This 2-layer rigid RF PCB is specifically engineered for high-performance radio frequency (RF) applications, utilizing Rogers RO4350B material—a proprietary woven glass reinforced hydrocarbon/ceramic laminate. It is designed to balance exceptional electrical performance (close to PTFE/woven glass) with the manufacturability of epoxy/glass, making it ideal for RF systems requiring reliable signal transmission and stable performance.
PCB Specification
| Parameter |
Details |
| Layer Count |
2-Layer (rigid RF structure) |
| Base Material |
Rogers RO4350B (proprietary woven glass reinforced hydrocarbon/ceramic laminate) |
| Board Dimensions |
54mm × 68mm per piece (1PCS), tolerance ±0.15mm |
| Minimum Trace/Space |
4 mils (trace) / 6 mils (space) |
| Minimum Hole Size |
0.3mm |
| Vias |
No blind vias; total vias: 101; via plating thickness: 20 μm |
| Finished Board Thickness |
1.6mm |
| Finished Copper Weight |
1oz (1.4 mils) for outer layers |
| Surface Finish |
Immersion silver |
| Silkscreen |
White on top layer; no silkscreen on bottom layer |
| Solder Mask |
Blue on top layer; no solder mask on bottom layer |
| Quality Assurance |
100% electrical testing before shipment |
PCB Stack-up
| Layer Name |
Material |
Thickness |
| Top Layer (Copper_layer_1) |
Copper |
35 μm |
| Substrate Layer |
Rogers RO4350B Core |
1.524mm (60 mil) |
| Bottom Layer (Copper_layer_2) |
Copper |
35 μm |
Rogers RO4350B Material Introduction
Rogers RO4350B materials are proprietary woven glass reinforced hydrocarbon/ceramics that combine electrical performance close to PTFE/woven glass with the manufacturability of epoxy/glass. These laminates offer tight control over dielectric constant (Dk) and maintain low loss while utilizing the same processing methods as standard epoxy/glass materials. Available at a fraction of the cost of conventional microwave laminates, RO4350B does not require the special through-hole treatments or handling procedures needed for PTFE-based materials. Additionally, RO4350B laminates are UL 94 V-0 rated, making them suitable for active devices and high-power RF designs.
Key Material Features
| Feature |
Specification/Description |
| Dielectric Constant (Dk) |
3.48 ± 0.05 at 10GHz/23°C |
| Dissipation Factor |
0.0037 at 10GHz/23°C |
| Thermal Coefficient of Dk |
+50 ppm/°C (ranging from -50°C to 150°C) |
| Thermal Conductivity |
0.69 W/m/°K |
| Coefficient of Thermal Expansion (CTE) |
X axis: 10 ppm/°C; Y axis: 12 ppm/°C; Z axis: 32 ppm/°C |
| Glass Transition Temperature (Tg) |
>280 °C |
| Water Absorption |
0.06% (low water absorption) |
| Flammability Rating |
UL 94-V0 |
| Manufacturability |
Compatible with standard epoxy/glass processing methods; no special through-hole treatments required |
Benefits
Superior RF Performance: Tight Dk control and low dissipation factor ensure reliable high-frequency signal transmission, critical for RF applications.
Cost-Effective Manufacturing: Utilizes standard epoxy/glass processing workflows, reducing production costs compared to conventional microwave laminates.
High Thermal Stability: High Tg (>280°C) and excellent thermal conductivity enable stable performance in high-temperature operating environments.
Low Environmental Sensitivity: Low water absorption (0.06%) minimizes performance degradation in humid conditions.
Enhanced Safety: UL 94-V0 flammability rating ensures compliance with safety standards for active devices and high-power RF designs.
Artwork
Type of artwork supplied: Gerber RS-274-X (industry-standard format for PCB manufacturing)
Quality Standard & Availability
Quality Standard: Complies with IPC-Class-2 quality standards. This widely recognized standard specifies strict acceptability requirements for PCB manufacturing,
Availability: Worldwide supply is supported.
Typical Applications
-Telecom Infrastructure: Cellular Base Station Antennas and Power Amplifiers
-RF Identification: RF Identification Tags
-Automotive Electronics: Automotive Radar and Sensors
-Satellite Communication: LNB's (Low Noise Blocks) for Direct Broadcast Satellites
Summary
The 2-layer rigid RF PCB with Rogers RO4350B material is a high-performance, cost-effective solution tailored for demanding RF applications. By combining superior electrical performance (close to PTFE-based materials) with the manufacturability of epoxy/glass, immersion silver surface finish, and compliance with IPC-Class-2 standards, it addresses key challenges in RF system design—from stable high-frequency signal transmission to efficient volume manufacturing. Its global availability and UL 94-V0 safety rating make it a trusted choice for telecom, automotive, RFID, and satellite communication projects worldwide.
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