PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold
(Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)
1.1 General description
This is a type of 10-layer printed circuit board built on FR-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on the top of the circuit board, high pin-count on a 0.5mm pitch. The base material is from Shengyi and supplying 1 up board. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 boards are packed for shipment.
1.2 Features and benefits
1. High Tg industrial standard material shows excellent thermal reliability;
2. Immersion gold ensure excellent wetting during component soldering and avoid copper corrosion;
3. In house, engineering design prevents problems from occurring in pre-production;
4. ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;
5. Customer complaint rate: <1%
6. Delivery on time: >98%
7. Prototype PCB capability to Volume Production capability;
8. Multilayer and Any Layer HDI PCBs;
9. More than 18+ years of PCB experience.
1.3 Applications
USB Wireless Adapter
Wireless Router Reviews
Battery Inverter
Wireless G Router
Backplanes
1.4 PCB Specifications
| Item |
Description |
Value |
| Layer count |
10 Layers PCB |
10 Layers Board |
| Board type |
Multilayer PCB |
Multilayer PCB Board |
| Board size |
168.38 x 273.34mm=1up |
168.38 x 273.34mm=1up |
| Laminate |
Laminate Type |
FR4 |
| Supplier |
SHENGYI |
| Tg |
TG ≧170 |
| Finished thickness |
2.0+/-10% MM |
| Plating Thickness |
PTH Cu thickness |
>20 um |
| Inner layer Cu Thickness |
1/1 OZ |
| Surface Cu thickness |
35 um |
| Solder Mask |
Material type |
LP-4G G-05 |
| Supplier |
Nan Ya |
| Color |
Green |
| Single / both sides |
Both Sides |
| S/M thickness |
>=10.0 um |
| 3M tape test |
NO Peel Off |
| Legend |
Material type |
S-380W |
| Supplier |
Tai yo |
| Color |
White |
| Location |
Both Sides |
| 3M tape test |
No peel off |
| Circuit |
Trace Width (mm) |
0.203+/-20%mm |
| Spacing (mm) |
0.203+/- 20%mm |
| Identification |
UL mark |
94V-0 |
| Company Logo |
QM2 |
| Date code |
1017 |
| Mark location |
CS |
| Immersion Gold |
Nickel |
100u'' |
| Gold |
≧2u'' |
| Reliabilty Tests |
Thermal shock test |
288±5℃, 10sec ,3 cycles |
| solder abllity test |
245±5℃ |
| Function |
Electrioal Test |
233+/-5℃ |
| Standard |
IPC-A 600H class 2, IPC_6012C CLASS 2 |
100% |
| Appearance |
Visual inspection |
100% |
| warp and twist |
<= 0.75% |
1.5 BGA and via plug
The full name of the BGA is Ball Grid Array, which is a type of surface mount package used for integrated circuit (IC). It has the characteristics of: ① packaging area reduced ② function increased and the number of pins increased ③ solder can be self-centered when dissolved soldering, easy to put on tin ④ reliability is high ⑤ electric performance is good and low cost etc. PCB board with BGA generally have more small holes. Mostly, via holes under BGA are designed to be 8~12mil in diameter by customers. Vias under BGA have to be plugged by resin, soldering ink is not allowed to be onto pads and no drilling on BGA pads. The plugged vias are 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm and 0.55mm.
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