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High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold

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China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold

High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold

Large Image :  High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-480.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: FR-4 Layer Count: 14 Layers
PCB Thickness: 2 Mm ±0.16 PCB Size: 220mm X 170mm=4PCS
Solder Mask: Green Silkscreen: White
Copper Weight: Inner 0.5oz, Outer 1oz Surface Finish: Immersion Gold
High Light:

Multilayer FR4 PCB Board

,

1oz FR4 PCB Board

,

1oz Immersion Gold PCB

 

High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170 With Immersion Gold

 

1.1 General description

This is a type of 14-layer HDI printed circuit board built on FR-4 Tg170 substrate for the application of codec equipment. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. The PCBs contains 2+N+2 high density interconnection layers, microvias on different layers are stacked. The base material is from ITEQ supplying in 1 up board per panel.They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 panels are packed for shipment.

 

1.2 Our Advantages

ISO9001, ISO14001, IATF16949, UL Certified;

Prototype to volume Production Capability;

16000㎡ workshop;

30000㎡ output capability per month;

8000 types of PCB's per month;

IPC Class 2 / IPC Class 3;

Eligible products rate of first production: >95%

 

1.3 Applications of HDI PCBs

Oscilloscope
Wireless Booster
Access Point WiFi
4G WiFi
GSM Router
Card Access Systems
Instrumentation

 

High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold 0

 

1.4 Parameter and data sheet

Number of Layers 14-Layer
Board Type Multilayer PCB
Board size 220mm x 170mm=4PCS
Board Thickness 2.0 mm +/-0.16
Board Material FR-4
Board Material Supplier ITEQ
Tg Value of Board Material 170℃
 
PTH Cu thickness ≥20 um
Inner Iayer Cu thicknes 18 um (0.5oz)
Surface Cu thickness 35 um (1oz)
 
Solder Mask Type and Model No. LPSM, PSR-2000GT600D
Solder Mask Supplier TAIYO
Solder Mask Colour Green
Number of Solder Masks 2
Thickness of Solder Mask 14 um
 
Type of Silkscreen Ink IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 1
 
Mininum Trace (mil) 5.8 mil
Minimum Gap(mil) 6.2 mil
 
Surface Finish Immersion Gold
RoHS Required Yes
Warpage 0.25%
Thermal Shock Test Pass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Solderablity Test Pass, 255±5℃,5 seconds Wetting Area Least 95%
Function 100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6012C Class 2
Drill Table (mm)  
T1 0.300
T2 0.450
T3 0.580
T4 0.590
T5 0.690
T6 0.650
T7 1.000
T8 1.150
T9 1.200
T10 1.300
T11 1.400
T12 1.500
T13 1.600
T14 1.700
T15 2.050
T16 2.550
T17 3.000
T18 3.200
T19 3.450

 

High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold 1

 

1.5 Different Types of HDI PCBs

To simplify the high density interconnect PCB, we define 3 types of HDI PCBs as below:

1+N+1, PCBs contain 1-time laser drill and pressing in the HDI boards.

I+N+I (I≥2), PCBs contain 2-time laser drill and pressing or more times laser drill and pressing, including the microvias staggered or stacked on different layers.

Any layer HDI, blind vias and buried vias can be freely put on different layers as designer want.

 

High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold 2

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

Send your inquiry directly to us (0 / 3000)