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Immersion gold UL 94 Multi Layer PCB RO4003C 32mil And RO4450F 12mil PP

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Immersion gold UL 94 Multi Layer PCB RO4003C 32mil And RO4450F 12mil PP

Immersion gold UL 94 Multi Layer PCB RO4003C 32mil And RO4450F 12mil PP
Immersion gold UL 94 Multi Layer PCB RO4003C 32mil And RO4450F 12mil PP Immersion gold UL 94 Multi Layer PCB RO4003C 32mil And RO4450F 12mil PP Immersion gold UL 94 Multi Layer PCB RO4003C 32mil And RO4450F 12mil PP

Large Image :  Immersion gold UL 94 Multi Layer PCB RO4003C 32mil And RO4450F 12mil PP

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-069.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: RO4003C 32mil + RO4450F 12mil PP Layer Count: 4 Layers
PCB Thickness: 2.1mm PCB Size: 113mm X 80mm = 1 Type = 4 Piece
Copper Weight: 1oz Surface Finish: Immersion Gold
High Light:

Immersion Gold Multi Layer PCB

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UL 94 Multi Layer PCB

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UL 94 Immersion Gold PCB

 

4 Layer High Frequency PCB On 2 Cores of 32mil 0.813mm RO4003C and 12mil RO4450F for Ultrahigh Frequency Coupler

(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)

 

Today we talk about a type of 4 layer high frequency PCB. This PCB is built on 2 sheets of 0.813mm (32mil) RO4003C cores with 1 sheet RO4450F prepreg for the application of ultrahigh frequency coupler. Following is the stack-up.

 

Immersion gold UL 94 Multi Layer PCB RO4003C 32mil And RO4450F 12mil PP 0

 

In general, multilayer Rogers high frequency PCBs are made from all high frequency material inclusive of prepreg adhesive. As is known to all, there’re 6 cores in RO4003C family, i.e. 8mil (0.203mm) to 60mil (1.524mm).

 

RO4003C:  
8mil 0.203mm
12mil 0.305mm
16mil 0.406mm
20mil 0.508mm
32mil 0.813mm
60mil 1.524mm

 

The specifications of the board are as follows:

Base material: RO4003C 32mil + RO4450F 12mil PP

Layer count: 4 layers

Type: Castellation holes (half holes) on edge

Format: 113mm x 80mm = 1 type = 4 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm/ Inner layer 35 μm

Solder mask / Legend: no / no

Final PCB height: 2.1 mm

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 10 working days

Shelf life: 6 months

 

You enjoy the features and benefits

1) Excellent high frequency performance due to low dielectric tolerance and loss;

2) AOI inspection;

3) Meeting your PCB needs from prototype to mass production;

4) 30000 square meter month capability;

5) 8000 types of PCB's per month;

6) More than 16 years of PCB experience;

 

Application

GPS antenna, WiFi amplifier, Power amplifier, RF transceiver, TV antenna, Radar data acquisition converter, Spread spectrum, Attenuator

 

Appendix: Properties of RO4003C

RO4003C Typical Value
Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z   10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
(6.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        

 

Immersion gold UL 94 Multi Layer PCB RO4003C 32mil And RO4450F 12mil PP 1

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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