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Rogers RO4360 RF PCB 12mil Double Sided High Frequency PCB with Immersion Gold for Base Station Power Amplifiers

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Rogers RO4360 RF PCB 12mil Double Sided High Frequency PCB with Immersion Gold for Base Station Power Amplifiers

Rogers RO4360 RF PCB 12mil Double Sided High Frequency PCB with Immersion Gold for Base Station Power Amplifiers
Rogers RO4360 RF PCB 12mil Double Sided High Frequency PCB with Immersion Gold for Base Station Power Amplifiers Rogers RO4360 RF PCB 12mil Double Sided High Frequency PCB with Immersion Gold for Base Station Power Amplifiers

Large Image :  Rogers RO4360 RF PCB 12mil Double Sided High Frequency PCB with Immersion Gold for Base Station Power Amplifiers

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-114.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: Hydrocarbon Ceramic-filled Thermoset Materials Layer Count: Double Layer, Multilayer, Hybrid PCB
PCB Thickness: 8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm) PCB Size: ≤400mm X 500mm
Solder Mask: Green, Black, Blue, Yellow, Red Etc. Copper Weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish: Bare Copper, HASL, ENIG, OSP Etc..
High Light:

Rogers RO4360G2 Power Amplifier Circuit Board

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12mil Power Amplifier Circuit Board

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12mil High Frequency PCB

 

Rogers RO4360 RF PCB 12mil Double Sided High Frequency PCB with Immersion Gold for Base Station Power Amplifiers

 

RO4360G2 laminates of Rogers Corporation are 6.15 Dk, low loss, glass-reinforced, hydrocarbon ceramic-filled thermoset materials that provide the ideal balance of performance and processing ease. RO4360G2 laminates extend Rogers' portfolio of high performance materials by providing customers with a product that is lead-free process capable and offers better rigidity for improved processability in multi-layer board constructions, while reducing material and fabrication costs.

 

RO4360G2 laminates process similar to FR-4 and are automated assembly compatible. They have a low Z-axis CTE for design flexibility and have the same high Tg as all of the RO4000 product line. RO4360G2 laminates can be paired with RO4450F prepreg and lower-Dk RO4000 laminate in multi-layer designs.

 

RO4360G2 laminates, with a Dk of 6.15 (Design Dk 6.4), allow designers to reduce circuit dimensions in applications where size and cost are critical. They are the best value choice for engineers working on designs including power amplifiers, patch antennas, ground-based radar, and other general RF applications.

 

Features and benefits:

1. Thermoset resin system specially formulated to meet 6.15 Dk

1). Ease of fabrication / processes similar to FR-4

2). Material repeatability

3). Low loss

4). High thermal conductivity

5). Lower total PCB cost solution than competing PTFE products,

 

2. Low Z-axis CTE / High Tg

1). Design flexibility

2). Plated through-hole reliability

3). Automated assembly compatible

 

3. Environmentally friendly

1) Lead free process compatible

 

4. Regional finished goods inventory

1). Short lead times / quick inventory turns

2). Efficient supply chain

 

Some Typical Applications:

1. Base Station Power Amplifiers

2. Small Cell Transceivers

3. Patch antennas

4. Ground-based Radar

 

Rogers RO4360 RF PCB 12mil Double Sided High Frequency PCB with Immersion Gold for Base Station Power Amplifiers 0

 

PCB Capability

PCB Material: Hydrocarbon Ceramic-filled Thermoset Materials
Designation: RO4360G2
Dielectric constant: 6.15 ±0.15
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

 

Data Sheet of RO4360G2

RO4360G2 Typical Value
Property RO4360G2 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.15 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
2.5 GHz/23℃
Dissipation Factor,tanδ 0.0038 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Conductivity 0.75   W/mK 50℃ ASTM D-5470
Volume Resistivity 4.0 X 1013   Ω.cm Elevated T IPC-TM-650 2.5.17.1
Surface Resistivity 9.0 X 1012   Ω Elevated T IPC-TM-650 2.5.17.1
Electrical Strength 784 Z V/mil   IPC-TM-650 2.5.6.2
Tensile Strength 131 (19) 97(14) X Y MPa (kpsi) 40 hrs 50%RH/23 ASTM D638
Flexural Strength 213(31) 145(21) X Y Mpa (kpsi) 40 hrs 50%RH/23 IPC-TM-650, 2.4.4
Coefficient of Thermal Expansion 13 14 28 X Y Z ppm/℃ -50 ℃to 288℃ After Replicated Heat Cycle IPC-TM-650, 2.1.41
Tg >280   ℃ TMA   IPC-TM-650 2.4.24.3
Td 407     ASTM D3850 using TGA
T288 >30 Z min 30 min / 125℃ Prebake IPC-TM-650 2.2.24.1
Moisure Absorption 0.08   % 50℃/48hr IPC-TM-650 2.6.2.1 ASTM D570
Thermal Coefficient of er -131 @10 GHz Z ppm/℃ -50℃ to 150 ℃ IPC-TM-650, 2.5.5.5
Density 2.16   gm/cm3 RT ASTM D792
Copper Peel Stength 5.2 (0.91)   pli (N/mm) Condtion B IPC-TM-650 2.4.8
Flammability V-0       UL 94 File QMTS2. E102765

 

Rogers RO4360 RF PCB 12mil Double Sided High Frequency PCB with Immersion Gold for Base Station Power Amplifiers 1

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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