English
Introduction
Wangling’s TP material is a unique high-frequency thermoplastic material in the industry. The dielectric layer of TP-type laminates consists of ceramics and polyphenylene Oxide resin (PPO), without fiberglass reinforcement. The dielectric constant can be precisely adjusted by adjusting the ratio between ceramics and PPO resin. The production process is special, and it has excellent dielectric performance and high reliability.
Features
The dielectric constant can be arbitrarily selected within the range of 3 to 25 according to circuit requirements, and it is stable. Common dielectric constants include 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 10.2, 11, 16, and 20.
The material demonstrates low dielectric loss, with a slight increase at higher frequencies. However, this increase is not significant within the 10 GHz range.
For long-term operation, the material can withstand temperatures ranging from -100°C to +150°C, showcasing excellent low-temperature resistance. It's important to note that temperatures exceeding 180°C may result in deformation, copper foil peeling, and significant changes in electrical performance.
The material exhibits radiation resistance and displays low outgassing properties.
Furthermore, the adhesion between the copper foil and dielectric is more reliable compared to ceramic substrates with vacuum coating.
PCB Capability
Let’s see our PCB Capability on TP materials.
Layer count: We offer single-sided and double-sided PCBs based on the characteristics of the material.
Copper weight: We provide options of 1oz (35µm) and 2oz (70µm), catering to different conductivity requirements.
Wide range of dielectric thicknesses are available, such as 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 7.0mm, 8.0mm, 10.0mm, and 12.0mm, allowing flexibility in design specifications.
Due to laminate size constraints, the maximum PCB we can provide is 150mm X 220mm.
Solder mask: We offer various solder mask colors, including green, black, blue, yellow, red, and more, enabling customization and visual distinction.
Our surface finish options include bare copper, HASL, ENIG, immersion silver, immersion tin, OSP, pure gold, ENEPIG, and more, ensuring compatibility with your specific requirements.
| PCB Material: | Polyphenylene, ceramic | ||
| Designation (TP Series) | Designation | DK | DF |
| TP300 | 3.0±0.06 | 0.0010 | |
| TP440 | 4.4±0.09 | 0.0010 | |
| TP600 | 6.0±0.12 | 0.0010 | |
| TP615 | 6.15±0.12 | 0.0010 | |
| TP920 | 9.2±0.18 | 0.0010 | |
| TP960 | 9.6±0.2 | 0.0011 | |
| TP1020 | 10.2±0.2 | 0.0011 | |
| TP1100 | 11.0±0.22 | 0.0011 | |
| TP1600 | 16.0±0.32 | 0.0015 | |
| TP2000 | 20.0±0.4 | 0.0020 | |
| TP2200 | 22.0±0.44 | 0.0022 | |
| TP2500 | 25.0±0.5 | 0.0025 | |
| Layer count: | Single Sided, Double Sided PCB | ||
| Copper weight: | 1oz (35µm), 2oz (70µm) | ||
| Dielectric thickness (or overall thickness) | 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 7.0mm, 8.0mm, 10.0mm, 12.0mm | ||
| PCB size: | ≤150mm X 220mm | ||
| Solder mask: | Green, Black, Blue, Yellow, Red etc. | ||
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. | ||
Applications
Displayed on the screen is a TP high-frequency PCB with a thickness of 1.5mm, featuring OSP coating. TP high-frequency PCBs are also utilized in applications such as Beidou, missile-borne systems, fuzes, and miniaturized antennas etc.