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| Base Material: | Lightweight Woven Fiberglass | Layer Count: | 1 Layer, 2 Layer, 4 Layer. |
|---|---|---|---|
| PCB Thickness: | 0.2mm, 0.3mm, 0.6mm, 0.8mm, 1.6mm | PCB Size: | ≤400mm X 500mm |
| Copper Weight: | 0.5oz, 1oz, 2oz | Surface Finish: | Bare Copper, HASL, ENIG, Immersion Tin Etc. |
| High Light: | Taconic High Frequency PCB,Lightweight Woven Fiberglass Taconic PCB,TLY-3FF Coating High Frequency PCB |
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Taconic TLY High Frequency PCB with TLY-5, TLY-5-L, TLY-3, TLY-3FF Coating with HASL, Immersion Gold, OSP and Tin
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Hello Everyone,
Today, we're talking about high frequency PCB built on TLY material.
TLY laminates are manufactured with very lightweight woven fiberglass, which are from Taconic Company. They are more dimensionally stable than chopped fiber reinforced PTFE composites. Since they are more mechanically stable, it is suitable for high volume manufacturing.
The low dissipation factor enables successful deployment for automotive radar applications designed at 77 GHz as well as other antennas in millimeter wave frequencies.
We benefit from its following advantages:
1. Dimensionally stable:
High volume fabrication becomes possible.
2. Lowest DF
In the low dielectric constant range, the dissipation factor is approximately 0.0009 at 10 GHz.
3. Low moisture absorption
It can work in severe environment.
4. High copper peel strength
It’s high up to 2.32, dimensionally stable.
5. Uniform and consistent DK
For most thicknesses, the dielectric constant can be specified anywhere within this range with a tolerance of +/-0.02
Typical applications include:
Cellular communications
Power amplifiers, Filters, couplers
Aerospace, avionics
Phased array antennas
There’re 6 members in TLY family. We have stock for TLY-5. Others are purchased according to clients’ requirement.
| PCB Capability | |
| PCB Material: | Lightweight Woven Fiberglass |
| TLY Family (Dielectric constant ±0.02) | TLY-5A (DK=2.17) |
| TLY-5A-L (DK=2.17) | |
| TLY-5 (DK=2.20) | |
| TLY-5-L (DK=2.20) | |
| TLY-3 (DK=2.33) | |
| TLY-3FF (DK=2.33) | |
| Layer count: | 1 Layer, 2 Layer, 4 Layer. |
| Copper weight: | 0.5oz, 1oz, 2oz |
| PCB thickness: | 0.2mm, 0.3mm, 0.6mm, |
| 0.8mm, 1.6mm | |
| PCB Size: | ≤400mm X 500mm |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin etc. |
Bicheng specializes in providing you with prototype, small batches and mass production service.
If you have any questions, please feel free to contact us.
Thank you for your reading.
Appendix: Typical Values of TLY
| TLY TYPICAL VALUES | |||||
| Property | Test Method | Unit | Value | Unit | Value |
| DK at 10 GHz | IPC-650 2.5.5.5 | 2.2 | 2.2 | ||
| Df at 10 GHz | IPC-650 2.5.5.5 | 0.0009 | 0.0009 | ||
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
| Dielectric Strength | ASTM D 149 | V/mil | 2,693 | V/mil | 106,023 |
| Volume Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms/cm | 1010 | Mohms/cm | 1010 |
| Volume Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms/cm | 1010 | Mohms/cm | 109 |
| Surface Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms | 108 | Mohms | 108 |
| Surface Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms | 108 | Mohms | 108 |
| Flex Strength(MD) | IPC-650 2.4.4 | psi | 14,057 | N/mm2 | 96.91 |
| Flex Strength(CD) | IPC-650 2.4.4 | psi | 12,955 | N/mm2 | 89.32 |
| Peel Stength(½ oz.ed copper) | IPC-650 2.4.8 | Ibs./inch | 11 | N/mm | 1.96 |
| Peel Stength(1 oz.CL1 copper) | IPC-650 2.4.8 | Ibs./inch | 16 | N/mm | 2.86 |
| Peel Stength(1 oz..CV1 copper) | IPC-650 2.4.8 | Ibs./inch | 17 | N/mm | 3.04 |
| Peel Stength | IPC-650 2.4.8(after elevated temp.) | Ibs./inch | 13 | N/mm | 2.32 |
| Young's Modulus(MD) | ASTM D 3039/IPC-650 2.4.19 | psi | 1.4 x 106 | N/mm2 | 9.65 x 103 |
| Poisson's Ratio(MD) | ASTM D 3039/IPC-650 2.4.19 | 0.21 | 0.21 | ||
| Thermal Conductivity | ASTM F 433 | W/M*K | 0.22 | W/M*K | 0.22 |
| Dimensional Stability(MD,10mil) | IPC-650 2.4.39(avg.after bake&thermal stress) | mils/inch | -0.038 | -0.038 | |
| Dimensional Stability(CD,10mil) | IPC-650 2.4.39(avg.after bake&thermal stress) | mils/inch | -0.031 | -0.031 | |
| Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.19 | g/cm3 | 2.19 |
| CTE(X axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 26 | ppm/℃ | 26 |
| CTE(Y axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 15 | ppm/℃ | 15 |
| CTE(Z axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 217 | ppm/℃ | 217 |
| NASA Outgassing(% TML) | 0.01 | 0.01 | |||
| NASA Outgassing(% CVCM) | 0.01 | 0.01 | |||
| NASA Outgassing(% WVR) | 0.00 | 0.00 | |||
| UL-94 Flammability Rating | UL-94 | V-0 | V-0 | ||
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
