This rigid 2-layer TP1600 high-Dk RF PCB is fabricated with specialized ceramic-filled PPO resin dielectric laminate, featuring an ultra-high dielectric constant of 16.0 for circuit miniaturization. Adopting pure gold plating surface finish and manufactured in compliance with IPC-Class-2 industrial standards, this 0.9mm thick PCB delivers stable low dissipation factor, precise dielectric control and radiation resistance. Without fiberglass reinforcement, TP1600 eliminates the weave effect for consistent electrical performance. It is highly suitable for miniaturized antennas, microwave filters, aerospace payloads and defense navigation systems.
PCB Specifications
| Construction Item |
Details |
| Base Material |
TP1600 – Ceramic-filled PPO resin composite laminate for ultra-high Dk microwave circuits |
| Layer Count |
2 layers – Rigid high-Dk PCB structure engineered for miniaturized RF devices |
| Board Dimensions |
75mm × 68mm (1PCS), with a tight tolerance of +/- 0.15mm for precise assembly consistency |
| Trace & Space |
Minimum 4/6 mils, enabling compact circuit routing while preserving superior signal integrity |
| Minimum Hole Size |
0.2mm, designed for high-precision through-hole component installation |
| Vias |
No blind vias, simplifying fabrication and ensuring stable interlayer electrical connectivity |
| Finished Board Thickness |
0.9mm, optimized thickness balancing structural rigidity and miniaturization demands |
| Copper Weight |
1oz (1.4 mils) outer copper layers, delivering steady conductivity for RF signal transmission |
| Via Plating Thickness |
20μm, compliant with IPC-Class-2 standards to guarantee durable via conduction |
| Surface Finish |
Pure Gold Plating, featuring excellent conductivity, corrosion resistance and high-frequency stability for precision RF circuits |
| Silkscreen & Solder Mask |
Top Silkscreen: White; Bottom Silkscreen: White; Top Solder Mask: Green; Bottom Solder Mask: Green — Standard industrial coating for insulation and anti-oxidation protection |
| Quality Testing |
100% electrical testing conducted prior to shipment to ensure reliable circuit performance |
PCB Stack-up Configuration
| Stack-up Component |
Specifications & Description |
| Copper Layer 1 |
35μm – High-purity copper layer for low-resistance microwave signal conduction |
| TP1600 Core |
0.8 mm (31.49mil) – Fiberglass-free ceramic-filled PPO substrate with ultra-high stable Dk value |
| Copper Layer 2 |
35μm – Symmetrical copper layout to maintain excellent electrical stability |
Artwork Format & Compliance Standard
Artwork Format: Delivered in Gerber RS-274-X, the universal industrial standard ensuring high-precision PCB fabrication and full data compatibility.
Accepted Standard: IPC-Class-2, ensuring stable and long-term service performance for industrial and military high-frequency electronic devices.
Availability: Global shipping service is provided to support worldwide engineering procurement and industrial projects.
Introduction of TP1600 Substrate
TP1600 is a specialized high-frequency microwave composite dielectric copper-clad laminate (CCL) belonging to the TP material series. Adopting ceramic-filled polyphenylene oxide (PPO) resin matrix without fiberglass reinforcement, this substrate is molded through high-precision compression technology. The naming convention indicates its fixed nominal dielectric constant of 16.0, which is precisely tuned by adjusting the mixing ratio of ceramic powder and PPO resin.
With exclusive customized production craftsmanship, TP1600 delivers excellent dielectric repeatability and industrial-grade reliability. The fiberglass-free structure eliminates weave effect interference, achieving uniform electrical distribution across the entire board. This high-Dk substrate is widely trusted for military, aerospace and high-precision microwave electronic systems.
Key Features
TP1600 integrates superior electrical, mechanical and environmental properties for high-Dk microwave industrial applications:
Material Type: Fiberglass-free ceramic-filled PPO resin copper-clad laminate
Dielectric Constant: 16.0 ± 0.32, enabling extreme circuit miniaturization for compact antennas
Dissipation Factor: 0.0012, maintaining ultra-low signal loss up to 10 GHz
Temperature Coefficient of Dk (TcDk): -43ppm/°C for stable dielectric performance under temperature fluctuation
Z-axis CTE: 45ppm/°C, effectively reducing thermal expansion deformation
Smooth substrate surface without fiberglass weave effect
Radiation resistance & low outgassing for harsh aerospace environments
Key Benefits
TP1600 provides irreplaceable technical advantages for high-Dk microwave circuit designers:
Ultra-high Dk value supports miniaturized antenna and resonant structure design to save board space
Extremely low Df ensures minimal signal attenuation for high-frequency matching networks
Fiberglass-free construction avoids signal distortion caused by weave effect
Excellent radiation resistance adapts to aerospace, satellite and military working conditions
Easier machining than pure ceramic substrates with higher production yield and lower cost
Reliable copper adhesion prevents delamination during precision processing
Typical Applications
This TP1600 2-layer RF PCB is extensively applied in high-Dk precision microwave and defense electronic equipment:
-Miniaturized Antennas & High-Frequency Sensor Modules
-RF/Microwave Filters, Couplers and Resonant Cavities
-Aerospace, Defense and Satellite Payload Systems
-Beidou Navigation and Missile-Borne Fuze Electronic Units
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