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4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4

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China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4

4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4
4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4

Large Image :  4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-076.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: RO4350B + FR4; RO4003C + FR4; F4B + FR4; RT/duroid5880 + FR4; RT/duroid5880 + RO4350B Layer Count: 4 Layer, 6 Layer, Multilayer
PCB Thickness: 1.0-5.0mm PCB Size: ≤400mm X 500mm
Solder Mask: Green, Red, Blue, Black, Yellow Coppper Weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish: Bare Copper, HASL, ENIG, Immersion Tin, OSP
High Light:

Hybrid Multi Layer PCB

,

1.6mm Multi Layer PCB

,

1.6mm 4 Layer PCB Board

 

4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4

(PCB’s are custom-made products, the picture and parameters shown are just for reference)

 

Hello everyone,

Warm greetings!

Today we talk about 4-layer hybrid PCB built on 20mil RO4003C and FR-4.

 

4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4 0

Firstly, it's a 4 layer structure. Layer 1 to layer 2 is 20mil RO4003C core, which is the main wiring layer for the signal lines. Layer 3 to layer 4 is the core of FR-4, both cores are combined through 0.2mm prepeg. Each layer is connected by plated through holes. The inner layer and out layer of copper is 1 ounce. This is a good method to keep the board cost effective.

 

Let's take a look at its micro-section chart.

4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4 1

 

Here on the left is the PTH hole, the bottom is layer 1 to layer 2 which is high frequency material, the upper part is glass fiber material. The finished thickness of the plate is 1.6mm.

 

The color of solder mask and silkscreen are also commonly used in green and white. Surface finish on pads is immersion gold.

 

4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4 2

 

Following is another type of 20mil RO4003C hybrid PCB. It’s made of 2 cores of 20mil RO4003C.

 

4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4 3

 

The applications of 20mil RO4003C hybrid PCB is wide, such as LNA, optical coupler, balanced amplifier, duplexer etc.

 

The advantages of 20mil RO4003C hybrid PCB are reflected in following 3 points:

1) RO4003C exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications.

2) Reducing signal loss in high frequency application meets the development needs of communication technology.

3) Cost reduced over stack-ups with all low loss material;

 

Our PCB Capability (Hybrid Design)

PCB Capability
PCB Type: Hybrid PCB, Mixed PCB
Mixed type: RO4350B + FR4;
  RO4003C + FR4;
  F4B + FR4;
  RT/duroid5880 + FR4;
  RT/duroid5880 + RO4350B
Solder mask: Green, Red, Blue, Black, Yellow
Layer count: 4 Layer, 6 Layer, Multilayer
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 1.0-5.0mm
PCB size: ≤400mm X 500mm
Surface finish: Bare copper, HASL, ENIG, Immersion tin, OSP
   

 

At present, the mature mixed pressing materials are as follows:

RO4350B + FR4;

RO4003C + FR4;

F4B + FR4;

RT/duroid5880 + FR4

RT/duroid5880 + RO4350B

 

Thank you for your reading. You’re welcome to contact us for your RF PCB enquiries.

 

Appendix: Data Sheet of RO4003C

RO4003C Typical Value
Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z   10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
(6.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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