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0.8mm TP1020 PCB 1oz Copper 2 Layer Immersion Gold RF Circuits

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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0.8mm TP1020 PCB 1oz Copper 2 Layer Immersion Gold RF Circuits

0.8mm TP1020 PCB 1oz Copper 2 Layer Immersion Gold RF Circuits
0.8mm TP1020 PCB 1oz Copper 2 Layer Immersion Gold RF Circuits

Large Image :  0.8mm TP1020 PCB 1oz Copper 2 Layer Immersion Gold RF Circuits

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: TP1020 PCB Size: 43.35mm X 36.56 Mm=1PCS, +/- 0.15mm
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: Immersion Gold
Layer Count: 2-layer PCB Thickness: 0.8mm
Highlight:

1oz Copper RF Circuits

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0.8mm RF Circuits

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2 layer circuit board 0.8mm

Introducing our newly shipped PCB featuring Wangling TP, a unique high-frequency thermoplastic material in the industry. TP-type laminates offer exceptional dielectric performance and high reliability, making them an ideal choice for a wide range of applications. With the ability to precisely adjust the dielectric constant by altering the ratio between ceramics and PPO resin, TP laminates provide excellent flexibility for circuit design.

 

Key Features:
1. Adjustable Dielectric Constant: The dielectric constant of TP laminates can be selected within the range of 3 to 25, allowing precise customization according to circuit requirements. Common dielectric constants include 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 10.2, 11, 16, and 20. The dielectric loss is low and remains relatively stable up to 10 GHz.

 

2. Wide Operating Temperature Range: TP laminates can withstand long-term operating temperatures ranging from -100°C to +150°C. They exhibit excellent low-temperature resistance. However, it's important to note that temperatures exceeding 180°C may cause deformation, copper foil peeling, and significant changes in electrical performance.
 

Product Technical Parameter Product Models & Data Sheet
Product Features Test Conditions Unit TP TP-1 TP-2
Dielectric Constant When the dielectric constant is ≤11, the test condition is 10GHz.

When the dielectric constant is >11, the test condition is 5GHz.
/ 3.0±0.06 4.4±0.09 6.0±0.12
6.15±0.12 9.2±0.18 9.6±0.19
10.2±0.2 11.0±0.022 16.0±0.4
20.0±0.8 22.0±0.88 25.0±1.0
The dielectric constant can be customized within the range of 3.0 to 25.
Dielectric Constant Tolerance Dielectric Constant 3.0~11.0 / ±2%
Dielectric Constant 11.1~16.0 / ±2.5%
Dielectric Constant 16.1~25.0 / ±4%
Loss Tangent Loss Tangent 3.0~9.5 10GHz / 0.0010
Loss Tangent 9.6~11.0 10GHz / 0.0012
Loss Tangent 11.1~16.0 5GHz / 0.0015
Loss Tangent 16.1~25.0 5GHz / 0.0020~0.0025
Dielectric Constant Temperature Coefficient Dielectric Constant 3.0~9.5 -55 º~150ºC PPM/℃ -50
Dielectric Constant 9.6~16.0 -55 º~150ºC PPM/℃ -40
Dielectric Constant 16.1~25.0 -55 º~150ºC PPM/℃ -55
Peel Strength 1 OZ Normal State N/mm >0.6
1 OZ After AC Humidity Test N/mm >0.4
Volume Resistivity Normal State at 500V MΩ.cm >1×109
Surface Resistivity Normal State at 500V >1×107
Coefficient of Thermal Expansion
(XY Z)
Dielectric Constant 3.00~4.40 -55 º~150ºC PPM/℃ 60,60,70
Dielectric Constant 4.60~6.15 -55 º~150ºC PPM/℃ 50,50,60
Dielectric Constant 6.16~11.0 -55 º~150ºC PPM/℃ 40,40,55
Dielectric Constant 11.1~16.0 -55 º~150ºC PPM/℃ 40,40,50
Dielectric Constant 16.1~25.0 -55 º~150ºC PPM/℃ 35,35,40
Water Absorption 20±2℃, 24 hours % ≤0.01
Long-Term Operating Temperature High-Low Temperature Chamber -100º~150ºC
Material Composition Polyphenylene oxide, ceramic, paired with ED copper foil.
The density and thermal conductivity data for materials with different dielectric constants are as follows:
Product Features Unit Dielectric Constanct
3.0 4.4 6.0 6.15 9.6 10.2 11.0 16.0 20.0 22.0 25.0
Density g/cm3 1.69 1.89 2.1 2.12 2.26 2.33 2.40 2.76 2.73 2.77 2.94
Thermal Conductivity W/(M.K) 0.40 0.44 0.55 0.55 0.65 0.67 0.70 0.80 0.85 0.90 1.0

 

3. Versatile Thickness Options: Available in various thicknesses, TP laminates can be customized to meet specific design requirements. The thinnest thickness available is 0.5mm, ensuring flexibility in achieving desired PCB dimensions.
 

4. Radiation Resistance and Low Outgassing: TP laminates exhibit resistance to radiation and low outgassing properties, making them suitable for applications in Beidou, missile-borne systems, fuzes, and miniaturized antennas.
 

5. Reliable Adhesion and Machinability: The adhesion between the copper foil and dielectric in TP laminates is superior to ceramic substrates with vacuum coating. TP material is easy to machine and can be processed through various methods such as drilling, turning, grinding, shearing, and etching, providing greater flexibility compared to ceramic substrates.

 

The stackup of this PCB features a 2-layer rigid configuration with a copper layer thickness of 35 μm on both sides. The TP1020 core serves as the dielectric layer, with a thickness of 0.8 mm, providing excellent electrical performance. The construction details of the PCB include a board size of 43.35 mm x 36.56 mm, ensuring a compact and efficient design. The minimum trace/space is set at 5/7 mils, allowing for precise routing. The minimum hole size is 0.3 mm, accommodating various components and connectors.

 

0.8mm TP1020 PCB 1oz Copper 2 Layer Immersion Gold RF Circuits 0

 

This PCB does not include blind vias, simplifying the manufacturing process. The finished board thickness is 0.9 mm, offering a balance between durability and space constraints. The finished copper weight is 1 oz (1.4 mils) on the outer layers, ensuring sufficient conductivity. Via plating thickness is 20 μm, providing reliable electrical connections. The surface finish is immersion gold, offering excellent solderability and a flat surface for component mounting.

 

For marking and identification, neither top nor bottom silkscreen is present in this configuration, ensuring a clean and minimalistic appearance. The top and bottom solder masks are not applied, allowing for direct access to copper pads. Each PCB has undergone a 100% electrical test prior to shipment, ensuring high-quality and reliable performance.

 

PCB Material: Polyphenylene oxide, ceramic
Designation (TP Series) Designation DK DF
TP300 3.0±0.06 0.0010
TP440 4.4±0.09 0.0010
TP600 6.0±0.12 0.0010
TP615 6.15±0.12 0.0010
TP920 9.2±0.18 0.0010
TP960 9.6±0.2 0.0011
TP1020 10.2±0.2 0.0011
TP1100 11.0±0.22 0.0011
TP1600 16.0±0.32 0.0015
TP2000 20.0±0.4 0.0020
TP2200 22.0±0.44 0.0022
TP2500 25.0±0.5 0.0025
Layer count: Single Sided, Double Sided PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness (Dielectric thickness or overall thickness) 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 7.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size: ≤150mm X 220mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

 

PCB statistics indicate that it comprises 6 components, with a total of 24 pads. Among these pads, 16 are through-hole pads, while 8 are top surface-mount technology (SMT) pads. This PCB features 5 vias for interconnection between different layers and components. The board has 2 nets, representing the interconnected pathways for signal transmission.

 

The artwork supplied for production is Gerber RS-274-X, a widely accepted format in the industry. This PCB conforms to IPC-Class-2 quality standard, ensuring high-quality manufacturing and assembly.

 

Our PCB is available for worldwide shipping, providing easy access to this high-performance solution. Some typical applications for this PCB include GPS antennas, missile-borne systems, fuzes, and miniaturized antennas. Experience the exceptional performance and reliability of Wangling TP in your designs.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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