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4 Layer Hybrid PCB Board Built On Rogers 10mil RO4350B and FR-4

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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4 Layer Hybrid PCB Board Built On Rogers 10mil RO4350B and FR-4

4 Layer Hybrid PCB Board Built On Rogers 10mil RO4350B and FR-4

Large Image :  4 Layer Hybrid PCB Board Built On Rogers 10mil RO4350B and FR-4

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-078.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: RO4350B+FR-4 Layer Count: 4 Layers
PCB Thickness: 0.7mm Solder Mask: Green
Silkscreen: White Copper Weight: Inner Layer Is 0.5 Ounces And The Outer Layer Is 1 Ounce.
Surface Finish: Immersion Gold
High Light:

RO4350B FR4 4 Layer Circuit Board

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0.7mm 4 Layer Circuit Board

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RO4350B FR4 Diy 4 Layer PCB

 

4 Layer Hybrid PCB Board Built On Rogers 10mil RO4350B and FR-4

(PCB’s are custom-made products, the picture and parameters shown are just for reference)

 

Hi Everyone,

Today, we're talking about 4-layer high frequency PCB made on 10mil RO4350B pressed with FR-4.

 

The board is designed as a 4-layer structure, because 4-layer is relatively simple and cost controllable, this is helpful to open up a new market.

 

Let's take a look at first build-up,

4 Layer Hybrid PCB Board Built On Rogers 10mil RO4350B and FR-4 0

 

The first layer to the second layer is 10mil RO4350B core material, the core has fixed thickness which is very important to the electrical length of RF lines on the circuit board, and the other layers are FR-4 materials, which are bonded by semi-cured sheets. Inner layer is 0.5 ounces and the outer layer is 1 ounce.

 

Following picture is the cross section

4 Layer Hybrid PCB Board Built On Rogers 10mil RO4350B and FR-4 1

 

Plated through holes connect each layer. Pads and vias are with immersion gold.

 

The second board has a special “hole” in the board. See the build-up first.

4 Layer Hybrid PCB Board Built On Rogers 10mil RO4350B and FR-4 2

 

Layer 1 and layer 2 is the 10mil core. The depth-control drill is dented on FR-4 side. The whole height of this board is only 0.7mm thick.

 


4 Layer Hybrid PCB Board Built On Rogers 10mil RO4350B and FR-4 3

 

The applications of 10mil RO4350B hybrid PCB are wide, such as preamplifier, radar sensors, digital transmitter and splitter module; GPS antenna, communications relays, analogue transmitter and 4G antennas; RF transmitter, WiFi amplifier, RFID and attenuator etc.

 

The advantages of 10mil RO4350B hybrid PCBs are reflected in following points.

 

1) RO4350B exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications;

 

2) Signal integrity performance improved over the stack-ups with all FR4 board;

 

3) Cost reduced over stack-ups with all low loss material;

 

4) Benefit from our strong capabilities: meeting your PCB needs from prototype to mass production and IATF 16949 (2016), ISO14001 (2015), ISO9001 (2015) and UL certified factory guarantee your quality.

 

Thank you for your reading. You’re welcome to contact us for our RF PCB enquiries.

 

Appendix: Our PCB Capability 2021

Parameter Value
 Layer Counts  1-32
 Substrate Material FR-4(including High Tg 170, High CTI>600V); Aluminum based; Copper based; Rogers RO4350B, RO4003C, RO3003, RO3006, RO3010, RO3210 etc.; Rogers RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010 etc..; Taconic TLX-8, TLY-5, RF-35TC, TLF-35 etc..; Arlon AD450, AD600 etc; PTFE F4B DK2.2, DK2.65 etc..; Polyimide and PET.
 Maximum Size  Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
 Board Outline Tolerance  ±0.0059" (0.15mm)
 PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)  ±8%
Thickness Tolerance(t<0.8mm)  ±10%
 Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
 Minimum Track 0.003" (0.075mm)
 Minimum Space  0.003" (0.075mm)
 Outer Copper Thickness  35µm--420µm (1oz-12oz)
 Inner Copper Thickness  17µm--350µm (0.5oz - 10oz)
 Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
 Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
 Registration (Mechanical) 0.00197" (0.05mm)
 Aspect Ratio  12:1
 Solder Mask Type  LPI
 Min Soldermask Bridge 0.00315" (0.08mm)
 Min Soldermask Clearance 0.00197" (0.05mm)
 Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance  ±10%
 Surface Finish HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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