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PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold

PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold
PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold

Large Image :  PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-462.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: FR-4 Layer Count: 10 Layers
PCB Thickness: 2.0mm ±10% PCB Size: 168.38 X 273.34mm=1up
Solder Mask: Green Silkscreen: White
Copper Weight: 1oz Surface Finish: Immersion Gold
High Light:

8 Layers High TG PCB

,

1oz High TG PCB

,

1oz Immersion Gold PCB

 

PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold

(Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)

 

1.1 General description

This is a type of 10-layer printed circuit board built on FR-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on the top of the circuit board, high pin-count on a 0.5mm pitch. The base material is from Shengyi and supplying 1 up board. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 boards are packed for shipment.

 

1.2 Features and benefits

1. High Tg industrial standard material shows excellent thermal reliability;

2. Immersion gold ensure excellent wetting during component soldering and avoid copper corrosion;

3. In house, engineering design prevents problems from occurring in pre-production;

4. ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;

5. Customer complaint rate: <1%

6. Delivery on time: >98%

7. Prototype PCB capability to Volume Production capability;

8. Multilayer and Any Layer HDI PCBs;

9. More than 18+ years of PCB experience.

 

PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold 0

 

1.3 Applications

USB Wireless Adapter

Wireless Router Reviews

Battery Inverter

Wireless G Router

Backplanes

 

1.4 PCB Specifications

Item Description Value
Layer count 10 Layers PCB 10 Layers Board
Board type Multilayer PCB Multilayer PCB Board
Board size 168.38 x 273.34mm=1up 168.38 x 273.34mm=1up
Laminate Laminate Type FR4
Supplier SHENGYI
Tg TG ≧170
Finished thickness 2.0+/-10% MM
Plating Thickness PTH Cu thickness >20 um
Inner layer Cu Thickness 1/1 OZ
Surface Cu thickness 35 um
Solder Mask Material type LP-4G G-05
Supplier Nan Ya
Color Green
Single / both sides Both Sides
S/M thickness >=10.0 um
3M tape test NO Peel Off
Legend Material type S-380W
Supplier Tai yo
Color White
Location Both Sides
3M tape test No peel off
Circuit Trace Width (mm) 0.203+/-20%mm
Spacing (mm) 0.203+/- 20%mm
Identification UL mark 94V-0
Company Logo QM2
Date code 1017
Mark location CS
Immersion Gold Nickel 100u''
Gold ≧2u''
Reliabilty Tests Thermal shock test 288±5℃, 10sec ,3 cycles
solder abllity test 245±5℃
Function Electrioal Test 233+/-5℃
Standard IPC-A 600H class 2, IPC_6012C CLASS 2 100%
Appearance Visual inspection 100%
warp and twist <= 0.75%

 

1.5 BGA and via plug

The full name of the BGA is Ball Grid Array, which is a type of surface mount package used for integrated circuit (IC). It has the characteristics of: ① packaging area reduced ② function increased and the number of pins increased ③ solder can be self-centered when dissolved soldering, easy to put on tin ④ reliability is high ⑤ electric performance is good and low cost etc. PCB board with BGA generally have more small holes. Mostly, via holes under BGA are designed to be 8~12mil in diameter by customers. Vias under BGA have to be plugged by resin, soldering ink is not allowed to be onto pads and no drilling on BGA pads. The plugged vias are 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm and 0.55mm.

 

PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold 1

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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