrication, protecting substrate integrity and improving manufacturing yield
Simplified Plating Workflow: Eliminates the need for sodium napthanate pre-treatment before electroless plating, shortening production cycles and reducing overall manufacturing costs
Consistent Wire-Bonding Performance: Thermoset resin-based composition enables stable, repeatable wire bonding, making it highly suitable for precision chip assembly and high-density RF module packaging
Key PCB Construction Specifications
| Parameter Item |
Specific Specification |
| Base Material |
Rogers TMM10i ceramic thermoset polymer composite substrate |
| Layer Count |
2 layers (double-sided rigid PCB structure) |
| Board Dimensions |
104.8mm × 99.01mm with ±0.15mm dimensional tolerance (1 piece) |
| Minimum Trace/Space |
6/9 mils minimum line width/spacing |
| Minimum Hole Size |
0.4mm minimum drilled hole size |
| Via Design |
Through-hole-only structure without blind vias |
| Finished Board Thickness |
0.8mm |
| Finished Copper Weight |
1oz (1.4 mils) outer copper layers |
| Via Plating Thickness |
20μm via copper plating |
| Surface Finish |
ENIG (Electroless Nickel Immersion Gold) |
| Silkscreen |
Dual-sided white silkscreen for clear component labeling and convenient assembly identification |
| Solder Mask |
Black solder mask on top and bottom layers |
| Special Process |
Edge plating treatment to enhance structural robustness and electromagnetic shielding performance |
| Quality Test Standard |
100% full electrical testing conducted before delivery |
2-Layer Rogers TMM10i PCB Stack-up Structure
This 2-layer rigid PCB stack-up consists of double-sided high-purity copper foil and a central Rogers TMM10i thermoset ceramic composite core. This well-structured low-loss stack-up delivers isotropic high-Dk characteristics, copper-matched thermal expansion, and exceptional dimensional stability, perfectly suited for high-precision stripline and microstrip microwave circuit designs.
| Layer Sequence |
Material Specification |
Thickness |
| Outer Layer 1 (Top) |
Conductive copper foil |
35μm |
| Core Dielectric Layer |
Rogers TMM10i ceramic thermoset composite substrate |
0.762mm (30mil) |
| Outer Layer 2 (Bottom) |
Conductive copper foil |
35μm |
PCB Statistics
| Parameter Item |
Specific Value |
| Components |
19 |
| Total Pads |
52 |
| Thru Hole Pads |
38 |
| Top SMT Pads |
14 |
| Bottom SMT Pads |
0 |
| Vias |
18 |
| Nets |
2 |
Accepted Artwork Format: We support standard Gerber RS-274-X file formats for custom PCB fabrication, ensuring precise manufacturing output and efficient technical collaboration with global customers.
Quality Standard: All custom PCBs are produced and inspected in full compliance with IPC-Class-2 industrial standards, ensuring consistent batch quality and long-term operational reliability.
Global Service: We provide worldwide PCB quotation, professional technical consulting, and global shipping services for all customized Rogers TMM10i high-frequency PCB orders.
Typical Application Scenarios
- RF and microwave circuitry
- Power amplifiers and combiners
- Filters and coupler
- Satellite communication systems
- Global Positioning Systems Antennas
- Patch Antennas
- Dielectric polarizers and lenses
- Chip testers
To conclude, the 2-layer Rogers TMM10i rigid PCB adopts premium ceramic thermoset composite dielectric material, delivering high isotropic Dk value, ultra-low high-frequency signal loss, copper-matched thermal expansion, and excellent processing compatibility. Combined with dependable wire-bonding capability and chemical resistance, this high-frequency PCB provides a cost-effective, high-stability solution for advanced microwave and RF circuit designs, widely applied in satellite communication, GPS positioning, and precision microwave testing systems.
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