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Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation

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China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation

Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation
Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation

Large Image :  Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-309.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: Polyimide 25μm + Polyimide Stiffener +3M Sticker Layer Count: 2 Layers
PCB Thickness: 0.2mm PCB Size: 93mm X 44mm = 1 Type = 1 Piece
Solder Mask: Yellow Coverlay Silkscreen: NO
Copper Weight: Outer Layer 35 μm/ Inner Layer 0 μm Surface Finish: Immersion Gold

 

Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation

(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)

 

General description

This is a type of 2 Layer flexible printed circuit (FPC) built on polyimide for the application of PLC Automation.

 

Basic specifications

Base material: Polyimide 25μm + polyimide stiffener +3M sticker

Layer count: 2 layers

Type: Individual FPC

Format: 93mm x 44mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm/ Inner layer 0 μm

Solder mask / Legend: Yellow coverlay / No.

Final PCB height: 0.20 mm

Standard: IPC 6012 Class 2

Packing: 100 pieces are packed for shipment.

Lead time: 10 working days

Shelf life: 6 months

 

Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation 0

 

Features and benefits

Reliability increased;

Controllability of electrical parameter design;

Good oxidation resistance and good heat dissipation;

Powerful PCB capabilities support your research and development, sales and marketing;

Delivery on time higher than 98% on-time-delivery rate;

Quick CADCAM checking and free PCB quotation;

8000 types of PCB's per month;

 

Applications

industrial control touch remote control soft board, Tablet PC module soft board, mobile phone module flex board, Consumer electrostatic Bracelet soft board, capacitive touch screen / panel, medical equipment controller

 

Flexible Printed Circuit (FPC) Capability 2021

No. Specifications Capabilities
1 Board Type Single layer, Doulbe layer, Multilayer, Rigid-Flex
2 Base Material PI, PET
3 Copper Weight 0.5oz, 1oz, 2oz
4 LED Maximum Size 250 x 5000mm
5 General Maximum Size 250 x 2000mm
6 Board Thickness 0.03mm-3.0mm
7 Thickness Tolerance ±0.03mm
8 Mininum Drill Hole 0.05mm
9 Maximum Drill Hole 6.5mm
10 Tolerance of Drill Hole ±0.025mm
11 Thickness of Hole Wall 8 um
12 Minimum Track/Gap of Single Layer Board 0.025/0.03mm
13 Minimum Track/Gap of Double Layer and Multilayer Board 0.03/0.040mm
14 Etching Tolerance ±0.02mm
15 Minimum Width of Silk Legend 0.125mm
16 Minimum Heigh of Silk Legend 0.75mm
17 Distance from Legend to Pad 0.15mm
18 Distance from Opening Solder Mask of Drill Coverlay to Track 0.03mm
19 Distance from Opening Solder Mask of Punching Coverlay to Track 0.03mm
20 Thickness of Immersion Nickel 100-300u"
21 Thickness of Immersion Gold 1-3u"
22 Thicnkess of Immersion Tin 150-400u"
23 Minimum Electrical Testing Pad 0.2mm
24 Minimum Tolerance of Outline(Normal Steel Mould Punch) ±0.1mm
25 Minimum Tolerance of Outline (Precision Steel Mould Punch) ±0.05mm
26 Mininum Radius of Bevel Angle (Outline) 0.2mm
27 Stiffner Material PI, FR-4, 3M Adhesive, PET, Steel Sheet
28 RoHs Yes
29 Solder Mask Colour Yellow, White, Black, Green

 

Components of a flexible circuit

A flexible circuit consists of copper foil, dielectric substrate+ coverlay and adhesive.

Copper foil is available in two different types of copper: ED Copper and RA copper.

 

ED copper is an electro-deposited (ED) copper foil produced in the same way as the copper foil used for rigid printed circuit boards. This also means that the copper is “treated”, i.e., it has a slightly rough surface on one side, which ensures a better adhesion when the copper foil is bonded to the base material.

 

RA copper is a rolled and annealed copper foil produced from electrolytically deposited cathode copper, which is melted and cast into ingots. The ingots are first hot-rolled to a certain size and milled on all surfaces. The copper is then cold-rolled and annealed, until the desired thickness is obtained.

Copper foil is available in thickness of 12, 18, 35 and 70 μm.

 

The most common available for dielectric substrate and coverlay is polyimide films. This material can also be used as coverlay. Polyimide is best suited for flexible circuits because of its characteristics as stated below:

High temperature resistance allows soldering operations without damaging the flexible circuits

Very good electrical properties

Good chemical resistance

Polyimide is available in thicknesses of 12.5, 20, 25 and 50 μm.

 

Base laminates for rigid printed circuit boards are copper foils laminated together with the base materials, the adhesive coming from the prepreg material during lamination. Contrary to this is the flexible circuit where the lamination of the copper foil to the film material is achieved by means of an adhesive system. It is necessary to distinguish between two main systems of adhesive, namely thermoplastic and thermoset adhesives. The choice is dictated partly by the processing, and partly by the application of the finished flexible circuit.

 
Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation 1
 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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