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RO4725JXR PCB 60.7mil Substrate Double-layer Circuit Board

RO4725JXR PCB 60.7mil Substrate Double-layer Circuit Board

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
Rogers RO4725JXR
Layer Count:
2-layer
PCB Thickness:
1.62mm
PCB Size:
115.1mm × 66.3mm
Silkscreen:
No
Solder Mask:
No
Copper Weight:
1oz (1.4 Mils) For Outer Layers
Surface Finish:
Immersion Gold
Highlight:

60.7 mil Substrate PCB Board

,

RO4725JXR double layer circuit board

,

60.7mil double layer circuit board

Product Description

This 2-layer rigid PCB adopts Rogers RO4725JXR, a hydrocarbon/ceramic/woven glass antenna grade laminate. It is specifically engineered to reliably meet the stringent requirements for high-frequency signal transmission in precision RF application scenarios, particularly suitable for cellular base station antenna applications.

 

PCB Specifications

Parameter Details
Layer Count 2-Layer (rigid structure)
Base Material Rogers RO4725JXR
Board Dimensions 115.1mm × 66.3mm per piece (1PCS), tolerance ±0.15mm
Minimum Trace/Space 5 mils (trace) / 6 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; Total vias: 131; Via plating thickness: 20 μm
Finished Board Thickness 1.62mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Immersion Gold
Silkscreen No silkscreen on top layer; No silkscreen on bottom layer
Solder Mask No solder mask on top layer; No solder mask on bottom layer
Quality Assurance 100% electrical test conducted prior to shipment

 

PCB Stack-up

Layer Name Material Thickness
Top Copper Layer (Copper_layer_1) Copper 35 μm
Substrate Core Rogers RO4725JXR Core 1.542mm (60.7 mil)
Bottom Copper Layer (Copper_layer_2) Copper 35 μm

 

Rogers RO4725JXR Material Introduction

Rogers RO4725JXR Hydrocarbon / Ceramic / Woven Glass antenna grade laminates are a reliable, low-cost alternative to conventional PTFE-based laminates. The resin systems of RO4725JXR dielectric materials provide the necessary properties for ideal antenna performance. RO4725JXR antenna grade laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing.

 

These materials do not require the special treatment needed on traditional PTFE-based laminates for plated through-hole preparation. RO4725JXR laminates are an affordable alternative to conventional PTFE-based antenna materials, allowing for designers to optimize cost and performance. They have the mechanical and electrical properties that antenna designers need, with values that allow antenna designers to realize substantial gain values while minimizing signal loss.

 

RO4725JXR PCB 60.7mil Substrate Double-layer Circuit Board 0

 

Key Material Features

Feature Specification/Description
Material Composition Rogers RO4725JXR Hydrocarbon / Ceramic / Woven Glass antenna grade laminate
Dielectric Constant (Dk) 2.55 ± 0.05 at 10 GHz/23°C
Dissipation Factor 0.0026 at 10 GHz/23°C; 0.0022 at 2.5 GHz
Thermal Coefficient of Dielectric Constant +34 ppm/°C
Coefficient of Thermal Expansion (CTE) X axis: 13.9 ppm/°C; Y axis: 19 ppm/°C; Z axis: 25.6 ppm/°C (matched to copper)
Glass Transition Temperature (Tg) >280 °C
Passive Intermodulation (PIM) Value -166 dBC
Surface Finish Advantage Immersion Gold ensures excellent solderability, corrosion resistance and reliable bonding performance

 

Core Benefits

Low-Loss Performance: Low-loss dielectric with low-profile foil, minimizing signal attenuation.

 

Low Insertion Loss: Ensures efficient high-frequency signal transmission and integrity.

 

Dk Compatibility: Dk matched to standard PTFE antennas, facilitating design compatibility.

 

Reduced PIM: Low passive intermodulation, avoiding interference and enhancing system reliability.

 

Consistent Circuit Performance: Stable electrical/mechanical properties for reliable operation.

 

Excellent Process Compatibility: FR-4 and lead-free solder compatible, no special through-hole treatment.

 

Cost-Effective Solution: Affordable alternative to PTFE laminates, optimizing cost-performance.

 

Quality Standard & Availability

Quality Standard: Complies with IPC-Class-2, ensuring consistent quality via rigorous process control and 100% electrical verification before shipment.

 

Availability: Globally available, enabling timely delivery and efficient after-sales support for international customers.

 

Typical Applications

Cellular Base Station Antennas

 

Summary

This 2-layer rigid PCB based on Rogers RO4725JXR substrate is a high-performance, cost-effective solution tailored for commercial microwave and RF applications, especially cellular base station antennas.

 

RO4725JXR PCB 60.7mil Substrate Double-layer Circuit Board 1

products
PRODUCTS DETAILS
RO4725JXR PCB 60.7mil Substrate Double-layer Circuit Board
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
Rogers RO4725JXR
Layer Count:
2-layer
PCB Thickness:
1.62mm
PCB Size:
115.1mm × 66.3mm
Silkscreen:
No
Solder Mask:
No
Copper Weight:
1oz (1.4 Mils) For Outer Layers
Surface Finish:
Immersion Gold
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

60.7 mil Substrate PCB Board

,

RO4725JXR double layer circuit board

,

60.7mil double layer circuit board

Product Description

This 2-layer rigid PCB adopts Rogers RO4725JXR, a hydrocarbon/ceramic/woven glass antenna grade laminate. It is specifically engineered to reliably meet the stringent requirements for high-frequency signal transmission in precision RF application scenarios, particularly suitable for cellular base station antenna applications.

 

PCB Specifications

Parameter Details
Layer Count 2-Layer (rigid structure)
Base Material Rogers RO4725JXR
Board Dimensions 115.1mm × 66.3mm per piece (1PCS), tolerance ±0.15mm
Minimum Trace/Space 5 mils (trace) / 6 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; Total vias: 131; Via plating thickness: 20 μm
Finished Board Thickness 1.62mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Immersion Gold
Silkscreen No silkscreen on top layer; No silkscreen on bottom layer
Solder Mask No solder mask on top layer; No solder mask on bottom layer
Quality Assurance 100% electrical test conducted prior to shipment

 

PCB Stack-up

Layer Name Material Thickness
Top Copper Layer (Copper_layer_1) Copper 35 μm
Substrate Core Rogers RO4725JXR Core 1.542mm (60.7 mil)
Bottom Copper Layer (Copper_layer_2) Copper 35 μm

 

Rogers RO4725JXR Material Introduction

Rogers RO4725JXR Hydrocarbon / Ceramic / Woven Glass antenna grade laminates are a reliable, low-cost alternative to conventional PTFE-based laminates. The resin systems of RO4725JXR dielectric materials provide the necessary properties for ideal antenna performance. RO4725JXR antenna grade laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing.

 

These materials do not require the special treatment needed on traditional PTFE-based laminates for plated through-hole preparation. RO4725JXR laminates are an affordable alternative to conventional PTFE-based antenna materials, allowing for designers to optimize cost and performance. They have the mechanical and electrical properties that antenna designers need, with values that allow antenna designers to realize substantial gain values while minimizing signal loss.

 

RO4725JXR PCB 60.7mil Substrate Double-layer Circuit Board 0

 

Key Material Features

Feature Specification/Description
Material Composition Rogers RO4725JXR Hydrocarbon / Ceramic / Woven Glass antenna grade laminate
Dielectric Constant (Dk) 2.55 ± 0.05 at 10 GHz/23°C
Dissipation Factor 0.0026 at 10 GHz/23°C; 0.0022 at 2.5 GHz
Thermal Coefficient of Dielectric Constant +34 ppm/°C
Coefficient of Thermal Expansion (CTE) X axis: 13.9 ppm/°C; Y axis: 19 ppm/°C; Z axis: 25.6 ppm/°C (matched to copper)
Glass Transition Temperature (Tg) >280 °C
Passive Intermodulation (PIM) Value -166 dBC
Surface Finish Advantage Immersion Gold ensures excellent solderability, corrosion resistance and reliable bonding performance

 

Core Benefits

Low-Loss Performance: Low-loss dielectric with low-profile foil, minimizing signal attenuation.

 

Low Insertion Loss: Ensures efficient high-frequency signal transmission and integrity.

 

Dk Compatibility: Dk matched to standard PTFE antennas, facilitating design compatibility.

 

Reduced PIM: Low passive intermodulation, avoiding interference and enhancing system reliability.

 

Consistent Circuit Performance: Stable electrical/mechanical properties for reliable operation.

 

Excellent Process Compatibility: FR-4 and lead-free solder compatible, no special through-hole treatment.

 

Cost-Effective Solution: Affordable alternative to PTFE laminates, optimizing cost-performance.

 

Quality Standard & Availability

Quality Standard: Complies with IPC-Class-2, ensuring consistent quality via rigorous process control and 100% electrical verification before shipment.

 

Availability: Globally available, enabling timely delivery and efficient after-sales support for international customers.

 

Typical Applications

Cellular Base Station Antennas

 

Summary

This 2-layer rigid PCB based on Rogers RO4725JXR substrate is a high-performance, cost-effective solution tailored for commercial microwave and RF applications, especially cellular base station antennas.

 

RO4725JXR PCB 60.7mil Substrate Double-layer Circuit Board 1

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