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Product Details:
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| Base Material: | 1.0mm FR-4 / Polyimide 25µm | Layer Count: | 4 Layers |
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| PCB Thickness: | 1.0mm | PCB Size: | 20.61 X 50.17mm |
| Coverlay: | Yellow Coverlay / Green Solder Mask | Silkscreen: | White |
| Copper Weight: | 1oz | Surface Finish: | Immersion Gold |
4 Layer Rigid-Flex PCB Built on FR-4 and Poyimide With Immersion Gold and Green Solder Mask for Industrial Surveying
(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)
General description
This is a type of Rigid flex PCB for the application of Micro USB. It’s a 4 layer rigid-flex board at 1.0mm thick. The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data.
Parameter and data sheet
| Size of Flexible PCB | 20.61 X 50.17mm |
| Number of Layers | 4 |
| Board Type | Rigid flex PCB |
| Board Thickness | 1.0mm |
| Board Material | 1.0mm FR-4 / Polyimide 25µm |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 60℃ |
| PTH Cu thickness | ≥20 µm |
| Inner Iayer Cu thicknes | 35 µm |
| Surface Cu thickness | 35 µm |
| Coverlay Colour | Yellow coverlay / Green solder mask |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 µm |
| Stiffener Material | no |
| Stiffener Thickness | N/A |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
| Peeling test of Coverlay | No peelable |
| Legend Adhesion | 3M 90℃ No peeling after Min. 3 times test |
| Surface Finish | Immersion Gold |
| Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required | Yes |
| Famability | 94-V0 |
| Thermal Shock Test | Pass, -25℃±125℃, 1000 cycles. |
| Thermal Stress | Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
Features and benefits
Excellent flexibility
Reducing the volume
Consistency of assembly
Increased reliability
Continuity of processing
Applications
Contact belt of inkjet printer, industrial surveying and mapping instrument, Tablet PC camera soft board
Clarifications of FPC
According to the combination of base material and copper foil, flexible circuit board can be divided into two types: flexible board with adhesive and flexible board without adhesive. The price of non-adhesive flexible PCB is much higher than that of adhesive flexible PCB, but its flexibility, bonding force between copper foil and substrate and flatness of solder are also better than that of adhesive flexible PCB. So it is only used in the high demand situations, such as the: COF (CHIP ON FLEX, flexible board with bare chip, the high flatness of the pad) and so on. Because its price is high, most of the flexible PCBs used in the market are still adhesive flexible circuit board. Because the flexible circuit board is mainly used in the situation where bending is required, if the design or process is not reasonable, it is easy to produce micro-cracks, welding and other defects.
Economy of using FPC
If the circuit design is relatively simple, the total volume is small, and the space is suitable, the traditional internal connection is much cheaper. Flexible circuits are a good design option if the circuit is complex, processes many signals or has special electrical or mechanical requirements. When the size and performance of applications exceed the capacity of rigid circuits, flexible assembly is the most economical. A 12mil pad with a 5mil through hole and a flexible circuit with 3mil lines and spacing can be fabricated on a thin film. Therefore, it is more reliable to mount the chip directly on the film. There is no flame retardant that could be an ion source. These films may be protective and solidified at higher temperatures to obtain higher glass transition temperatures. Flexible materials are less costly than rigid materials because they are free of connectors.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
