Introducing our high-performance 4-layer PCB, meticulously engineered with advanced materials to meet the demands of modern electronic applications. This PCB combines the robustness of RO4350B and S1000-2M, ensuring exceptional reliability and performance in various environments.
Material Composition
This PCB features a unique construction combining RO4350B and S1000-2M materials.
- RO4350B: This material is renowned for its high-frequency performance and stability. It is a woven glass reinforced hydrocarbon/ceramic laminate that provides a dielectric constant (Dk) of 3.48 ±0.05 at 10GHz, ensuring minimal signal loss. With a thermal coefficient of expansion (CTE) closely matching that of copper, it guarantees excellent dimensional stability, which is crucial for multi-layer designs.
| RO4350B Typical Value |
| Property |
RO4350B |
Direction |
Units |
Condition |
Test Method |
| Dielectric Constant,εProcess |
3.48±0.05 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign |
3.66 |
Z |
|
8 to 40 GHz |
Differential Phase Length Method |
| Dissipation Factortan,δ |
0.0037
0.0031 |
Z |
|
10 GHz/23℃
2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε |
+50 |
Z |
ppm/℃ |
-50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
| Volume Resistivity |
1.2 x 1010 |
|
MΩ.cm |
COND A |
IPC-TM-650 2.5.17.1 |
| Surface Resistivity |
5.7 x109 |
|
MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
| Electrical Strength |
31.2(780) |
Z |
Kv/mm(v/mil) |
0.51mm(0.020") |
IPC-TM-650 2.5.6.2 |
| Tensile Modulus |
16,767(2,432)
14,153(2,053) |
X
Y |
MPa(ksi) |
RT |
ASTM D 638 |
| Tensile Strength |
203(29.5)
130(18.9) |
X
Y |
MPa(ksi) |
RT |
ASTM D 638 |
| Flexural Strength |
255
(37) |
|
MPa
(kpsi) |
|
IPC-TM-650 2.4.4 |
| Dimensional Stability |
<0.5 |
X,Y |
mm/m
(mil/inch) |
after etch+E2/150℃ |
IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion |
10
12
32 |
X
Y
Z |
ppm/℃ |
-55℃to288℃ |
IPC-TM-650 2.4.41 |
| Tg |
>280 |
|
℃ TMA |
A |
IPC-TM-650 2.4.24.3 |
| Td |
390 |
|
℃ TGA |
|
ASTM D 3850 |
| Thermal Conductivity |
0.69 |
|
W/M/oK |
80℃ |
ASTM C518 |
| Moisture Absorption |
0.06 |
|
% |
48hrs immersion 0.060"
sample Temperature 50℃ |
ASTM D 570 |
| Density |
1.86 |
|
gm/cm3 |
23℃ |
ASTM D 792 |
| Copper Peel Stength |
0.88
(5.0) |
|
N/mm
(pli) |
after solder float 1 oz.
EDC Foil |
IPC-TM-650 2.4.8 |
| Flammability |
(3)V-0 |
|
|
|
UL 94 |
| Lead-free Process Compatible |
Yes |
|
|
|
|
- S1000-2M: This material enhances mechanical robustness and thermal resistance, boasting a Tg of 180°C. Its lower Z-axis CTE contributes to improved reliability in through-hole connections, making it ideal for high-frequency and high-power applications.
Layer Structure
The PCB is composed of four layers, each meticulously designed for optimal performance:
Copper_layer_1 - 35 μm
RO4350B - 0.254 mm (10mil)
Copper_layer_2 - 35 μm
Prepreg - 1080 RC63% +7628 (43%) -0.254mm (10mil)
Copper_layer_3 - 35 μm
S1000-2M - 0.8 mm (31.5mil)
Copper_layer_4 - 35 μm
This stackup allows for efficient heat dissipation and signal integrity, critical for modern electronic devices.
Dimensions and Specifications
- Board Dimensions: 173mm x 85.3mm (± 0.15mm)
- Finished Board Thickness: 1.5mm
- Minimum Trace/Space: 4/6 mils
- Minimum Hole Size: 0.20mm
- Via Plating Thickness: 20 μm
- Surface Finish: Electroless Nickel Immersion Gold (ENIG)
Each board undergoes a 100% electrical test prior to shipment, ensuring that every unit meets the highest quality standards.
Performance Characteristics
Electrical Performance
The electrical performance of our PCB is exceptional, driven by the properties of RO4350B and S1000-2M. Key performance metrics include:
- Dissipation Factor: 0.0037 at 10GHz, indicating low signal loss.
- Thermal Conductivity: 0.69 W/m/°K, aiding in efficient thermal management.
- High Tg Value: Greater than 280°C, allowing the PCB to withstand high-temperature environments without compromising performance.
Mechanical Stability
The robust construction of our PCB ensures mechanical stability across various applications. The materials' thermal properties provide reliability even in severe thermal shock environments, making it suitable for demanding applications such as aerospace and military systems.
Quality Assurance
Quality is paramount in PCB manufacturing. Our PCBs adhere to IPC-Class-2 standards, ensuring they meet industry requirements for reliability and performance. The Gerber RS-274-X artwork supplied with each PCB allows for precise manufacturing and design verification, minimizing errors and ensuring a smooth production process.
Applications
This hybrid PCB is ideal for a multitude of applications:
- Commercial Airline Broadband Antennas: High-frequency performance ensures reliable communication.
- Microstrip and Stripline Circuits: Suitable for RF and microwave applications.
- Radar Systems: Exceptional signal integrity enhances detection capabilities.
- Guidance Systems: Reliable performance crucial for navigation and targeting.
- Point-to-Point Digital Radio Antennas: Efficient transmission and reception of data.
Conclusion
With its outstanding performance metrics, stringent quality control, and wide-ranging applicability, this PCB is designed to enhance your projects and foster innovation in your industry. Whether you're involved in telecommunications, aerospace, or any high-tech sector, our PCB delivers the reliability and performance essential for your success.
For further details or to place an order, please reach out to our sales team. We are here to help you take your designs to the next level.
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