This custom 6-layer rigid multilayer PCB is fabricated with premium ISOLA 370HR high-Tg FR-4 dielectric substrate. Finished with 2μ" ENIG plating and double-side green solder mask with white legend, it adopts 1oz copper on each conductive layer with a 1.6mm finished board thickness. Configured with 50Ω controlled impedance on the top layer with 11mil trace width, the PCB meets IPC-Class-3 requirements with 25μm hole copper thickness, featuring excellent thermal stability, CAF resistance and universal FR-4 process compatibility for high-reliability industrial electronic applications.
PCB Specifications
| Parameter Item |
Specification |
| Layer Configuration |
6-layer rigid PCB |
| Base Material |
ISOLA 370HR high-performance high-Tg FR-4 |
| Board Dimension |
111mm × 78mm (1 piece) |
| Finished Board Thickness |
1.6mm |
| Copper Weight |
1oz copper for each layer |
| Surface Finishing |
ENIG, 2μ" gold thickness |
| Solder Mask & Silkscreen |
Green solder mask with white legend on both sides |
| Quality Standard |
IPC-Class-3 |
| Via Plating Thickness |
25μm hole copper |
| Impedance Requirement |
Top layer: 11mil trace width, 50Ω controlled impedance |
ISOLA 370HR Material Introduction
ISOLA 370HR is a high-performance 180°C Tg FR-4 material system developed for multilayer printed wiring boards demanding superior thermal performance and long-term application reliability. Manufactured with proprietary multifunctional epoxy resin reinforced with E-grade glass fabric, it provides enhanced thermal endurance and reduced thermal expansion versus conventional FR-4, while retaining standard FR-4 process compatibility.
Its mechanical robustness, chemical durability and moisture resistance meet or exceed standard FR-4 performance benchmarks. Equipped with laser fluorescence and UV-blocking properties, 370HR achieves full compatibility with AOI inspection, optical positioning and photoimageable solder mask processes. It is also well qualified for complex sequential lamination multilayer projects.
Core Material Features
Superior Thermal Performance: 180°C Tg (DSC), 340°C Td (TGA @ 5% weight loss), low CTE for structural reliability; 60min T260 endurance, 30min T288 endurance
Environmental Compliance: Fully RoHS compliant
UV Blocking & AOI Compatibility: Improves fabrication and assembly efficiency with high inspection precision
Outstanding CAF Resistance: Restrains conductive anodic filament growth to extend service lifespan
Easy Fabrication: Matches standard FR-4 fabrication workflow for mass production
Diversified Material Options: Various core thicknesses, prepreg forms, glass fabrics and copper foils available; customized copper thickness is acceptable
Full Industry Qualification: Compliant with IPC-4101D specifications, UL certified (File No. E41625), UL MCIL program approved
Typical Applications
- High-reliability multilayer PCBs and sequential lamination circuit boards
- Automotive control units and vehicle-borne power electronic modules
- Telecom base stations and wired network communication devices
- Industrial controllers, precision instruments and testing equipment
- High-temperature consumer electronics and computer peripheral devices
- Civil aerospace electronic modules requiring thermal stability and CAF immunity
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