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|Base Material:||Polyimide||Layer Count:||2 Layers|
|PCB Thickness:||0.2mm||PCB Size:||73mm X 58mm = 1 Type = 1 Piece|
|Solder Mask:||Yellow Coverlay||Silkscreen:||White|
|Copper Weight:||Outer Layer 35 μm/ Inner Layer 0 μm||Surface Finish:||Immersion Gold|
2 Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide for the application of PLC Control
(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)
This is a type of 2 Layer flexible printed circuit (FPC) built on polyimide for the application of PLC Control.
Base material: Polyimide 25μm
Layer count: 2 layers
Type: Individual FPC
Format: 73mm x 58mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 μm/ Inner layer 0 μm
Solder mask / Legend: Yellow coverlay / white
Final PCB height: 0.20 mm
Standard: IPC 6012 Class 2
Packing: 100 pieces are packed for shipment.
Lead time: 10 working days
Shelf life: 6 months
Features and benefits
Continuity of processing;
Hassle-free, one-to-one after-sales service;
Free-of-charge PCB panelization;
Prototype PCB capability;
Volume Production capability;
FFC for industrial control equipment, Tablet computer battery soft board, automobile GPS navigation flex board, consumer card reader soft board, Thin-film switch, medical keypad soft board
Specifications of standard coverlay
|Specifications||Polyimide Film Thickness (µm)||Adhesive Thickness (µm)||Applications|
|SF305C 0205||5||5||Ultrathin FPC|
|SF305C 0515||12.5||15||General type|
|SF305C 1035||25||35||Power batter|
Structure of FPC
According to the number of layers of conductive copper foil, FPC can be divided into single layer circuit, double layer circuit, multi-layer circuit, double sided and so on.
Single-layer structure: the flexible circuit of this structure is the simplest structure of the flexible PCB. Usually the base material (dielectric substrates) + transparent rubber(adhesive) + copper foil is a set of purchased raw materials(semi-manufactures), the protective film and transparent glue are another kind of bought raw material. First, copper foil must be etched to obtain the required circuit, and the protective film should be drilled to reveal the corresponding pad. After cleaning, the two are combined by rolling. Then the exposed part of the pad electroplated gold or tin to protect. In this way, the big panel board will be ready. Generally also it’s stamped into the corresponding shape of the small circuit board. There is also no protective film directly on the copper foil, but printed resistance soldering coating, so that the cost will be lower, but the mechanical strength of the circuit board will become worse. Unless the strength requirement is not high and the price needs to be as low as possible, it is best to apply the protective film method.
Double layer structure: when the circuit is too complex to be wired, or copper foil is needed to shield the ground, it is necessary to choose a double layer or even a multilayer. The most typical difference between a multilayer and a single plate is the addition of a perforated structure to connect the layers of copper foil. The first process of transparent rubber + base material + copper foil is to make holes. Drill holes in the base material and copper foil first, clean and then plated with a certain thickness of copper. The subsequent fabrication process is almost the same as the single-layer circuit.
Double sided structure: both sides of the double sided FPC have pads, mainly used to connect other circuit boards. Although it and monolayer structure is similar, but the manufacturing process is very different. Its raw material is copper foil, protective film and transparent glue. The protective film should be drilled according to the position of the pad first, then the copper foil should be affixed, the pad and track lines should be etched and then the protective film of another drilled hole should be affixed.