Introducing our high-performance 6-layer rigid PCB, expertly crafted for a wide range of advanced electronic applications. This PCB is designed using top-quality materials and precision engineering, ensuring outstanding reliability and performance.
PCB Construction
This 6-layer PCB is meticulously engineered, featuring a combination of RO4350B and S1000-2M materials. The board’s dimensions are 76.5mm x 83mm, with a finished thickness of 1.5mm. The construction includes:
- Base Materials: RO4350B, known for its excellent electrical performance, and S1000-2M, which enhances thermal management and reliability.
- Layer Composition: The stackup consists of alternating copper and prepreg layers, ensuring optimal signal integrity and thermal stability.
Key Specifications
- Minimum Trace/Space: 4/4 mils
- Minimum Hole Size: 0.3mm
- Surface Finish: Electroless Nickel Immersion Gold (ENIG), providing excellent solderability and corrosion resistance.
- Electrical Testing: Each board undergoes 100% electrical testing before shipment, ensuring quality and reliability.
Material Advantages
RO4350B
RO4350B is a high-performance laminate that combines the manufacturability of epoxy/glass with the electrical performance of ceramic materials. Key features include:
- Dielectric Constant (Dk): Maintains a stable value of approximately 3.48 at 10GHz, crucial for high-frequency applications.
- Thermal Coefficient of Expansion (CTE): The CTE of RO4350B is closely matched to that of copper, ensuring minimal thermal stress and excellent dimensional stability during soldering and operation.
- High Glass Transition Temperature (Tg): With a Tg exceeding 280°C (536°F), RO4350B is suitable for high-temperature environments, making it ideal for demanding applications.
| RO4350B Typical Value |
| Property |
RO4350B |
Direction |
Units |
Condition |
Test Method |
| Dielectric Constant,εProcess |
3.48±0.05 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign |
3.66 |
Z |
|
8 to 40 GHz |
Differential Phase Length Method |
| Dissipation Factortan,δ |
0.0037
0.0031 |
Z |
|
10 GHz/23℃
2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε |
+50 |
Z |
ppm/℃ |
-50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
| Volume Resistivity |
1.2 x 1010 |
|
MΩ.cm |
COND A |
IPC-TM-650 2.5.17.1 |
| Surface Resistivity |
5.7 x109 |
|
MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
| Electrical Strength |
31.2(780) |
Z |
Kv/mm(v/mil) |
0.51mm(0.020") |
IPC-TM-650 2.5.6.2 |
| Tensile Modulus |
16,767(2,432)
14,153(2,053) |
X
Y |
MPa(ksi) |
RT |
ASTM D 638 |
| Tensile Strength |
203(29.5)
130(18.9) |
X
Y |
MPa(ksi) |
RT |
ASTM D 638 |
| Flexural Strength |
255
(37) |
|
MPa
(kpsi) |
|
IPC-TM-650 2.4.4 |
| Dimensional Stability |
<0.5 |
X,Y |
mm/m
(mil/inch) |
after etch+E2/150℃ |
IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion |
10
12
32 |
X
Y
Z |
ppm/℃ |
-55℃to288℃ |
IPC-TM-650 2.4.41 |
| Tg |
>280 |
|
℃ TMA |
A |
IPC-TM-650 2.4.24.3 |
| Td |
390 |
|
℃ TGA |
|
ASTM D 3850 |
| Thermal Conductivity |
0.69 |
|
W/M/oK |
80℃ |
ASTM C518 |
| Moisture Absorption |
0.06 |
|
% |
48hrs immersion 0.060"
sample Temperature 50℃ |
ASTM D 570 |
| Density |
1.86 |
|
gm/cm3 |
23℃ |
ASTM D 792 |
| Copper Peel Stength |
0.88
(5.0) |
|
N/mm
(pli) |
after solder float 1 oz.
EDC Foil |
IPC-TM-650 2.4.8 |
| Flammability |
(3)V-0 |
|
|
|
UL 94 |
| Lead-free Process Compatible |
Yes |
|
|
|
|
S1000-2M
S1000-2M complements RO4350B by offering:
- Lower Z-Axis CTE: This characteristic enhances the reliability of plated through-holes, especially in thermal cycling situations.
- Lead-Free Compatibility: S1000-2M supports environmentally friendly manufacturing processes, making it suitable for modern compliance standards.
- Excellent Mechanical Processability: This material allows for intricate designs without compromising reliability.
Applications
Given its robust specifications and material advantages, this 6-layer rigid PCB is ideally suited for a variety of applications, including:
- Commercial Airline Broadband Antennas: Providing reliable connectivity in aviation environments.
- Microstrip and Stripline Circuits: Essential for RF and microwave applications where signal integrity is paramount.
- Radar Systems: Supporting complex radar technology with high precision.
- Guidance Systems: Ensuring accurate and reliable performance in navigation and control systems.
- Point-to-Point Digital Radio Antennas**: Facilitating high-speed data transmission.
Compliance and Quality Assurance
Our PCBs meet IPC-Class-2 standards, ensuring high-quality manufacturing practices. The commitment to quality is evident in our rigorous testing processes, allowing us to deliver products that meet or exceed industry standards.
Additionally, the worldwide availability of our PCBs means that clients across the globe can access this cutting-edge technology, ensuring that your projects benefit from the best materials and manufacturing processes available.
Conclusion
In conclusion, our newly shipped 6-layer rigid PCB, crafted from RO4350B and S1000-2M, represents a significant advancement in PCB technology. With its impressive specifications, material advantages, and diverse applications, this PCB is designed to meet the complex demands of modern electronics.
Whether you are involved in aerospace, telecommunications, or advanced consumer electronics, choosing our 6-layer PCB will empower your designs with reliability, efficiency, and performance. Contact us today to learn more about how our PCBs can elevate your projects to the next level.
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