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RO3003 Rogers PCB Board

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RO3003 Rogers PCB Board

RO3003 Rogers PCB Board
RO3003 Rogers PCB Board RO3003 Rogers PCB Board RO3003 Rogers PCB Board RO3003 Rogers PCB Board

Large Image :  RO3003 Rogers PCB Board

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-095.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
  • Product Details
Detailed Product Description
Base Material: RO3003 Layer Count: 1 Layer, 2 Layer, Multilayer, Hybrid PCB
PCB Thickness: 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) PCB Size: ≤400mm X 500mm
Solder Mask: Green, Black, Blue, Yellow, Red Etc. Copper Weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish: Bare Copper, HASL, ENIG, OSP Etc..
High Light:

RO3003 Rogers PCB Board

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10mil Rogers PCB Board

 

Rogers RO3003 High Frequency PCB with 10mil, 20mil, 30mil and 60mil Thick Coating Immersion Gold, Immersion Silver, Immersion Tin and HASL

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Hello Everyone,

Today we’re talk about RO3003 high frequency PCBs.

 

RO3003 high frequency circuit laminates are ceramic-filled PTFE composites intended for using in commercial microwave and RF applications. Its obvious characteristic is that the electrical performance is exceptional and the mechanical property is stable and consistent. This allows our designers to develop multi-layer board design feeling free and free, without encountering warpage or reliability problems.

 

Let’s see some more features and applications.

 

RO3003 Rogers PCB Board 0

 

Firstly, low dielectric loss, DF=0.001, it can be used in applications up to 77 GHz.

 

Secondly, Stable dielectric constant versus temperature and frequency, it’s ideal material for band pass filters, microstrip patch antennas, and voltage controlled oscillators.

 

Thirdly, excellent mechanical properties versus temperature, it’s reliable stripline and multi-layer board constructions.

 

Fourthly, Uniform mechanical properties, it’s suitable for use with epoxy glass multi-layer board hybrid designs.

 

Fifthly, low in-plane expansion coefficient matches to copper, it allows for more reliable surface mounted assemblies; ideal for applications sensitive to temperature change and exhibit excellent dimensional stability.

 

Our PCB Capability (RO3003)

PCB Capability
PCB Material: Ceramic-filled PTFE composite
Designator: RO3003
Dielectric constant: 3.0 ±0.04 (process)
3.0 (design)
Layer count: 1 Layer, 2 Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil (0.508mm)
30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..
   

 

RO3003 high frequency PCBs are available with double sided, multi-layer and hybrid construction, copper ranges from 0.5oz to 2oz, thickness from 0.3mm to 1.6mm, maximum size 400 by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.

 

RO3003 Rogers PCB Board 1

 

Typical Applications

1. Automotive radar applications

2. Power amplifiers and antennas

3. Direct broadcast satellite

 

RO3003 Rogers PCB Board 2

 

The basic colour of RO3003 PCB is white.

 

The manufacturing process of RO3003 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market.

 

Should you have any questions, please feel free to contact us.

 

Thank you for your reading.

 

Appendix: Data Sheet of RO3003

RO3003 Typical Value
Property RO3003 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.04 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.001 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -3 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.06
0.07
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107   COND A IPC 2.5.17.1
Tensile Modulus 930
823
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.04   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.9   j/g/k   Calculated
Thermal Conductivity 0.5   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
17
16
25
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.1   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 12.7   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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