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Double Layer Flexible Circuit Board (FPC) Built on Polyimide With Black Coverlay for Medium Access Control

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Double Layer Flexible Circuit Board (FPC) Built on Polyimide With Black Coverlay for Medium Access Control

Double Layer Flexible Circuit Board (FPC) Built on Polyimide With Black Coverlay for Medium Access Control
Double Layer Flexible Circuit Board (FPC) Built on Polyimide With Black Coverlay for Medium Access Control Double Layer Flexible Circuit Board (FPC) Built on Polyimide With Black Coverlay for Medium Access Control Double Layer Flexible Circuit Board (FPC) Built on Polyimide With Black Coverlay for Medium Access Control Double Layer Flexible Circuit Board (FPC) Built on Polyimide With Black Coverlay for Medium Access Control Double Layer Flexible Circuit Board (FPC) Built on Polyimide With Black Coverlay for Medium Access Control Double Layer Flexible Circuit Board (FPC) Built on Polyimide With Black Coverlay for Medium Access Control Double Layer Flexible Circuit Board (FPC) Built on Polyimide With Black Coverlay for Medium Access Control Double Layer Flexible Circuit Board (FPC) Built on Polyimide With Black Coverlay for Medium Access Control

Large Image :  Double Layer Flexible Circuit Board (FPC) Built on Polyimide With Black Coverlay for Medium Access Control

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-307.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: Polyimide Layer Count: 2 Layers
PCB Thickness: 0.25 Mm (inclusive Of Stiffener) PCB Size: 156mm X 41mm = 1 Type = 1 Piece
Solder Mask: Black Coverlay Silkscreen: White
Copper Weight: Outer Layer 35 μm/ Inner Layer 0 μm Surface Finish: Immersion Gold

 

Double Layer Flexible Circuit Board (FPC) Built on Polyimide With Black Coverlay for Medium Access Control

(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)

 

General description

This is a type of double sided flexible printed circuit (FPC) built on polyimide for the application of Medium Access Control.

 

Basic specifications

Base material: Polyimide 25μm

Layer count: 2 layers

Type: Individual FPC

Format: 156mm x 41mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm/ Inner layer 0 μm

Solder mask / Legend: Black coverlay / white

Final PCB height: 0.25 mm (inclusive of stiffener)

Standard: IPC 6012 Class 2

Packing: 100 pieces are packed for shipment.

Lead time: 10 working days

Shelf life: 6 months

 

Double Layer Flexible Circuit Board (FPC) Built on Polyimide With Black Coverlay for Medium Access Control 0

 

Features and benefits

Reducing the volume;

Weight reduction;

Consistency of assembly;

Experienced sales persons and skilled customer services;

No minimum order quantity and low cost sample;

Focus on low to medium volume production;

On-time service;

More than 18 years of PCB experience;

 

Applications

Industrial control audio equipment, Tablet PC camera soft board, Automobile sensor flex board, LED display soft board, Tablet PC module soft board, mobile phone module flex board

 

General Properties of Coverlay

Test Item Treatment Condition Unit Property Date
IPC Standard * value Typical Value
SF305C 0205 SF305C 0309
Resin Flow A mm - <0.15 <0.15
Peeling Strength (90º) ¹ A N/mm ≥0.7 0.82 1.06
288℃, 5s ≥0.53 0.80 1.11
Thermal Stress ¹ 288℃, 20s - - No delamination No delamination
Dimensional Stability MD After peeling off the paper % ±0.2 ±0.1 ±0.1
TD ±0.1 ±0.1
Chemical Resistance After Chemical Exposure % ≥80 >90 >90
Volume Resistvitiy C-96/35/90 MΩ-cm ≥10^6 7.8 x 10^6 2.2 x 10^7
Surface Resistance C-96/35/90 ≥10^4 2.5 x 10^5 4.2 x 10^5

 

Clarifications of FPC

According to the combination of base material and copper foil, flexible circuit board can be divided into two types: flexible board with adhesive and flexible board without adhesive. The price of non-adhesive flexible PCB is much higher than that of adhesive flexible PCB, but its flexibility, bonding force between copper foil and substrate and flatness of solder are also better than that of adhesive flexible PCB. So it is only used in the high demand situations, such as the: COF (CHIP ON FLEX, flexible board with bare chip, the high flatness of the pad) and so on. Because its price is high, most of the flexible PCBs used in the market are still adhesive flexible circuit board. Because the flexible circuit board is mainly used in the situation where bending is required, if the design or process is not reasonable, it is easy to produce micro-cracks, welding and other defects.

 

Economy of using FPC

If the circuit design is relatively simple, the total volume is small, and the space is suitable, the traditional internal connection is much cheaper. Flexible circuits are a good design option if the circuit is complex, processes many signals or has special electrical or mechanical requirements. When the size and performance of applications exceed the capacity of rigid circuits, flexible assembly is the most economical. A 12mil pad with a 5mil through hole and a flexible circuit with 3mil lines and spacing can be fabricated on a thin film. Therefore, it is more reliable to mount the chip directly on the film. There is no flame retardant that could be an ion source. These films may be protective and solidified at higher temperatures to obtain higher glass transition temperatures. Flexible materials are less costly than rigid materials because they are free of connectors.

 
Double Layer Flexible Circuit Board (FPC) Built on Polyimide With Black Coverlay for Medium Access Control 1
 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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