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RO4350B 4 Layer IPC 6012 Class 2 High TG PCB For 4G Signal Booster

RO4350B 4 Layer IPC 6012 Class 2 High TG PCB For 4G Signal Booster

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-077.V1.0
Base Material:
RO4350B 0.102mm + Tg 170℃ FR4 0.30mm
PCB Thickness:
1.0mm
PCB Size:
55mm X 132mm = 1 Type = 1 Piece
Solder Mask:
Green
Silkscreen:
White
Copper Weight:
Outer Layer 35 Um/ Inner Layer 18 Um
Layer Count:
4 Layers
Surface Finish:
Immersion Gold
Highlight:

4 Layer High TG PCB

,

IPC 6012 Class 2 High TG PCB

,

High TG 4 Layer PCB Board

Product Description

 

4 Layer Hybrid PCB Board Build On 4mil Rogers RO4350B and High Tg FR-4 for 4G Signal Booster

(PCB’s are custom-made products, the picture and parameters shown are just for reference)
 

Hi Everyone,

Today, we're going to talk about a type of 4-layer high frequency PCB made on 4mil RO4350B pressed with FR-4.

 

The board is designed as a 4-layer structure, because 4-layer is relatively simple and cost controllable, this is helpful to open up a new market.

 

Let's take a look at first build-up,
RO4350B 4 Layer IPC 6012 Class 2 High TG PCB For 4G Signal Booster 0

 

The first layer to the second layer and the third layer to the fourth layer are the Rogers core 4mil (0.102mm) RO4350B, the core has fixed thickness which is very important to the electrical length of RF lines on the circuit board, and the dielectric material in the middle is FR-4 epoxy glass, which bonds both cores on top and bottom side. Inner layer is 0.5 ounces and the outer layer is 1 ounce.

 

The detailed specifications of this board are as follows:

Base material: RO4350B 0.102mm + Tg 170℃ FR4 0.30mm

Layer count: 4 layers

Panel: 55mm x 132mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 um/ Inner layer 18 um

Solder mask / Legend: green / white

Final PCB height: 1.0 mm

Special technology: via in pad (hole filled) under BGA

Standard: IPC 6012 Class 2

Packing: 25 panels are packed for shipment.

Lead time: 12 working days

Shelf life: 6 months
 
RO4350B 4 Layer IPC 6012 Class 2 High TG PCB For 4G Signal Booster 1

 

The applications of RO4350B hybrid PCB are wide, such as

(1) preamplifier

(2) radar sensors

(3)digital transmitter and splitter module

(4) GPS antenna

(5) communications relays

(6)analogue transmitter and 4G antennas

(7)RF transmitter, WiFi amplifier, RFID and attenuator etc.

 

The advantages of RO4350B hybrid PCBs:

1) RO4350B exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications;

2) Signal integrity performance improved over the stack-ups with all FR4 board;

3) Cost reduced over stack-ups with all low loss material;

4) Reduce signal loss at high frequencies as well;

5) Benefit from our strong capabilities: meeting your PCB demands from prototype mass production and IATF 16949 (2016), ISO14001 (2015), ISO9001 (2015) and UL certified factory guarantee your quality.

 

That’s all of today. Thank you for your reading. You’re welcome to contact us for your RF PCB enquiries.
 

Appendix: Our PCB Capability 2021

Parameter Value
 Layer Counts  1-32
 Substrate Material FR-4(including High Tg 170, High CTI>600V); Aluminum based; Copper based; Rogers RO4350B, RO4003C, RO3003, RO3006, RO3010, RO3210 etc.; Rogers RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010 etc..; Taconic TLX-8, TLY-5, RF-35TC, TLF-35 etc..; Arlon AD450, AD600 etc; PTFE F4B DK2.2, DK2.65 etc..; Polyimide and PET.
 Maximum Size  Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
 Board Outline Tolerance  ±0.0059" (0.15mm)
 PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)  ±8%
Thickness Tolerance(t<0.8mm)  ±10%
 Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
 Minimum Track 0.003" (0.075mm)
 Minimum Space  0.003" (0.075mm)
 Outer Copper Thickness  35µm--420µm (1oz-12oz)
 Inner Copper Thickness  17µm--350µm (0.5oz - 10oz)
 Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
 Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
 Registration (Mechanical) 0.00197" (0.05mm)
 Aspect Ratio  12:1
 Solder Mask Type  LPI
 Min Soldermask Bridge 0.00315" (0.08mm)
 Min Soldermask Clearance 0.00197" (0.05mm)
 Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance  ±10%
 Surface Finish HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger

 

products
PRODUCTS DETAILS
RO4350B 4 Layer IPC 6012 Class 2 High TG PCB For 4G Signal Booster
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-077.V1.0
Base Material:
RO4350B 0.102mm + Tg 170℃ FR4 0.30mm
PCB Thickness:
1.0mm
PCB Size:
55mm X 132mm = 1 Type = 1 Piece
Solder Mask:
Green
Silkscreen:
White
Copper Weight:
Outer Layer 35 Um/ Inner Layer 18 Um
Layer Count:
4 Layers
Surface Finish:
Immersion Gold
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

4 Layer High TG PCB

,

IPC 6012 Class 2 High TG PCB

,

High TG 4 Layer PCB Board

Product Description

 

4 Layer Hybrid PCB Board Build On 4mil Rogers RO4350B and High Tg FR-4 for 4G Signal Booster

(PCB’s are custom-made products, the picture and parameters shown are just for reference)
 

Hi Everyone,

Today, we're going to talk about a type of 4-layer high frequency PCB made on 4mil RO4350B pressed with FR-4.

 

The board is designed as a 4-layer structure, because 4-layer is relatively simple and cost controllable, this is helpful to open up a new market.

 

Let's take a look at first build-up,
RO4350B 4 Layer IPC 6012 Class 2 High TG PCB For 4G Signal Booster 0

 

The first layer to the second layer and the third layer to the fourth layer are the Rogers core 4mil (0.102mm) RO4350B, the core has fixed thickness which is very important to the electrical length of RF lines on the circuit board, and the dielectric material in the middle is FR-4 epoxy glass, which bonds both cores on top and bottom side. Inner layer is 0.5 ounces and the outer layer is 1 ounce.

 

The detailed specifications of this board are as follows:

Base material: RO4350B 0.102mm + Tg 170℃ FR4 0.30mm

Layer count: 4 layers

Panel: 55mm x 132mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 um/ Inner layer 18 um

Solder mask / Legend: green / white

Final PCB height: 1.0 mm

Special technology: via in pad (hole filled) under BGA

Standard: IPC 6012 Class 2

Packing: 25 panels are packed for shipment.

Lead time: 12 working days

Shelf life: 6 months
 
RO4350B 4 Layer IPC 6012 Class 2 High TG PCB For 4G Signal Booster 1

 

The applications of RO4350B hybrid PCB are wide, such as

(1) preamplifier

(2) radar sensors

(3)digital transmitter and splitter module

(4) GPS antenna

(5) communications relays

(6)analogue transmitter and 4G antennas

(7)RF transmitter, WiFi amplifier, RFID and attenuator etc.

 

The advantages of RO4350B hybrid PCBs:

1) RO4350B exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications;

2) Signal integrity performance improved over the stack-ups with all FR4 board;

3) Cost reduced over stack-ups with all low loss material;

4) Reduce signal loss at high frequencies as well;

5) Benefit from our strong capabilities: meeting your PCB demands from prototype mass production and IATF 16949 (2016), ISO14001 (2015), ISO9001 (2015) and UL certified factory guarantee your quality.

 

That’s all of today. Thank you for your reading. You’re welcome to contact us for your RF PCB enquiries.
 

Appendix: Our PCB Capability 2021

Parameter Value
 Layer Counts  1-32
 Substrate Material FR-4(including High Tg 170, High CTI>600V); Aluminum based; Copper based; Rogers RO4350B, RO4003C, RO3003, RO3006, RO3010, RO3210 etc.; Rogers RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010 etc..; Taconic TLX-8, TLY-5, RF-35TC, TLF-35 etc..; Arlon AD450, AD600 etc; PTFE F4B DK2.2, DK2.65 etc..; Polyimide and PET.
 Maximum Size  Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
 Board Outline Tolerance  ±0.0059" (0.15mm)
 PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)  ±8%
Thickness Tolerance(t<0.8mm)  ±10%
 Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
 Minimum Track 0.003" (0.075mm)
 Minimum Space  0.003" (0.075mm)
 Outer Copper Thickness  35µm--420µm (1oz-12oz)
 Inner Copper Thickness  17µm--350µm (0.5oz - 10oz)
 Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
 Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
 Registration (Mechanical) 0.00197" (0.05mm)
 Aspect Ratio  12:1
 Solder Mask Type  LPI
 Min Soldermask Bridge 0.00315" (0.08mm)
 Min Soldermask Clearance 0.00197" (0.05mm)
 Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance  ±10%
 Surface Finish HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger

 

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