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RO4350B 4 Layer IPC 6012 Class 2 High TG PCB For 4G Signal Booster

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China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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RO4350B 4 Layer IPC 6012 Class 2 High TG PCB For 4G Signal Booster

RO4350B 4 Layer IPC 6012 Class 2 High TG PCB For 4G Signal Booster
RO4350B 4 Layer IPC 6012 Class 2 High TG PCB For 4G Signal Booster RO4350B 4 Layer IPC 6012 Class 2 High TG PCB For 4G Signal Booster RO4350B 4 Layer IPC 6012 Class 2 High TG PCB For 4G Signal Booster RO4350B 4 Layer IPC 6012 Class 2 High TG PCB For 4G Signal Booster

Large Image :  RO4350B 4 Layer IPC 6012 Class 2 High TG PCB For 4G Signal Booster

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-077.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: RO4350B 0.102mm + Tg 170℃ FR4 0.30mm PCB Thickness: 1.0mm
PCB Size: 55mm X 132mm = 1 Type = 1 Piece Solder Mask: Green
Silkscreen: White Copper Weight: Outer Layer 35 Um/ Inner Layer 18 Um
Layer Count: 4 Layers Surface Finish: Immersion Gold
High Light:

4 Layer High TG PCB

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IPC 6012 Class 2 High TG PCB

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High TG 4 Layer PCB Board

 

4 Layer Hybrid PCB Board Build On 4mil Rogers RO4350B and High Tg FR-4 for 4G Signal Booster

(PCB’s are custom-made products, the picture and parameters shown are just for reference)
 

Hi Everyone,

Today, we're going to talk about a type of 4-layer high frequency PCB made on 4mil RO4350B pressed with FR-4.

 

The board is designed as a 4-layer structure, because 4-layer is relatively simple and cost controllable, this is helpful to open up a new market.

 

Let's take a look at first build-up,
RO4350B 4 Layer IPC 6012 Class 2 High TG PCB For 4G Signal Booster 0

 

The first layer to the second layer and the third layer to the fourth layer are the Rogers core 4mil (0.102mm) RO4350B, the core has fixed thickness which is very important to the electrical length of RF lines on the circuit board, and the dielectric material in the middle is FR-4 epoxy glass, which bonds both cores on top and bottom side. Inner layer is 0.5 ounces and the outer layer is 1 ounce.

 

The detailed specifications of this board are as follows:

Base material: RO4350B 0.102mm + Tg 170℃ FR4 0.30mm

Layer count: 4 layers

Panel: 55mm x 132mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 um/ Inner layer 18 um

Solder mask / Legend: green / white

Final PCB height: 1.0 mm

Special technology: via in pad (hole filled) under BGA

Standard: IPC 6012 Class 2

Packing: 25 panels are packed for shipment.

Lead time: 12 working days

Shelf life: 6 months
 
RO4350B 4 Layer IPC 6012 Class 2 High TG PCB For 4G Signal Booster 1

 

The applications of RO4350B hybrid PCB are wide, such as preamplifier, radar sensors, digital transmitter and splitter module; GPS antenna, communications relays, analogue transmitter and 4G antennas; RF transmitter, WiFi amplifier, RFID and attenuator etc.

 

The advantages of RO4350B hybrid PCBs:

1) RO4350B exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications;

2) Signal integrity performance improved over the stack-ups with all FR4 board;

3) Cost reduced over stack-ups with all low loss material;

4) Reduce signal loss at high frequencies as well;

5) Benefit from our strong capabilities: meeting your PCB demands from prototype mass production and IATF 16949 (2016), ISO14001 (2015), ISO9001 (2015) and UL certified factory guarantee your quality.

 

That’s all of today. Thank you for your reading. You’re welcome to contact us for your RF PCB enquiries.
 

Appendix: Our PCB Capability 2021

Parameter Value
 Layer Counts  1-32
 Substrate Material FR-4(including High Tg 170, High CTI>600V); Aluminum based; Copper based; Rogers RO4350B, RO4003C, RO3003, RO3006, RO3010, RO3210 etc.; Rogers RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010 etc..; Taconic TLX-8, TLY-5, RF-35TC, TLF-35 etc..; Arlon AD450, AD600 etc; PTFE F4B DK2.2, DK2.65 etc..; Polyimide and PET.
 Maximum Size  Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
 Board Outline Tolerance  ±0.0059" (0.15mm)
 PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)  ±8%
Thickness Tolerance(t<0.8mm)  ±10%
 Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
 Minimum Track 0.003" (0.075mm)
 Minimum Space  0.003" (0.075mm)
 Outer Copper Thickness  35µm--420µm (1oz-12oz)
 Inner Copper Thickness  17µm--350µm (0.5oz - 10oz)
 Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
 Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
 Registration (Mechanical) 0.00197" (0.05mm)
 Aspect Ratio  12:1
 Solder Mask Type  LPI
 Min Soldermask Bridge 0.00315" (0.08mm)
 Min Soldermask Clearance 0.00197" (0.05mm)
 Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance  ±10%
 Surface Finish HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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