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RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

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Customer Reviews
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

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RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick
RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

Large Image :  RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-332.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
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RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

Description
Base Material: F4BTMS450 Layer Count: 4 Layers
PCB Thickness: 1.4mm PCB Size: 20mm X 20mm Per Unit (tolerance: ±0.15mm)
Silkscreen: No Solder Mask: No
Copper Weight: 1oz (1.4 Mils / 35μm) Surface Finish: Immersion Gold
Highlight:

RF PCB board 4-layer design

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Microwave PCB 1.4mm thickness

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F4BTMS450 RF PCB board

RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick
This 4-layer rigid PCB uses aerospace-grade F4BTM450 material to deliver superior electrical, thermal, and mechanical performance for high-frequency, mission-critical systems. Meeting IPC-Class-2 standards, it provides a high-reliability solution for aerospace, microwave, and military applications and serves as a competitive alternative to premium imported options.
PCB Specification
Parameter Specification
Base Material F4BTMS450 (advanced PTFE-nano-ceramic composite)
Layer Configuration 4-layer rigid PCB
Board Dimensions 20mm x 20mm per unit (tolerance: ±0.15mm)
Finished Board Thickness 1.4mm
Copper Weight (Finished) 1oz (1.4 mils / 35μm)
Via Plating Thickness 20μm
Minimum Trace/Space 4 mils / 5 mils
Minimum Hole Size 0.3mm
Vias 4 total (no blind vias)
Surface Finish Immersion Gold
Silkscreen Top: No; Bottom: No
Solder Mask Top: No; Bottom: No
Quality Assurance 100% Electrical test prior to shipment
Precise PCB Stack-up
  • Copper Layer 1: 35μm (1oz)
  • F4BTMS450 Core: 0.127mm (5mil)
  • Copper Layer 2: 35μm (1oz)
  • Prepreg RO4450F: 0.102mm (4mil)
  • F4BTMS450 Core: 0.127mm (5mil)
  • Copper Layer 3: 35μm (1oz)
  • Prepreg RO4450F: 0.102mm (4mil)
  • F4BTMS450 Core: 0.762mm (30mil)
  • Copper Layer 4: 35μm (1oz)
RF/Microwave F4BTMS450 PCB close-up view
F4BTMS450 Material Advantages
F4BTMS450 is an upgraded iteration of the F4BTM series, featuring a breakthrough formulation of polytetrafluoroethylene (PTFE) resin, ultra-thin/ultra-fine glass fiber cloth, and uniformly distributed special nano-ceramics. Key benefits include:
  • Minimized electromagnetic wave propagation interference from glass fibers, reducing dielectric loss.
  • Enhanced dimensional stability and reduced X/Y/Z anisotropy, ensuring consistency across extreme conditions.
  • Extended usable frequency range, improved electrical strength, and superior thermal conductivity.
  • Low thermal expansion coefficient and stable dielectric temperature characteristics.
  • Standard RTF (Reverse Treat Foil) low-roughness copper foil, reducing conductor loss and delivering excellent peel strength (compatible with copper or aluminum bases).
F4BTMS450 Key Electrical & Mechanical Properties
Property Specification
Dielectric Constant (Dk) 4.5 ±0.09 (10GHz)
Dissipation Factor (Df) 0.0015 (10GHz); 0.0019 (20GHz)
Coefficient of Thermal Expansion (CTE) X-axis: 12 ppm/°C; Y-axis: 12 ppm/°C; Z-axis: 45 ppm/°C (-55°C to 288°C)
Thermal Coefficient of Dk -58 ppm/°C (-55°C to 150°C)
Flame Rating UL-94 V0
Thermal Conductivity 0.64 W/MK
Moisture Absorption 0.08% (max)
Typical Applications
This PCB is ideal for demanding environments and high-performance systems, including:
  • Aerospace equipment, space vehicles, and cabin systems
  • Microwave and RF (Radio Frequency) devices
  • Military radar and general radar systems
  • Feed networks for high-frequency applications
  • Phase-sensitive antennas and phased array antennas
  • Satellite communications systems
  • Other mission-critical electronics requiring stable performance under extreme temperatures and conditions.
RF/Microwave F4BTMS450 PCB in application

Tag:

High Frequency CuClad233 PCB,

RF PCB substrate material,

Copper clad laminate with warranty

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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