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F4BTMS1000 PCB Double-Sided 1.905mm Thick Immersion Gold Finish

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Ms. Ivy Deng

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86-755-27374847

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F4BTMS1000 PCB Double-Sided 1.905mm Thick Immersion Gold Finish

MOQ:	1PCS
Price:	USD9.99-99.99/PCS
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Details Information

Product Description

Detail Information

Place of Origin

China

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

PCB Material:

F4BTMS1000 Core - 1.905 Mm (75mil)

Layer Count:

2-layer

PCB Thickness:

2.0mm

PCB Size:

349mm X 361 Mm=1PCS, +/- 0.15mm

Copper Weight:

1oz (1.4 Mils) Outer Layers

Surface Finish:

Immersion Gold

Highlight:

PCB 1.905mm Thick

Immersion Gold PCB

Double Sided PCB

Product Description

The F4BTMS1000 2-layer PCB stands out as a cutting-edge solution specifically engineered for applications in aerospace, microwave, and RF technologies.

PCB Construction and Specifications

Material Composition

This PCB is constructed from high-quality F4BTMS1000 material, an advanced formulation that combines polytetrafluoroethylene resin with a significant amount of ceramics and ultra-thin glass fiber. This innovative material composition significantly enhances the PCB's dielectric properties, thermal stability, and overall performance.

Technical Specifications

- Layer Count: 2 layers
- Board Dimensions: 349mm x 361mm (±0.15mm)
- Minimum Trace/Space: 8/7 mils
- Minimum Hole Size: 0.3mm
- Finished Board Thickness: 2.0mm
- Finished Copper Weight: 1oz (1.4 mils) on outer layers
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion gold
- Electrical Testing: 100% electrical test before shipment

F4BTMS1000 PCB Double-Sided 1.905mm Thick Immersion Gold Finish 0

PCB Stackup

The stackup of this PCB consists of:

- Copper Layer 1: 35 μm
- F4BTMS1000 Core: 1.905 mm (75 mils)
- Copper Layer 2: 35 μm

This structure allows for optimal conductivity and thermal management, making it suitable for high-frequency applications.

Performance Advantages

Enhanced Dielectric Properties

The F4BTMS1000 boasts a dielectric constant (Dk) of 10.2 at 10GHz, with a low dissipation factor of 0.0020 at 10GHz. This performance ensures minimal signal loss, making the PCB ideal for microwave and RF applications where maintaining signal integrity is paramount.

Thermal Stability and Conductivity

With a thermal conductivity of 0.81 W/mk and a low thermal expansion coefficient, the F4BTMS1000 effectively manages heat dissipation. This is critical in environments where temperature fluctuations occur, ensuring consistent performance and reliability.

Moisture Resistance

The low moisture absorption rate of 0.03% enhances the PCB's durability, making it suitable for use in harsh environments where humidity and moisture can compromise performance.

Rigorous Quality Standards

Manufactured to IPC-Class-2 standards, the F4BTMS1000 PCB guarantees high reliability and quality. Each board undergoes a thorough 100% electrical test before shipment, ensuring that every unit meets stringent performance specifications.

PCB Material:	PTFE,Ultra-thin and ultra-fine fiberglass, ceramics.
Designation (F4BTMS )	F4BTMS	DK (10GHz)	DF (10 GHz)
	F4BTMS220	2.2±0.02	0.0009
	F4BTMS233	2.33±0.03	0.0010
	F4BTMS255	2.55±0.04	0.0012
	F4BTMS265	2.65±0.04	0.0012
	F4BTMS294	2.94±0.04	0.0012
	F4BTMS300	3.0±0.04	0.0013
	F4BTMS350	3.5±0.05	0.0016
	F4BTMS430	4.3±0.09	0.0015
	F4BTMS450	4.5±0.09	0.0015
	F4BTMS615	6.15±0.12	0.0020
	F4BTMS1000	10.2±0.2	0.0020
Layer count:	Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness	0.09mm (3.5mil), 0.127mm (5mil), 0.254mm(10mil),0.508mm(20mil), 0.635mm(25mil), 0.762mm(30mil), 0.787mm(31mil), 1.016mm(40mil), 1.27mm(50mil), 1.5mm(59mil), 1.524mm(60mil), 1.575mm(62mil), 2.03mm(80mil), 2.54mm(100mil), 3.175mm(125mil), 4.6mm(160mil), 5.08mm(200mil), 6.35mm(250mil)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

Applications

The F4BTMS1000 PCB is versatile and can be used in a variety of advanced applications, including:

- Aerospace Equipment: Ideal for systems requiring high reliability and performance in extreme conditions.

- Microwave and RF Technologies: Perfect for applications where signal integrity is crucial.

- Military Radar Systems: Designed to meet the demanding specifications of defense applications.

- Phased Array Antennas: Suitable for advanced communications and radar systems.

Conclusion

The F4BTMS1000 PCB represents a significant advancement in PCB technology, combining superior materials and construction with rigorous quality standards. Its excellent electrical and thermal properties make it an attractive option for professionals in aerospace, military, and high-frequency industries. Whether you're designing cutting-edge communication systems or aerospace equipment, the F4BTMS1000 is engineered to meet your most demanding requirements.

F4BTMS1000 PCB Double-Sided 1.905mm Thick Immersion Gold Finish 1

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