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2-layer TP1600 High-DK PCB 0.9mm Thick Pure Gold Finish

2-layer TP1600 High-DK PCB 0.9mm Thick Pure Gold Finish

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
PCB Material:
TP1600
Layer Count:
2-layer
PCB Thickness:
0.9mm
PCB Size:
75mm × 68mm (1PCS)
Solder Mask:
Green
Silkscreen:
White
Copper Weight:
1oz (1.4 Mils) Outer Copper Layers
Surface Finish:
Pure Gold Plating
Highlight:

high frequency copper clad laminate

,

F4BM245 copper clad sheet

,

laminated copper sheet PCB

Product Description

This rigid 2-layer TP1600 high-Dk RF PCB is fabricated with specialized ceramic-filled PPO resin dielectric laminate, featuring an ultra-high dielectric constant of 16.0 for circuit miniaturization. Adopting pure gold plating surface finish and manufactured in compliance with IPC-Class-2 industrial standards, this 0.9mm thick PCB delivers stable low dissipation factor, precise dielectric control and radiation resistance. Without fiberglass reinforcement, TP1600 eliminates the weave effect for consistent electrical performance. It is highly suitable for miniaturized antennas, microwave filters, aerospace payloads and defense navigation systems.

 

PCB Specifications

Construction Item Details
Base Material TP1600 – Ceramic-filled PPO resin composite laminate for ultra-high Dk microwave circuits
Layer Count 2 layers – Rigid high-Dk PCB structure engineered for miniaturized RF devices
Board Dimensions 75mm × 68mm (1PCS), with a tight tolerance of +/- 0.15mm for precise assembly consistency
Trace & Space Minimum 4/6 mils, enabling compact circuit routing while preserving superior signal integrity
Minimum Hole Size 0.2mm, designed for high-precision through-hole component installation
Vias No blind vias, simplifying fabrication and ensuring stable interlayer electrical connectivity
Finished Board Thickness 0.9mm, optimized thickness balancing structural rigidity and miniaturization demands
Copper Weight 1oz (1.4 mils) outer copper layers, delivering steady conductivity for RF signal transmission
Via Plating Thickness 20μm, compliant with IPC-Class-2 standards to guarantee durable via conduction
Surface Finish Pure Gold Plating, featuring excellent conductivity, corrosion resistance and high-frequency stability for precision RF circuits
Silkscreen & Solder Mask Top Silkscreen: White; Bottom Silkscreen: White; Top Solder Mask: Green; Bottom Solder Mask: Green — Standard industrial coating for insulation and anti-oxidation protection
Quality Testing 100% electrical testing conducted prior to shipment to ensure reliable circuit performance

 

PCB Stack-up Configuration

Stack-up Component Specifications & Description
Copper Layer 1 35μm – High-purity copper layer for low-resistance microwave signal conduction
TP1600 Core 0.8 mm (31.49mil) – Fiberglass-free ceramic-filled PPO substrate with ultra-high stable Dk value
Copper Layer 2 35μm – Symmetrical copper layout to maintain excellent electrical stability

 

2-layer TP1600 High-DK PCB 0.9mm Thick Pure Gold Finish 0

 

Artwork Format & Compliance Standard

Artwork Format: Delivered in Gerber RS-274-X, the universal industrial standard ensuring high-precision PCB fabrication and full data compatibility.

 

Accepted Standard: IPC-Class-2, ensuring stable and long-term service performance for industrial and military high-frequency electronic devices.

 

Availability: Global shipping service is provided to support worldwide engineering procurement and industrial projects.

 

Introduction of TP1600 Substrate

TP1600 is a specialized high-frequency microwave composite dielectric copper-clad laminate (CCL) belonging to the TP material series. Adopting ceramic-filled polyphenylene oxide (PPO) resin matrix without fiberglass reinforcement, this substrate is molded through high-precision compression technology. The naming convention indicates its fixed nominal dielectric constant of 16.0, which is precisely tuned by adjusting the mixing ratio of ceramic powder and PPO resin.

 

With exclusive customized production craftsmanship, TP1600 delivers excellent dielectric repeatability and industrial-grade reliability. The fiberglass-free structure eliminates weave effect interference, achieving uniform electrical distribution across the entire board. This high-Dk substrate is widely trusted for military, aerospace and high-precision microwave electronic systems.

 

Key Features

TP1600 integrates superior electrical, mechanical and environmental properties for high-Dk microwave industrial applications:

 

Material Type: Fiberglass-free ceramic-filled PPO resin copper-clad laminate

 

Dielectric Constant: 16.0 ± 0.32, enabling extreme circuit miniaturization for compact antennas

 

Dissipation Factor: 0.0012, maintaining ultra-low signal loss up to 10 GHz

 

Temperature Coefficient of Dk (TcDk): -43ppm/°C for stable dielectric performance under temperature fluctuation

 

Z-axis CTE: 45ppm/°C, effectively reducing thermal expansion deformation

 

Smooth substrate surface without fiberglass weave effect

 

Radiation resistance & low outgassing for harsh aerospace environments

 

Key Benefits

TP1600 provides irreplaceable technical advantages for high-Dk microwave circuit designers:

 

Ultra-high Dk value supports miniaturized antenna and resonant structure design to save board space

 

Extremely low Df ensures minimal signal attenuation for high-frequency matching networks

 

Fiberglass-free construction avoids signal distortion caused by weave effect

 

Excellent radiation resistance adapts to aerospace, satellite and military working conditions

 

Easier machining than pure ceramic substrates with higher production yield and lower cost

 

Reliable copper adhesion prevents delamination during precision processing

 

Typical Applications

This TP1600 2-layer RF PCB is extensively applied in high-Dk precision microwave and defense electronic equipment:

 

-Miniaturized Antennas & High-Frequency Sensor Modules

-RF/Microwave Filters, Couplers and Resonant Cavities

-Aerospace, Defense and Satellite Payload Systems

-Beidou Navigation and Missile-Borne Fuze Electronic Units

 

2-layer TP1600 High-DK PCB 0.9mm Thick Pure Gold Finish 1

Products
PRODUCTS DETAILS
2-layer TP1600 High-DK PCB 0.9mm Thick Pure Gold Finish
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
PCB Material:
TP1600
Layer Count:
2-layer
PCB Thickness:
0.9mm
PCB Size:
75mm × 68mm (1PCS)
Solder Mask:
Green
Silkscreen:
White
Copper Weight:
1oz (1.4 Mils) Outer Copper Layers
Surface Finish:
Pure Gold Plating
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

high frequency copper clad laminate

,

F4BM245 copper clad sheet

,

laminated copper sheet PCB

Product Description

This rigid 2-layer TP1600 high-Dk RF PCB is fabricated with specialized ceramic-filled PPO resin dielectric laminate, featuring an ultra-high dielectric constant of 16.0 for circuit miniaturization. Adopting pure gold plating surface finish and manufactured in compliance with IPC-Class-2 industrial standards, this 0.9mm thick PCB delivers stable low dissipation factor, precise dielectric control and radiation resistance. Without fiberglass reinforcement, TP1600 eliminates the weave effect for consistent electrical performance. It is highly suitable for miniaturized antennas, microwave filters, aerospace payloads and defense navigation systems.

 

PCB Specifications

Construction Item Details
Base Material TP1600 – Ceramic-filled PPO resin composite laminate for ultra-high Dk microwave circuits
Layer Count 2 layers – Rigid high-Dk PCB structure engineered for miniaturized RF devices
Board Dimensions 75mm × 68mm (1PCS), with a tight tolerance of +/- 0.15mm for precise assembly consistency
Trace & Space Minimum 4/6 mils, enabling compact circuit routing while preserving superior signal integrity
Minimum Hole Size 0.2mm, designed for high-precision through-hole component installation
Vias No blind vias, simplifying fabrication and ensuring stable interlayer electrical connectivity
Finished Board Thickness 0.9mm, optimized thickness balancing structural rigidity and miniaturization demands
Copper Weight 1oz (1.4 mils) outer copper layers, delivering steady conductivity for RF signal transmission
Via Plating Thickness 20μm, compliant with IPC-Class-2 standards to guarantee durable via conduction
Surface Finish Pure Gold Plating, featuring excellent conductivity, corrosion resistance and high-frequency stability for precision RF circuits
Silkscreen & Solder Mask Top Silkscreen: White; Bottom Silkscreen: White; Top Solder Mask: Green; Bottom Solder Mask: Green — Standard industrial coating for insulation and anti-oxidation protection
Quality Testing 100% electrical testing conducted prior to shipment to ensure reliable circuit performance

 

PCB Stack-up Configuration

Stack-up Component Specifications & Description
Copper Layer 1 35μm – High-purity copper layer for low-resistance microwave signal conduction
TP1600 Core 0.8 mm (31.49mil) – Fiberglass-free ceramic-filled PPO substrate with ultra-high stable Dk value
Copper Layer 2 35μm – Symmetrical copper layout to maintain excellent electrical stability

 

2-layer TP1600 High-DK PCB 0.9mm Thick Pure Gold Finish 0

 

Artwork Format & Compliance Standard

Artwork Format: Delivered in Gerber RS-274-X, the universal industrial standard ensuring high-precision PCB fabrication and full data compatibility.

 

Accepted Standard: IPC-Class-2, ensuring stable and long-term service performance for industrial and military high-frequency electronic devices.

 

Availability: Global shipping service is provided to support worldwide engineering procurement and industrial projects.

 

Introduction of TP1600 Substrate

TP1600 is a specialized high-frequency microwave composite dielectric copper-clad laminate (CCL) belonging to the TP material series. Adopting ceramic-filled polyphenylene oxide (PPO) resin matrix without fiberglass reinforcement, this substrate is molded through high-precision compression technology. The naming convention indicates its fixed nominal dielectric constant of 16.0, which is precisely tuned by adjusting the mixing ratio of ceramic powder and PPO resin.

 

With exclusive customized production craftsmanship, TP1600 delivers excellent dielectric repeatability and industrial-grade reliability. The fiberglass-free structure eliminates weave effect interference, achieving uniform electrical distribution across the entire board. This high-Dk substrate is widely trusted for military, aerospace and high-precision microwave electronic systems.

 

Key Features

TP1600 integrates superior electrical, mechanical and environmental properties for high-Dk microwave industrial applications:

 

Material Type: Fiberglass-free ceramic-filled PPO resin copper-clad laminate

 

Dielectric Constant: 16.0 ± 0.32, enabling extreme circuit miniaturization for compact antennas

 

Dissipation Factor: 0.0012, maintaining ultra-low signal loss up to 10 GHz

 

Temperature Coefficient of Dk (TcDk): -43ppm/°C for stable dielectric performance under temperature fluctuation

 

Z-axis CTE: 45ppm/°C, effectively reducing thermal expansion deformation

 

Smooth substrate surface without fiberglass weave effect

 

Radiation resistance & low outgassing for harsh aerospace environments

 

Key Benefits

TP1600 provides irreplaceable technical advantages for high-Dk microwave circuit designers:

 

Ultra-high Dk value supports miniaturized antenna and resonant structure design to save board space

 

Extremely low Df ensures minimal signal attenuation for high-frequency matching networks

 

Fiberglass-free construction avoids signal distortion caused by weave effect

 

Excellent radiation resistance adapts to aerospace, satellite and military working conditions

 

Easier machining than pure ceramic substrates with higher production yield and lower cost

 

Reliable copper adhesion prevents delamination during precision processing

 

Typical Applications

This TP1600 2-layer RF PCB is extensively applied in high-Dk precision microwave and defense electronic equipment:

 

-Miniaturized Antennas & High-Frequency Sensor Modules

-RF/Microwave Filters, Couplers and Resonant Cavities

-Aerospace, Defense and Satellite Payload Systems

-Beidou Navigation and Missile-Borne Fuze Electronic Units

 

2-layer TP1600 High-DK PCB 0.9mm Thick Pure Gold Finish 1

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