Product Details:
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Material: | TP1020 | PCB Size: | 43.35mm X 36.56 Mm=1PCS, +/- 0.15mm |
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Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | Immersion Gold |
Layer Count: | 2-layer | PCB Thickness: | 0.8mm |
Highlight: | 1oz Copper RF Circuits,0.8mm RF Circuits,2 layer circuit board 0.8mm |
Introducing our newly shipped PCB featuring Wangling TP, a unique high-frequency thermoplastic material in the industry. TP-type laminates offer exceptional dielectric performance and high reliability, making them an ideal choice for a wide range of applications. With the ability to precisely adjust the dielectric constant by altering the ratio between ceramics and PPO resin, TP laminates provide excellent flexibility for circuit design.
Key Features:
1. Adjustable Dielectric Constant: The dielectric constant of TP laminates can be selected within the range of 3 to 25, allowing precise customization according to circuit requirements. Common dielectric constants include 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 10.2, 11, 16, and 20. The dielectric loss is low and remains relatively stable up to 10 GHz.
2. Wide Operating Temperature Range: TP laminates can withstand long-term operating temperatures ranging from -100°C to +150°C. They exhibit excellent low-temperature resistance. However, it's important to note that temperatures exceeding 180°C may cause deformation, copper foil peeling, and significant changes in electrical performance.
Product Technical Parameter | Product Models & Data Sheet | |||||||||||||||
Product Features | Test Conditions | Unit | TP TP-1 TP-2 | |||||||||||||
Dielectric Constant | When the dielectric constant is ≤11, the test condition is 10GHz. When the dielectric constant is >11, the test condition is 5GHz. |
/ | 3.0±0.06 | 4.4±0.09 | 6.0±0.12 | |||||||||||
6.15±0.12 | 9.2±0.18 | 9.6±0.19 | ||||||||||||||
10.2±0.2 | 11.0±0.022 | 16.0±0.4 | ||||||||||||||
20.0±0.8 | 22.0±0.88 | 25.0±1.0 | ||||||||||||||
The dielectric constant can be customized within the range of 3.0 to 25. | ||||||||||||||||
Dielectric Constant Tolerance | Dielectric Constant 3.0~11.0 | / | ±2% | |||||||||||||
Dielectric Constant 11.1~16.0 | / | ±2.5% | ||||||||||||||
Dielectric Constant 16.1~25.0 | / | ±4% | ||||||||||||||
Loss Tangent | Loss Tangent 3.0~9.5 | 10GHz | / | 0.0010 | ||||||||||||
Loss Tangent 9.6~11.0 | 10GHz | / | 0.0012 | |||||||||||||
Loss Tangent 11.1~16.0 | 5GHz | / | 0.0015 | |||||||||||||
Loss Tangent 16.1~25.0 | 5GHz | / | 0.0020~0.0025 | |||||||||||||
Dielectric Constant Temperature Coefficient | Dielectric Constant 3.0~9.5 | -55 º~150ºC | PPM/℃ | -50 | ||||||||||||
Dielectric Constant 9.6~16.0 | -55 º~150ºC | PPM/℃ | -40 | |||||||||||||
Dielectric Constant 16.1~25.0 | -55 º~150ºC | PPM/℃ | -55 | |||||||||||||
Peel Strength | 1 OZ Normal State | N/mm | >0.6 | |||||||||||||
1 OZ After AC Humidity Test | N/mm | >0.4 | ||||||||||||||
Volume Resistivity | Normal State at 500V | MΩ.cm | >1×109 | |||||||||||||
Surface Resistivity | Normal State at 500V | MΩ | >1×107 | |||||||||||||
Coefficient of Thermal Expansion (XY Z) |
Dielectric Constant 3.00~4.40 | -55 º~150ºC | PPM/℃ | 60,60,70 | ||||||||||||
Dielectric Constant 4.60~6.15 | -55 º~150ºC | PPM/℃ | 50,50,60 | |||||||||||||
Dielectric Constant 6.16~11.0 | -55 º~150ºC | PPM/℃ | 40,40,55 | |||||||||||||
Dielectric Constant 11.1~16.0 | -55 º~150ºC | PPM/℃ | 40,40,50 | |||||||||||||
Dielectric Constant 16.1~25.0 | -55 º~150ºC | PPM/℃ | 35,35,40 | |||||||||||||
Water Absorption | 20±2℃, 24 hours | % | ≤0.01 | |||||||||||||
Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -100º~150ºC | |||||||||||||
Material Composition | Polyphenylene oxide, ceramic, paired with ED copper foil. | |||||||||||||||
The density and thermal conductivity data for materials with different dielectric constants are as follows: | ||||||||||||||||
Product Features | Unit | Dielectric Constanct | ||||||||||||||
3.0 | 4.4 | 6.0 | 6.15 | 9.6 | 10.2 | 11.0 | 16.0 | 20.0 | 22.0 | 25.0 | ||||||
Density | g/cm3 | 1.69 | 1.89 | 2.1 | 2.12 | 2.26 | 2.33 | 2.40 | 2.76 | 2.73 | 2.77 | 2.94 | ||||
Thermal Conductivity | W/(M.K) | 0.40 | 0.44 | 0.55 | 0.55 | 0.65 | 0.67 | 0.70 | 0.80 | 0.85 | 0.90 | 1.0 |
3. Versatile Thickness Options: Available in various thicknesses, TP laminates can be customized to meet specific design requirements. The thinnest thickness available is 0.5mm, ensuring flexibility in achieving desired PCB dimensions.
4. Radiation Resistance and Low Outgassing: TP laminates exhibit resistance to radiation and low outgassing properties, making them suitable for applications in Beidou, missile-borne systems, fuzes, and miniaturized antennas.
5. Reliable Adhesion and Machinability: The adhesion between the copper foil and dielectric in TP laminates is superior to ceramic substrates with vacuum coating. TP material is easy to machine and can be processed through various methods such as drilling, turning, grinding, shearing, and etching, providing greater flexibility compared to ceramic substrates.
The stackup of this PCB features a 2-layer rigid configuration with a copper layer thickness of 35 μm on both sides. The TP1020 core serves as the dielectric layer, with a thickness of 0.8 mm, providing excellent electrical performance. The construction details of the PCB include a board size of 43.35 mm x 36.56 mm, ensuring a compact and efficient design. The minimum trace/space is set at 5/7 mils, allowing for precise routing. The minimum hole size is 0.3 mm, accommodating various components and connectors.
This PCB does not include blind vias, simplifying the manufacturing process. The finished board thickness is 0.9 mm, offering a balance between durability and space constraints. The finished copper weight is 1 oz (1.4 mils) on the outer layers, ensuring sufficient conductivity. Via plating thickness is 20 μm, providing reliable electrical connections. The surface finish is immersion gold, offering excellent solderability and a flat surface for component mounting.
For marking and identification, neither top nor bottom silkscreen is present in this configuration, ensuring a clean and minimalistic appearance. The top and bottom solder masks are not applied, allowing for direct access to copper pads. Each PCB has undergone a 100% electrical test prior to shipment, ensuring high-quality and reliable performance.
PCB Material: | Polyphenylene oxide, ceramic | ||
Designation (TP Series) | Designation | DK | DF |
TP300 | 3.0±0.06 | 0.0010 | |
TP440 | 4.4±0.09 | 0.0010 | |
TP600 | 6.0±0.12 | 0.0010 | |
TP615 | 6.15±0.12 | 0.0010 | |
TP920 | 9.2±0.18 | 0.0010 | |
TP960 | 9.6±0.2 | 0.0011 | |
TP1020 | 10.2±0.2 | 0.0011 | |
TP1100 | 11.0±0.22 | 0.0011 | |
TP1600 | 16.0±0.32 | 0.0015 | |
TP2000 | 20.0±0.4 | 0.0020 | |
TP2200 | 22.0±0.44 | 0.0022 | |
TP2500 | 25.0±0.5 | 0.0025 | |
Layer count: | Single Sided, Double Sided PCB | ||
Copper weight: | 1oz (35µm), 2oz (70µm) | ||
Dielectric thickness (Dielectric thickness or overall thickness) | 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 7.0mm, 8.0mm, 10.0mm, 12.0mm | ||
PCB size: | ≤150mm X 220mm | ||
Solder mask: | Green, Black, Blue, Yellow, Red etc. | ||
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. |
PCB statistics indicate that it comprises 6 components, with a total of 24 pads. Among these pads, 16 are through-hole pads, while 8 are top surface-mount technology (SMT) pads. This PCB features 5 vias for interconnection between different layers and components. The board has 2 nets, representing the interconnected pathways for signal transmission.
The artwork supplied for production is Gerber RS-274-X, a widely accepted format in the industry. This PCB conforms to IPC-Class-2 quality standard, ensuring high-quality manufacturing and assembly.
Our PCB is available for worldwide shipping, providing easy access to this high-performance solution. Some typical applications for this PCB include GPS antennas, missile-borne systems, fuzes, and miniaturized antennas. Experience the exceptional performance and reliability of Wangling TP in your designs.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848