logo
products
PRODUCTS DETAILS
Home > Products >
Rogers 4003C PCB 8mil Double-layer with Black silkscreen

Rogers 4003C PCB 8mil Double-layer with Black silkscreen

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
Rogers RO4003C
Layer Count:
2-layer
PCB Thickness:
0.3mm
PCB Size:
54mm × 58mm
Silkscreen:
Black
Solder Mask:
No
Copper Weight:
1oz (1.4 Mils) For Outer Layers
Surface Finish:
Immersion Silver
Highlight:

8mil Rogers 4003C PCB

,

Double-layer Rogers 4003C PCB

,

Black silkscreen Rogers 4003C PCB

Product Description

This 2-layer rigid PCB adopts Rogers RO4003C, a proprietary woven glass-reinforced hydrocarbon/ceramic composite material that integrates the electrical performance of PTFE/woven glass laminates with the manufacturability of epoxy/glass substrates. It is engineered to reliably meet the stringent requirements for high-frequency signal transmission in precision RF application scenarios.

 

PCB Specifications

Parameter Details
Layer Count 2-Layer (rigid structure)
Base Material Rogers RO4003C
Board Dimensions 54mm × 58mm per piece (1PCS), tolerance ±0.15mm
Minimum Trace/Space 4 mils (trace) / 6 mils (space)
Minimum Hole Size 0.2mm
Vias No blind vias; Total vias: 19; Via plating thickness: 20 μm
Finished Board Thickness 0.3mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Immersion Silver
Silkscreen Black silkscreen on top layer; No silkscreen on bottom layer
Solder Mask No solder mask on top layer; No solder mask on bottom layer
Quality Assurance 100% electrical test conducted prior to shipment

 

PCB Stack-up

Layer Name Material Thickness
Top Copper Layer (Copper_layer_1) Copper 35 μm
Substrate Core Rogers RO4003C Core 0.203mm (8 mil)
Bottom Copper Layer (Copper_layer_2) Copper 35 μm

 

Rogers RO4003C Material Introduction

Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics, integrating the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. Offered in various configurations, RO4003C laminates utilize both 1080 and 1674 glass fabric styles, with all configurations meeting the same laminate electrical performance specification.

 

RO4003C laminates provide tight control on dielectric constant (Dk) and low loss while utilizing the same processing method as standard epoxy/glass but at a fraction of the cost of conventional microwave laminates. Unlike PTFE based microwave materials, no special through-hole treatments or handling procedures are required. RO4003C materials are non-brominated and are not UL 94 V-0 rated. With a Tg of >280°C, their expansion characteristics remain stable over the entire range of circuit processing temperatures.

 

Rogers 4003C PCB 8mil Double-layer with Black silkscreen 0

 

Key Material Features

Feature Specification/Description
Material Composition Rogers RO4003C proprietary woven glass reinforced hydrocarbon/ceramics
Dielectric Constant (Dk) 3.38 ± 0.05 at 10 GHz
Dissipation Factor 0.0027 at 10 GHz; 0.0021 at 2.5 GHz
Thermal Coefficient of Dielectric Constant +40 ppm/°C
Thermal Conductivity 0.71 W/m·°K
Moisture Absorption 0.06%
Coefficient of Thermal Expansion (CTE) X axis: 11 ppm/°C; Y axis: 14 ppm/°C; Z axis: 46 ppm/°C
Surface Finish Advantage Immersion silver ensures excellent solderability and corrosion resistance

 

Core Benefits

Suitable for Multi-Layer Constructions: Ideal for MLB designs; copper-matched CTE ensures excellent dimensional stability in mixed dielectric multilayers.

 

Cost-Effective Manufacturability: FR-4 process-compatible, no special through-hole treatment, lower fabrication cost than conventional microwave laminates.

 

High-Performance for Volume Applications: Designed for high-volume, performance-sensitive RF applications, balancing electrical performance and production efficiency.

 

Competitive Pricing: Superior electrical performance at a fraction of conventional microwave laminate cost, excellent cost-performance ratio.

 

Reliable Plated Through-Hole Quality: Low Z-axis CTE ensures reliable plated through-holes even under severe thermal shock.

 

Stable Thermal Performance: Tg >280°C maintains stable expansion during all circuit processing temperatures.

 

Low Environmental Sensitivity: 0.06% moisture absorption minimizes performance degradation in humid environments.

 

Quality Standard & Availability

Quality Standard: Complies with IPC-Class-2, ensuring consistent quality via rigorous process control and 100% electrical verification before shipment.

 

Availability: Globally available, enabling timely delivery and efficient after-sales support for international customers.

 

Typical Applications

-Cellular Base Station Antennas and Power Amplifiers

-RF Identification Tags

-Automotive Radar and Sensors

-LNB's for Direct Broadcast Satellites

 

Summary

This 2-layer rigid PCB based on Rogers RO4003C substrate is a high-performance, cost-effective solution tailored for commercial microwave and RF applications. With its competitive pricing and global supply capability, It serves as a trustworthy option for high-volume production of precision RF devices.

 

Rogers 4003C PCB 8mil Double-layer with Black silkscreen 1

products
PRODUCTS DETAILS
Rogers 4003C PCB 8mil Double-layer with Black silkscreen
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
Rogers RO4003C
Layer Count:
2-layer
PCB Thickness:
0.3mm
PCB Size:
54mm × 58mm
Silkscreen:
Black
Solder Mask:
No
Copper Weight:
1oz (1.4 Mils) For Outer Layers
Surface Finish:
Immersion Silver
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

8mil Rogers 4003C PCB

,

Double-layer Rogers 4003C PCB

,

Black silkscreen Rogers 4003C PCB

Product Description

This 2-layer rigid PCB adopts Rogers RO4003C, a proprietary woven glass-reinforced hydrocarbon/ceramic composite material that integrates the electrical performance of PTFE/woven glass laminates with the manufacturability of epoxy/glass substrates. It is engineered to reliably meet the stringent requirements for high-frequency signal transmission in precision RF application scenarios.

 

PCB Specifications

Parameter Details
Layer Count 2-Layer (rigid structure)
Base Material Rogers RO4003C
Board Dimensions 54mm × 58mm per piece (1PCS), tolerance ±0.15mm
Minimum Trace/Space 4 mils (trace) / 6 mils (space)
Minimum Hole Size 0.2mm
Vias No blind vias; Total vias: 19; Via plating thickness: 20 μm
Finished Board Thickness 0.3mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Immersion Silver
Silkscreen Black silkscreen on top layer; No silkscreen on bottom layer
Solder Mask No solder mask on top layer; No solder mask on bottom layer
Quality Assurance 100% electrical test conducted prior to shipment

 

PCB Stack-up

Layer Name Material Thickness
Top Copper Layer (Copper_layer_1) Copper 35 μm
Substrate Core Rogers RO4003C Core 0.203mm (8 mil)
Bottom Copper Layer (Copper_layer_2) Copper 35 μm

 

Rogers RO4003C Material Introduction

Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics, integrating the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. Offered in various configurations, RO4003C laminates utilize both 1080 and 1674 glass fabric styles, with all configurations meeting the same laminate electrical performance specification.

 

RO4003C laminates provide tight control on dielectric constant (Dk) and low loss while utilizing the same processing method as standard epoxy/glass but at a fraction of the cost of conventional microwave laminates. Unlike PTFE based microwave materials, no special through-hole treatments or handling procedures are required. RO4003C materials are non-brominated and are not UL 94 V-0 rated. With a Tg of >280°C, their expansion characteristics remain stable over the entire range of circuit processing temperatures.

 

Rogers 4003C PCB 8mil Double-layer with Black silkscreen 0

 

Key Material Features

Feature Specification/Description
Material Composition Rogers RO4003C proprietary woven glass reinforced hydrocarbon/ceramics
Dielectric Constant (Dk) 3.38 ± 0.05 at 10 GHz
Dissipation Factor 0.0027 at 10 GHz; 0.0021 at 2.5 GHz
Thermal Coefficient of Dielectric Constant +40 ppm/°C
Thermal Conductivity 0.71 W/m·°K
Moisture Absorption 0.06%
Coefficient of Thermal Expansion (CTE) X axis: 11 ppm/°C; Y axis: 14 ppm/°C; Z axis: 46 ppm/°C
Surface Finish Advantage Immersion silver ensures excellent solderability and corrosion resistance

 

Core Benefits

Suitable for Multi-Layer Constructions: Ideal for MLB designs; copper-matched CTE ensures excellent dimensional stability in mixed dielectric multilayers.

 

Cost-Effective Manufacturability: FR-4 process-compatible, no special through-hole treatment, lower fabrication cost than conventional microwave laminates.

 

High-Performance for Volume Applications: Designed for high-volume, performance-sensitive RF applications, balancing electrical performance and production efficiency.

 

Competitive Pricing: Superior electrical performance at a fraction of conventional microwave laminate cost, excellent cost-performance ratio.

 

Reliable Plated Through-Hole Quality: Low Z-axis CTE ensures reliable plated through-holes even under severe thermal shock.

 

Stable Thermal Performance: Tg >280°C maintains stable expansion during all circuit processing temperatures.

 

Low Environmental Sensitivity: 0.06% moisture absorption minimizes performance degradation in humid environments.

 

Quality Standard & Availability

Quality Standard: Complies with IPC-Class-2, ensuring consistent quality via rigorous process control and 100% electrical verification before shipment.

 

Availability: Globally available, enabling timely delivery and efficient after-sales support for international customers.

 

Typical Applications

-Cellular Base Station Antennas and Power Amplifiers

-RF Identification Tags

-Automotive Radar and Sensors

-LNB's for Direct Broadcast Satellites

 

Summary

This 2-layer rigid PCB based on Rogers RO4003C substrate is a high-performance, cost-effective solution tailored for commercial microwave and RF applications. With its competitive pricing and global supply capability, It serves as a trustworthy option for high-volume production of precision RF devices.

 

Rogers 4003C PCB 8mil Double-layer with Black silkscreen 1

sitemap |  Privacy Policy | China Good Quality RF PCB Board Supplier. Copyright © 2020-2025 Bicheng Electronics Technology Co., Ltd . All Rights Reserved.